This book focuses on the development of circuit and system design techniques for millimeter wave wireless communication systems above 90GHz and fabricated in nanometer scale CMOS technologies. The authors demonstrate a hands-on methodology that was applied to design six different chips, in order to overcome a variety of design challenges. Behavior of both actives and passives, and how to design them to achieve high performance is discussed in detail. This book serves as a valuable reference for millimeter wave designers, working at both the transistor level and system level.
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1 | (12) |
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1.1 A Brief History of Electronic Communication |
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1 | (4) |
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1.2 Millimeter-Wave Frequencies: Toward High Bandwidth Wireless Channels |
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5 | (1) |
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1.3 Millimeter-Wave Communication Applications |
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6 | (1) |
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1.4 Other Millimeter-Wave Applications |
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7 | (1) |
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1.5 CMOS and Millimeter Wave: Advantages and Problems |
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8 | (1) |
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9 | (1) |
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10 | (3) |
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2 CMOS at Millimeter Wave Frequencies |
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13 | (20) |
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2.1 Properties of MOS Transistors at Millimeter Wave Frequencies |
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13 | (6) |
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2.1.1 High Frequency Gain |
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13 | (3) |
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2.1.2 Stability Considerations |
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16 | (3) |
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2.2 Capacitive Neutralization |
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19 | (11) |
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2.2.1 Differential Mode Stability |
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20 | (5) |
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2.2.2 Common Mode Stability |
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25 | (4) |
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2.2.3 Neutralization Capacitors |
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29 | (1) |
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30 | (1) |
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31 | (2) |
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3 Passive Devices: Simulation and Design |
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33 | (46) |
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3.1 2.5D Simulation of Planar Passive Devices |
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34 | (1) |
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35 | (9) |
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36 | (1) |
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3.2.2 Differential Microstrip |
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37 | (1) |
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3.2.3 Differential Slow-Wave Transmission Line |
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37 | (1) |
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3.2.4 High Characteristic Impedance Transmission Line |
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38 | (1) |
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3.2.5 Topology Comparison |
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38 | (6) |
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44 | (2) |
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46 | (11) |
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3.4.1 Transformer Topologies |
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47 | (4) |
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51 | (6) |
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57 | (18) |
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3.5.1 The Need for mm-Wave On-chip Antennas |
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57 | (2) |
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3.5.2 3D Simulation of Radiating Structures |
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59 | (1) |
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3.5.3 Substrate and Chip Carrier |
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60 | (1) |
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3.5.4 Fully Integrated Dipoles |
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61 | (6) |
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3.5.5 Pseudo Integrated Dipoles: Bondwire Antennas |
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67 | (7) |
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74 | (1) |
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75 | (2) |
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77 | (2) |
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4 Integrated Differential Amplifiers |
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79 | (28) |
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4.1 Optimization for Gain: Small-Signal Amplifiers |
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79 | (5) |
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4.1.1 Power Gain Matching |
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80 | (2) |
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4.1.2 100-GHz Transformer-Coupled Amplifier |
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82 | (2) |
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4.2 Optimization for Noise: LNA |
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84 | (7) |
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85 | (1) |
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86 | (4) |
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4.2.3 Chip Implementation |
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90 | (1) |
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4.3 Optimization for Output Power: PA |
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91 | (12) |
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92 | (2) |
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94 | (4) |
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4.3.3 Chip Implementations |
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98 | (5) |
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103 | (2) |
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105 | (2) |
