| List of Contributors |
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xvii | |
| Abbreviations |
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xxi | |
| 1 Why Use Ionic Liquids for Electrodeposition? |
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1 | (16) |
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2 | (1) |
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3 | (1) |
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1.3 What Is an Ionic Liquid? |
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4 | (2) |
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1.4 Technological Potential of Ionic Liquids |
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6 | (5) |
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1.4.1 Removal of Toxic Reagents |
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6 | (1) |
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1.4.2 Water-Sensitive Metals |
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7 | (1) |
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1.4.3 Deposition on Water-Sensitive Substrates |
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7 | (1) |
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1.4.4 Semiconductor Electrodeposition |
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7 | (1) |
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1.4.5 Deposition of Nanoarchitectures |
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7 | (1) |
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8 | (2) |
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10 | (1) |
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10 | (1) |
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1.4.9 Cation and Added Electrolytes |
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10 | (1) |
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10 | (1) |
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11 | (1) |
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11 | (1) |
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12 | (5) |
| 2 Synthesis of Ionic Liquids |
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17 | (38) |
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2.1 Nanostructured Metals and Alloys Deposited from Ionic Liquids |
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17 | (9) |
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17 | (1) |
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2.1.2 Synthesis of Room-Temperature Chloroaluminate-Based Ionic Liquids |
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18 | (1) |
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18 | (1) |
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2.1.2.2 The Quaternization Reaction |
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19 | (1) |
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2.1.2.3 Chloroaluminate Synthesis |
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21 | (3) |
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2.1.3 Physical Data of Haloaluminate-Based Ionic Liquids |
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24 | (1) |
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24 | (2) |
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2.2 Air- and Water-Stable Ionic Liquids |
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26 | (12) |
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26 | (2) |
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2.2.2 Tetrafluoroborate and Hexafluorophosphate-Based Ionic Liquids |
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28 | (2) |
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2.2.3 Triflate- and Trifluoroacetate-Based Ionic Liquids |
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30 | (1) |
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2.2.4 Bistriflamide-Based Ionic Liquids |
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30 | (1) |
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2.2.5 Trispentafluoroethyltrifluorophosphate-Based Ionic Liquids |
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31 | (1) |
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2.2.6 Cyano-Based Ionic Liquids |
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32 | (1) |
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2.2.7 Effect of Anion on Ionic Liquid Physicochemical Properties |
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33 | (1) |
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34 | (1) |
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35 | (3) |
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2.3 Eutectic-Based Ionic Liquids |
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38 | (17) |
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40 | (4) |
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44 | (1) |
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45 | (2) |
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47 | (1) |
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2.3.5 Modeling Viscosity and Conductivity |
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48 | (2) |
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50 | (1) |
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50 | (5) |
| 3 Physical Properties of Ionic Liquids for Electrochemical Applications |
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55 | (40) |
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55 | (1) |
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55 | (7) |
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55 | (5) |
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3.2.1.1 Effect of Ion Radius |
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56 | (1) |
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3.2.1.2 Effect of Cation Structure on the Melting Point |
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56 | (2) |
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58 | (2) |
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3.2.2 Glass Transition Temperature |
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60 | (1) |
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3.2.3 Thermal Decomposition Temperature |
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60 | (1) |
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3.2.4 Liquid Crystallinity and Solid-Solid Transitions |
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61 | (1) |
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3.2.5 Thermal Conductivity |
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61 | (1) |
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62 | (1) |
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62 | (2) |
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64 | (1) |
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65 | (2) |
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67 | (6) |
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67 | (1) |
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3.6.2 Reichardt's Betaine Dye |
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67 | (1) |
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3.6.3 Kamlet-Taft Parameters |
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68 | (4) |
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3.6.4 Acetylacetonatotetramethylethyldiamine copper (II) |
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72 | (1) |
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73 | (1) |
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73 | (1) |
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3.7 Solubility of Metal Salts |
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73 | (3) |
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3.8 Electrochemical Properties |
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76 | (10) |
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3.8.1 Electrochemical Window |
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76 | (2) |
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78 | (4) |
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3.8.3 Diffusion Coefficient of Component Ions |
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82 | (2) |
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3.8.4 Ionic Liquids for Specific Ion Conduction |
