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E-raamat: Advances in Abrasive Technology: Proceedings of the International Symposium, Sydney, Australia, 8-10 July 1997 [World Scientific e-raamat]

Edited by (Univ Of Sydney, Australia), Edited by (Tokai Univ, Japan)
  • Formaat: 236 pages
  • Ilmumisaeg: 12-Aug-1997
  • Kirjastus: World Scientific Publishing Co Pte Ltd
  • ISBN-13: 9789814317405
Teised raamatud teemal:
  • World Scientific e-raamat
  • Hind: 98,87 €*
  • * hind, mis tagab piiramatu üheaegsete kasutajate arvuga ligipääsu piiramatuks ajaks
  • Formaat: 236 pages
  • Ilmumisaeg: 12-Aug-1997
  • Kirjastus: World Scientific Publishing Co Pte Ltd
  • ISBN-13: 9789814317405
Teised raamatud teemal:
This volume aims to promote the latest advances in abrasive technology. Emphasis is placed on both the development of practical methods and the understanding of the mechanisms of machining ceramics, semiconductors, steel alloys, and other advanced materials. About 50 technical papers are included in the volume, describing the recent advances in the mechanics of abrasive machining, mechanisms of grinding, difficult-to-machine materials, grinding wheel technology, machinery and measurement, polishing, lapping, and nano-machining. Theoretically, the book discusses the material removal and deformation mechanisms; from the practical point of view, it provides useful data for direct industrial applications.
Preface vii Honour Lectures 1(27) Modelling the Related Processes of Abrasion, Wear and Polishing 1(17) P L B Oxley (Invited Opening Lecture) Recent Advances in Ultraprecision Surface Finishing Technologies in Japan 18(10) N Yasunaga (Invited Closing Lecture) Mechanisms of Material Removal and Related Problems 28(20) Possible Mechanism of Brittle-Ductile Transition in Material Removal in Micromachining of Brittle Materials 28(5) S Shimada T Inamura N Ikawa (Invited) Subsurface Structure Change of Silicon after Ultra-Precision Grinding 33(5) I Zarudi L C Zhang Si-O-Si Bonding Configurations of Damaged Layer Formed after Diamond Grinding and Chemomechanical Polishing of Si Wafers 38(5) Y Chang Y-T Hung J-H Tsai C-L Chao S-C Chang T-S Lin Y-P Chiu C-C Wang Phase Transformation of Silicon during Nano-Indentation 43(5) H Tanaka L C Zhang Polishing and Lapping 48(38) Electrophoresis-Polishing with a Partial Electrode Tool 48(5) K Suzuki A Ide T Uematsu T Kurobe N Yasunaga (Invited) Precision Optical Polishing Using Pitch and Teflon Laps at CSIRO TIP: A Review 53(4) A J Leistner (Invited) Mechanisms of Silicon Polishing: Chemical, Mechanical and Electrical Effects 57(4) Y Samitsu Mirror Finishing of 6Al-4V Titanium Alloy Utilizing New Lapping Tape Application of Polishing Fluid 61(5) K Kitajima H Tomoda H Ohtsubo T Tottori CMP Characteristics and Polishing Machine in ILD Planarization 66(5) J Watanabe T Inamura T Beppu Y Minamikawa Magnetic Field-Assisted Grinding-Like Polishing of Brittle Materials Effect of Magnetic Field and Magnetic Slurry on Polishing Characteristics 71(5) Y Yamada T Kurobe K Sakaya Material Removal Evaluation in the Optical Polishing of Hydrophilic Polymer Materials 76(5) J Sun L C Zhang Y-W Mai S Payor M Hogg Computer Controlled Lapping of Granite Plate 81(5) J Wang B Zhang B Xue Grinding 86(62) High Efficiency Grinding of Difficult-to-Machine