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5 Millimeter-Wave Transmitters in CMOS |
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107 | (34) |
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5.1 System Design Considerations |
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107 | (2) |
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5.1.1 Conventional Topologies |
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107 | (1) |
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5.1.2 Millimeter (mm)-Wave Topologies |
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108 | (1) |
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5.2 A 120-GHz Amplitude Shift Keying Transmitter |
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109 | (14) |
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109 | (1) |
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110 | (2) |
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112 | (1) |
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5.2.4 Power Amplifier (PA) |
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113 | (2) |
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115 | (8) |
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5.3 A 120-GHz Quadrature Phase Shift Keying Transmitter |
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123 | (13) |
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124 | (1) |
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5.3.2 Quadrature Phase Generation |
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125 | (1) |
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5.3.3 4-Channel Current Combining Multiplexer |
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125 | (2) |
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5.3.4 Power Amplifier (PA) |
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127 | (4) |
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131 | (5) |
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136 | (2) |
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138 | (3) |
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6 A 120-GHz Wireless Link |
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141 | (36) |
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141 | (1) |
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6.2 120-GHz Link Budget Analysis |
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142 | (1) |
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143 | (1) |
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143 | (18) |
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144 | (1) |
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144 | (1) |
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6.4.3 Demodulator: Costas Loop |
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145 | (12) |
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6.4.4 Amplitude Detector and High-Speed Comparator |
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157 | (2) |
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6.4.5 High-Speed Digital Output |
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159 | (1) |
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160 | (1) |
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161 | (13) |
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6.5.1 Quadrature Voltage Controlled Oscillator |
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161 | (1) |
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162 | (1) |
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162 | (3) |
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6.5.4 Simulated Performance |
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165 | (1) |
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166 | (1) |
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166 | (8) |
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174 | (1) |
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174 | (3) |
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177 | (2) |
| Index |
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179 | |
Noël Deferm (S'09) was born in Diest, Belgium, in 1985. In 2008 he received the degree of M.S. in Electrical Engineering (ir.) from the Katholieke Universiteit Leuven (K.U.Leuven), Belgium. The subject of his MS thesis was on the design of ultra low-power architectures for wireless sensor networks. He is currently working as a postdoc researcher at the MICAS laboratories of the department of Electrical Engineering (ESAT) of the Katholieke Universiteit Leuven (K.U.Leuven) from which he received the Ph.D. in Engineering Science (dr.) in 2014. While working towards his Ph.D. degree, his main research focus was on mm-wave CMOS circuit design for wireless communication systems. In 2011, he received the TSMC-Europractice innovation award.
Patrick Reynaert was born in Wilrijk, Belgium, in 1976. He received the Master of Industrial Sciences in Electronics (ing.) from the Karel de Grote Hogeschool, Antwerpen, Belgium in 1998 and both the Master of Electrical Engineering (ir.) and the Ph.D. in Engineering Science (dr.) from the KU Leuven), Belgium in 2001 and 2006 respectively.
From 2001 to 2006, he was a Teaching and Research Assistant within the MICAS research group of the Department of Electrical Engineering (ESAT), K.U.Leuven, Belgium. While working towards his Ph.D. degree, his main research focus was on CMOS RF power amplifiers and analog circuit design for mobile and wireless communications. From 2001 to 2006, he was also a Lector at ACE-Group T Leuven, Belgium were he teached several undergraduate courses on electronic circuit design.
During 2006-2007, he was a post-doctoral researcher at the Department of Electrical Engineering and Computer Sciences of the University of California at Berkeley. At the Berkeley Wireless Research Center, he was working on mm-wave CMOS integrated circuits within the group of Prof. Ali Niknejad. For this research, he received a Francqui Foundation fellowship from the Belgian AmericanEducational Foundation.
During the summer of 2007, he was a visiting researcher at Infineon, Villach, Austria where he worked on the linearization of basestation power amplifiers.
Since October 2007, he is a Professor at the Katholieke Universiteit Leuven, department of Electrical Engineering (ESAT) and a staff member of the ESAT-MICAS research group. His main research interests include mm-wave CMOS circuit design and RF power amplifiers.
Patrick Reynaert is a Senior Member of the IEEE, member of the ESSCIRC TPC, member of the IEDM TPC, chair of the IEEE SSCS Benelux Chapter, co-chair of the Analog, Mixed-signal and RF working group of the Global Semiconductor Alliance and member of the Commission on Innovation Policy of the Flemish Council for Science and Innovation (VRWI).
In 2011, he received the TSMC-Europractice innovation award. In 2011-2012, he served as the Guest Editor for the IEEE Journal of Solid-state Circuits Special Issue on ESSCIRC 2011.
Lisainfo e-raamatute kohta