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84 | (11) |
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3.8.4.1 Ionic Liquids Containing Specific Ions |
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84 | (1) |
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3.8.4.2 Selective Ion Conduction |
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85 | (1) |
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3.9 Conclusion and Future Prospects |
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86 | (1) |
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86 | (1) |
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86 | (9) |
| 4 Electrodeposition of Metals |
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95 | (62) |
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4.1 Electrodeposition in AlCl3-Based Ionic Liquids |
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95 | (9) |
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95 | (1) |
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95 | (4) |
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4.1.2.1 Electrodeposition of Lithium |
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96 | (2) |
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4.1.2.2 Electrodeposition of Sodium |
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98 | (1) |
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99 | (1) |
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100 | (2) |
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4.1.4.1 Electrodeposition of Aluminum and Aluminum Alloys |
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100 | (2) |
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4.1.4.2 Electrodeposition of Indium |
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102 | (1) |
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4.1.4.3 Electrodeposition of Gallium |
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102 | (1) |
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102 | (1) |
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4.1.5.1 Electrodeposition of Tin |
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102 | (1) |
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102 | (1) |
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4.1.6.1 Electrodeposition of Antimony |
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102 | (1) |
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103 | (1) |
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4.1.7.1 Electrodeposition of Tellurium |
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103 | (1) |
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103 | (1) |
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4.2 Electrodeposition of Refractory Metals from Ionic Liquids |
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104 | (15) |
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104 | (2) |
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4.2.2 Electrodeposition of Ti, Ta, and Nb from High-Temperature Molten Salts and RTILs |
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106 | (7) |
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4.2.2.1 Titanium Electrodeposition |
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106 | (2) |
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4.2.2.2 Tantalum Electrodeposition |
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108 | (2) |
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4.2.2.3 Niobium Electrodeposition |
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110 | (3) |
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4.2.3 Electrodeposition of Chromium, Molybdenum, and Zirconium |
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113 | (2) |
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4.2.3.1 Electrodeposition Studies on Refractory Metals from Chloroaluminate Ionic Liquids |
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114 | (1) |
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115 | (1) |
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115 | (4) |
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4.3 Deposition of Metals from Nonchloroaluminate Eutectic Mixtures |
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119 | (13) |
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119 | (3) |
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122 | (3) |
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4.3.2.1 Chlorozincate Ionic Liquids |
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122 | (2) |
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4.3.2.2 Other Type 1 Eutectics |
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124 | (1) |
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125 | (1) |
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126 | (2) |
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128 | (1) |
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4.3.6 Lewis Acidity Effects on Deposit Morphology |
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129 | (1) |
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4.3.7 Future Developments |
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129 | (2) |
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131 | (1) |
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132 | (5) |
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4.4.1 Deposition of Reactive Elements |
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132 | (2) |
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4.4.2 Viscosity/Conductivity |
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134 | (1) |
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134 | (1) |
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135 | (1) |
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4.4.5 Cation/Anion Effects |
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135 | (1) |
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136 | (1) |
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136 | (1) |
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137 | (1) |
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4.5 Complexation and Redox Behavior of Metal Ions in Ionic Liquids |
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137 | (20) |
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137 | (2) |
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4.5.2 Methods of Determining Metal Speciation in Ionic Media |
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139 | (9) |
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4.5.2.1 Controlling Speciation in Ionic Liquids |
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140 | (2) |
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4.5.2.2 Measuring Redox Potentials in Ionic Liquids |
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142 | (2) |
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4.5.2.3 Speciation and Redox Behavior |
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144 | (4) |
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4.5.3 Issues with Overpotentials and Passivation Effects |
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148 | (2) |
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4.5.4 Outlook and Future Challenges |
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150 | (1) |
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151 | (6) |
| 5 Electrodeposition of Alloys |
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157 | (30) |
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157 | (3) |
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5.2 Electrodeposition of Al-Containing Alloys from Chloroaluminate Ionic Liquids |
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160 | (7) |
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160 | (1) |
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161 | (1) |
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162 | (1) |
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163 | (1) |
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164 | (1) |
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164 | (1) |
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164 | (1) |
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165 | (1) |
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165 | (1) |