Materials 86(5) T Suto T Waida K Okano (Invited) Practical Modelling of the Surface Integrity of Ground Components 91(5) L C Zhang (Invited) Development of Sequential Grinding-Polishing Process Applicable to Large-Size Si Wafer Finishing 96(5) N Yasunaga M Takashina T Itoh Control of Grain Depth of Cut in Ductile Mode Grinding of Brittle Materials and Practical Application 101(5) A Kanai M Miyashita F Inaba M Sato T Yokotsuka R Kato Elastic Recovery of Ground Traces Made by Single Grain Grinding 106(5) M Yoshioka A Study on Grinding Quantities Using Chip Volume 111(5) P-L Tso S-H Wu Precision Grinding of Aspheric Surface Accuracy Improving by On-Machine Measurement 116(5) H Suzuki N Wajima M S S Zahmaty T Kuriyagawa K Syoji Simulation of Cylindrical Plunge Grinding Based on the Behaviour of Cutting Edge Wear 121(5) E-S Lee T Suto M-Y Yang Abrasive Technology -- Next Generation Processes Require Next Generation Machine Tool Technology 126(8) S C Salmon A Study on the Relation between Outgassing and Characteristics of Ground Surfaces 134(4) J Shibata Cylindrical Mirror Grinding with Extremely Fine Grit Wheels 138(5) N Wajima Y Mori K Syoji T Kuriyagawa H Suzuki Performance of Grinding Fluids for High-Speed Grinding Using CBN Wheels 143(5) T Imai R Mukai T Yoshimi M Yoshikawa Grinding Wheels 148(35) Grinding Characteristics of Wheels with New cBN Grits ABN800 148(5) K Suzuki Y Seki T Makizaki M Iwai (Invited) On-Machine Electrodischarge Truing Dressing Method for Metal Bonded Wheels 153(5) T Uematsu T Makizaki K Suzuki T Nakagawa (Invited) Quantified Wear Mechanisms of Diamond Wheels in Creep-Feed Grinding of Ceramic Materials 158(5) T W Liao K Li S B McSpadden, Jr L J ORourke On-Machine Monitoring of Dulling Behaviour of Wheel Working Surface 163(5) S Shimizu H Sakamoto Research and Development of SF Dressing Method for Superabrasive Grinding Wheels Influence of Kind of Dressing Wheels and Flow Rate of Dressing Fluid 168(4) S-I Tooe S-I Ninomiya S Yokomizo K Ohta Characterisation of the Contacting Portion of Grinding Wheel Surfaces 172(6) W Scott Fuzzy Modelling of Wear of Grinding Wheels 178(5) Z F Zhang L C Zhang Other Techniques 183(40) Newly Developed Micro-Processing and Measuring System Unifying Friction Force Microscope 183(4) K Ashida S Hirai N Morita Y Yoshida (Invited) Improving Surface Finish Generated by the Abrasive Waterjet Process 187(5) E Siores L Chen W C K Wong R Begg S Brandellero D Boundy (Invited) Effect of Abrasive Grain Size on Surface Finish and Abrasion in Abrasive-Flow Finishing of Aluminium 192(5) K Yamaguchi N Takakura Development of Automatic Measuring System of Cutting Tool Geometry 197(5) H Aoyama T Aoyama K Taguchi S Inoue Effect of Installation of Surface Grinding Machines on Wheel Unbalance Vibrations 202(5) K Yoshida J Ishimatsu S Koganei M Tanaka Robotics Deburring of GFRP Parts by Using Belt Sander -- Improvement in the Flexibility by Fuzzy Control 207(5) Y Nasu S-I Kuroki K Mitobe M J Uddin T Kuroda Design and Manufacturing of Indexable Insert Grinding Machine: An Experimental Evaluation 212 A D Joshi G K Awari T Chandrasekhar Nonaxisymmetric Aspheric Grinding Technique for Ceramic Mirrors T Kuriyagawa M S S Zahmaty H Suzuki K Syoji T Tachibana Author Index 223
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