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Circuit Devices and Process Simulation: Mathematical and Numerical Aspects [Hardback]

, , (University of Texas, San Antonio, USA), ,
  • Format: Hardback, 440 pages, height x width: 251x172 mm, weight: 940 g, Illustrations
  • Pub. Date: 22-Feb-1996
  • Publisher: John Wiley & Sons Ltd
  • ISBN-10: 0471960195
  • ISBN-13: 9780471960195
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  • Price: 111,25 €*
  • * This title is out of print. Used copies may be available, but delivery only inside Baltic States
  • This title is out of print. Used copies may be available, but delivery only inside Baltic States.
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  • Format: Hardback, 440 pages, height x width: 251x172 mm, weight: 940 g, Illustrations
  • Pub. Date: 22-Feb-1996
  • Publisher: John Wiley & Sons Ltd
  • ISBN-10: 0471960195
  • ISBN-13: 9780471960195
Other books in subject:
Presents a unified treatment of the physical processes, mathematical models, and numerical techniques for circuit, device, and process simulation. Offers a model of an integrated circuit based on linear and nonlinear circuit elements, a model of current flow within a transistor using the drift-diffusion and hydrodynamic PDE systems, and models for physical processes such as diffusion, oxidation, and crystal growth, as well as finite difference and finite element methods for spatial discretizations. Contains chapter summaries, exercises, and programming assignments. For a graduate electrical engineering course in simulation, and for researchers in the semiconductor industry. Annotation c. by Book News, Inc., Portland, Or.

This book presents for the first time a unified treatment of the physical processes, mathematical models and numerical techniques for circuit, device and process simulation. At the macroscopic level linear and nonlinear circuit elements are introduced to yield a mathematical model of an integrated circuit. Numerical techniques used to solve this coupled system of ODEs are described. Microscopically, current flow within a transistor is modeled using the drift-diffusion and hydrodynamic PDE systems. Finite difference and finite element methods for spatial discretizations are treated, as are grid generation and refinement, upwinding, and multilevel schemes. At the fabrication level, physical processes such as diffusion, oxidation, and crystal growth are modeled using reaction-diffusion-convection equations. These models require multistep integration techniques and Krylov projection methods for successful implementation. Exercises, programming assignments, and an extensive bibliography are included to reinforce and extend the treatment.
Partial table of contents:
Modeling and Simulation.
The Circuit Equations.
Transistors and Semiconductor Circuits.
Numerical Integration of Circuit ODEs.
Ion Implantation.
Single Species Diffusion.
Multiple Species Diffusion.
Integrating Reaction-Diffusion Systems.
Technology Computer Aided Design.
Bibliography.
Index.