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165 | (1) |
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166 | (1) |
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166 | (1) |
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167 | (1) |
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5.3 Electrodeposition of Zn-Containing Alloys from Chlorozincate Ionic Liquids |
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167 | (3) |
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5.3.1 Alloys of Zn with Cu, Cd, and Sn |
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167 | (1) |
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168 | (1) |
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168 | (1) |
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169 | (1) |
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169 | (1) |
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169 | (1) |
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5.4 Fabrication of a Porous Metal Surface by Electrochemical Alloying and Dealloying |
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170 | (1) |
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171 | (1) |
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5.6 Air- and Water-Stable Ionic Liquids |
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171 | (7) |
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172 | (1) |
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172 | (1) |
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172 | (1) |
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173 | (1) |
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173 | (1) |
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173 | (1) |
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174 | (1) |
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174 | (2) |
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176 | (1) |
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176 | (1) |
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176 | (1) |
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176 | (1) |
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177 | (1) |
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5.7 Deep Eutectic Solvents |
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178 | (4) |
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178 | (1) |
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178 | (1) |
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178 | (1) |
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179 | (1) |
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179 | (1) |
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179 | (1) |
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179 | (1) |
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180 | (1) |
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181 | (1) |
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181 | (1) |
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182 | (1) |
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182 | (1) |
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182 | (1) |
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183 | (4) |
| 6 Electrodeposition of Semiconductors from Ionic Liquids |
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187 | (24) |
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187 | (1) |
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6.2 Group IV Semiconductors |
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188 | (8) |
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189 | (2) |
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191 | (4) |
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6.2.3 SixGe1-x and GexSn1-x |
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195 | (1) |
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6.3 II-VI Compound Semiconductors |
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196 | (2) |
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196 | (1) |
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197 | (1) |
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197 | (1) |
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197 | (1) |
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6.3.5 Metal Sulfides (CdS, ZnS, and SnS) |
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198 | (1) |
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6.4 III-V Compound Semiconductors |
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198 | (3) |
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199 | (1) |
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199 | (1) |
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199 | (1) |
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6.4.4 Al-Containing Semiconductors (A1Sb and AlInSb) |
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200 | (1) |
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201 | (1) |
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6.5 Other Compound Semiconductors |
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201 | (1) |
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6.5.1 II-V Compound Semiconductors (ZnSb) |
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201 | (1) |
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6.5.2 Cu-Based Chalcogenide Ternary Semiconductors (CuSbS2) |
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201 | (1) |
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202 | (2) |
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204 | (7) |
| 7 Conducting Polymers |
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211 | (42) |
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211 | (3) |
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7.2 Electropolymerization - General Experimental Procedures |
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214 | (5) |
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215 | (1) |
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7.2.2 Electrochemical Techniques |
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215 | (1) |
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7.2.3 Electropolymerization Potential |
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216 | (1) |
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216 | (1) |
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7.2.5 Atmosphere and Water Content |
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217 | (1) |
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217 | (2) |
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7.3 Synthesis of Conducting Polymers in Chloroaluminate ILs |
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219 | (2) |
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219 | (1) |
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220 | (1) |
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7.3.3 Poly(thiophene)s and Poly(fluorene) |
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221 | (1) |
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221 | (1) |
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7.4 Synthesis of Conducting Polymers in Air- and Water-Stable ILs |
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221 | (14) |
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221 | (2) |
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223 | (6) |
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7.4.3 Poly(3,4-ethylenedioxythiophene) |
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229 | (3) |
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232 | (1) |
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233 | (1) |
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7.4.6 Copolymers, Composites, and Nanostructured Polymers |
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233 | (2) |
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235 | (9) |
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7.5.1 Electrochemical Characterization |
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236 | (2) |
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7.5.2 Morphological Characterization |
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238 | (3) |
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7.5.3 Spectroscopic Characterization |
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241 | (3) |
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7.6 Conclusions and Outlook |
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244 | (1) |
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245 | (8) |
| 8 Nanostructured Materials |
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253 | (68) |
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8.1 Nanostructured Metals and Alloys Deposited from Ionic Liquids |
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253 | (25) |
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253 | (2) |
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8.1.2 Pulsed Electrodeposition from Aqueous Electrolytes |
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255 | (4) |
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8.1.2.1 Fundamental Aspects |
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255 | (2) |
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8.1.2.2 Nanometal Deposition with Nano-Gold as an Example |
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257 | (1) |
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8.1.2.3 Nanoalloy Deposition with Fex Ni1-x Alloys as an Example |
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258 | (1) |
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8.1.3 Special Features of Ionic Liquids as Electrolytes |
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259 | (2) |
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8.1.4 Nanocrystalline Metals and Alloys from Chlorometallate-Based Ionic Liquids |
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261 | (5) |
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8.1.5 Nanocrystalline Metals from Air- and Water-Stable Ionic Liquids |
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266 | (7) |
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8.1.6 Conclusion and Outlook |
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273 | (1) |
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273 | (1) |
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274 | (4) |
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8.2 Electrodeposition of Ordered Macroporous Materials from Ionic Liquids |
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278 | (11) |
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278 | (1) |
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8.2.2 3DOM Germanium and Silicon |
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279 | (4) |
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283 | (1) |
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284 | (1) |
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284 | (1) |
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285 | (1) |
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285 | (1) |
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8.2.8 3DOM Zinc and Zinc Oxide |
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285 | (1) |
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8.2.9 3DOM Conducting Polymer |
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286 | (1) |
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8.2.10 3DOM Bilayer Films |
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286 | (2) |
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288 | (1) |
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288 | (1) |
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8.3 Electrodeposition of Nanowires from Ionic Liquids |
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289 | (15) |
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289 | (1) |
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8.3.2 Template-Assisted Electrodeposition of Nanowires |
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290 | (6) |
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290 | (1) |
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291 | (1) |
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292 | (2) |
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294 | (1) |
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8.3.2.5 Zinc-Copper and Zinc-Tin |
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294 | (1) |
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294 | (1) |
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8.3.2.7 Germanium and Silicon Semiconductors |
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295 | (1) |
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8.3.2.8 Conducting Polymers |
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295 | (1) |
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8.3.3 Template-Free Electrodeposition of Nanowires |
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296 | (6) |
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8.3.3.1 Nanowires Grown from Chlorometalate ILs |
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296 | (4) |
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8.3.3.2 Tin, Tin-Silicon, and Tellurium from Nonchlorometallate ILs |
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300 | (2) |
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302 | (1) |
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302 | (1) |
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303 | (1) |
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8.4 Electrochemical Synthesis of Nanowire Electrodes for Lithium Batteries |
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304 | (17) |
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304 | (1) |
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8.4.2 Template-Assisted Electrodeposition of Nanowires/Tubes |
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305 | (9) |
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305 | (1) |
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306 | (2) |
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308 | (3) |
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311 | (1) |
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312 | (2) |
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8.4.3 Template-Free Electrodeposition of Nanowires |
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314 | (2) |
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316 | (1) |
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317 | (1) |
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317 | (4) |
| 9 Ionic Liquid-Solid Interfaces |
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321 | (24) |
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321 | (1) |
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9.2 IL-Au(1 1 1) Interface |
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322 | (5) |
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327 | (5) |
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9.4 Influence of Solutes on the IL-Electrode Interfacial Structure |
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332 | (3) |
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9.5 Thin Films of Ionic Liquids in Ultrahigh Vacuum (UHV) |
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335 | (4) |
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339 | (1) |
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339 | (6) |
| 10 Plasma Electrochemistry with Ionic Liquids |
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345 | (28) |
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345 | (1) |
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10.2 Concepts and Principles |
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346 | (5) |
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10.2.1 Plasma Electrochemistry |
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346 | (1) |
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10.2.2 Low-Temperature Plasmas: Electrodes or Electrolytes? |
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347 | (1) |
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10.2.3 The Plasma-Electrolyte Interface |
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348 | (2) |
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10.2.4 Types of Plasmas and Reactors |
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350 | (1) |
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351 | (4) |
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10.4 The Stability of Ionic Liquids in Plasma Experiments |
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355 | (4) |
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10.5 Plasma Electrochemical Metal Deposition in Ionic Liquids |
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359 | (8) |
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10.5.1 Deposition of Silver Metal |
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360 | (4) |
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10.5.2 Deposition of Copper Metal |
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364 | (1) |
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10.5.3 Deposition of Platinum Metal |
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365 | (1) |
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10.5.4 Deposition of Palladium Metal |
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365 | (2) |
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10.6 Conclusions and Outlook |
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367 | (1) |
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368 | (1) |
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368 | (5) |
| 11 Impedance Spectroscopy on Electrode I Ionic Liquid Interfaces |
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373 | (28) |
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373 | (5) |
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11.1.1 Fundamentals of Impedance Spectroscopy |
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374 | (1) |
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11.1.2 The Impedance Response of Common Systems |
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375 | (3) |
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11.2 Measurement: Basics and Pitfalls |
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378 | (3) |
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11.2.1 Working Principles of Impedance Analyzers |
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378 | (1) |
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11.2.2 Artifacts in Measurements with More Than Two Electrodes |
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379 | (2) |
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381 | (1) |
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11.3 Analysis of Experimental Data |
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381 | (6) |
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382 | (4) |
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382 | (1) |
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11.3.1.2 Initialization of Fitting Algorithms |
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382 | (1) |
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383 | (1) |
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11.3.1.4 Fit Quality and Data Validity |
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384 | (2) |
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386 | (1) |
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11.4 Application: IL Interfaces at Metal Electrodes |
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387 | (14) |
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387 | (2) |
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11.4.2 Measurement and Data Analysis |
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389 | (1) |
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11.4.3 Experimental Setup |
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390 | (1) |
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391 | (3) |
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391 | (1) |
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392 | (1) |
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11.4.4.3 Origin of the Fast Capacitive Process |
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392 | (1) |
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11.4.4.4 Origin of the Slow Capacitive Process |
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393 | (1) |
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394 | (1) |
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395 | (6) |
| 12 Technical Aspects |
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401 | (68) |
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12.1 Metal Dissolution Processes |
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401 | (7) |
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12.1.1 Counter Electrode Reactions |
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401 | (7) |
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12.1.1.1 Pretreatment Protocol |
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405 | (3) |
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408 | (1) |
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12.2 Reference Electrodes for Use in Room-Temperature Ionic Liquids |
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408 | (16) |
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12.2.1 What Is a Reference Electrode? |
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408 | (2) |
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12.2.2 Essential Characteristics of a Reference Electrode |
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410 | (1) |
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12.2.3 Pseudo-Reference Electrodes and Internal Redox Reference Couples |
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411 | (1) |
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12.2.4 Liquid Junction Potentials |
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412 | (1) |
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12.2.5 Reference Electrodes in RTILs: What Has Been Used? |
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412 | (5) |
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12.2.6 Recommendations and Comments |
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417 | (5) |
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12.2.6.1 When and How Can I Use a Pseudo-Reference Electrode in Voltammetry? |
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417 | (3) |
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12.2.6.2 How Do I Conduct an Electrosynthetic Experiment under Potential Control? |
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420 | (1) |
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12.2.6.3 What Options Are Available for Rigorous, Quantitative Voltammetry? |
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420 | (2) |
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422 | (2) |
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424 | (14) |
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424 | (1) |
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424 | (2) |
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426 | (1) |
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427 | (3) |
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430 | (1) |
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12.3.6 Material Compatibility |
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430 | (1) |
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12.3.7 Pretreatment Protocols |
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431 | (1) |
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12.3.8 Conductivity and Added Electrolytes |
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432 | (4) |
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433 | (1) |
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12.3.8.2 Counter Electrode Reactions |
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434 | (1) |
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12.3.8.3 Posttreatment Protocols and Waste Treatment |
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434 | (1) |
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435 | (1) |
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12.3.8.5 Breakdown and Recycling |
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435 | (1) |
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436 | (1) |
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436 | (2) |
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12.4 Toward Regeneration and Reuse of Ionic Liquids in Electroplating |
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438 | (19) |
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439 | (1) |
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12.4.2 Recovery, Regeneration, and Reuse of Electrolytes in Electroplating |
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440 | (8) |
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440 | (1) |
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12.4.2.2 Regeneration Options for Water-Based Process Liquors |
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441 | (3) |
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12.4.2.3 Regeneration Options for Ionic Liquids in Electroplating |
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444 | (4) |
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448 | (4) |
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452 | (1) |
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453 | (1) |
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453 | (4) |
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457 | (12) |
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12.5.1 Origin of Impurities |
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457 | (2) |
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12.5.1.1 Synthetic Impurities |
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457 | (1) |
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458 | (1) |
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12.5.1.3 Gaseous Impurities |
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459 | (1) |
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12.5.1.4 Particulate Impurities |
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459 | (1) |
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12.5.2 Impurities in Deep Eutectic Solvents |
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459 | (2) |
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12.5.3 Impact of Impurities on Electrochemistry |
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461 | (6) |
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A.1 Protocol for the Deposition of Zinc from a Type III Ionic Liquid |
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467 | (1) |
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A.1.1 Preparation of Ionic Liquids |
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467 | (1) |
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A.2 Electroplating Experiment |
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467 | (1) |
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467 | (1) |
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468 | (1) |
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468 | (1) |
| 13 Plating Protocols |
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469 | (14) |
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13.1 Electrodeposition of Al from [ C2mim]Cl/AlCl3 |
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469 | (3) |
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13.1.1 Experimental Setup |
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469 | (1) |
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13.1.2 Chemicals and Preparation |
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470 | (1) |
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470 | (2) |
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13.2 Electrodeposition of Al from 1-Buty1-3-methylimidazoliumchloride- AlCl3-Toluene |
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472 | (1) |
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13.2.1 Apparatus, Materials, and Chemicals |
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472 | (1) |
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13.2.2 Preparation of AlCl3-[ C4mim]Cl-Toluene Ionic Liquid Mixture ([ 2:1]:3) |
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472 | (1) |
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472 | (1) |
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13.2.3.1 Cathode (Mild Steel Rods) |
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472 | (1) |
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473 | (1) |
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13.2.4 Electroplating and Morphology Analysis |
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473 | (1) |
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473 | (1) |
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13.3 Electrodeposition of Al from [ C2mim] NTf2/AlCl3 |
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473 | (3) |
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13.3.1 Experimental Setup |
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474 | (1) |
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13.3.2 Chemicals and Preparation |
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474 | (1) |
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475 | (1) |
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13.4 Electrodeposition of Al from [ C4mpyr]NTf2/AlCl3 |
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476 | (1) |
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13.4.1 Experimental Setup |
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476 | (1) |
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13.4.2 Chemicals and Preparation |
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476 | (1) |
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476 | (1) |
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13.5 Electrodeposition of Li from [ C4mpyr]NTf2/LiNTf2 |
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477 | (2) |
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13.6 Electrodeposition of Ta from [ C4mpyr]NTf2 |
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479 | (1) |
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479 | (1) |
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479 | (1) |
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479 | (1) |
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13.7 Electrodeposition of Zinc Coatings from a Choline Chloride: Ethylene-Glycol-Based Deep Eutectic Solvent |
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480 | (1) |
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13.7.1 Experimental Setup |
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480 | (1) |
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480 | (1) |
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481 | (1) |
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13.8 Electrodeposition of Nickel Coatings from a Choline Chloride: Ethylene-Glycol-Based Deep Eutectic Solvent |
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481 | (1) |
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482 | (1) |
| 14 Future Directions and Challenges |
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483 | (8) |
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483 | (2) |
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14.2 Counter Electrodes/Compartments |
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485 | (1) |
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14.3 Ionic Liquids for Reactive (Nano)materials |
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486 | (1) |
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14.4 Nanomaterials/Nanoparticles |
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486 | (1) |
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14.5 Cation/Anion Effects |
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487 | (1) |
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14.6 Polymers for Batteries and Solar Cells |
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487 | (1) |
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14.7 Variable-Temperature Studies |
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488 | (1) |
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14.8 Intrinsic Process Safety |
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488 | (1) |
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14.9 Economics (Price, Recycling) |
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|
489 | (1) |
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14.10 Fundamental Knowledge Gaps |
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|
490 | (1) |
| Index |
|
491 | |