| 1 Introduction |
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1 | (10) |
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1.1 Strength of Nanocomponents |
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1 | (1) |
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1.2 Fracture Nanomechanics in a Structure |
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2 | (3) |
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1.3 Conventional Macromechanics |
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5 | (1) |
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5 | (1) |
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5 | (1) |
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1.4 Developments in Nanomechanical Testing |
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6 | (1) |
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1.5 Developments in Nanomechanical Simulation |
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7 | (2) |
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9 | (2) |
| 2 Fundamentals in Fracture Mechanics |
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11 | (30) |
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11 | (1) |
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2.2 Fracture Mechanics in a Homogeneous Linear-Elastic Body |
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12 | (5) |
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2.2.1 Singular Stress Field in the Vicinity of the Crack Tip |
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12 | (3) |
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2.2.2 Energy Release Rate |
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15 | (1) |
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16 | (1) |
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2.3 Fracture Mechanics in a Homogeneous Elastic-Plastic Body |
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17 | (6) |
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2.3.1 Stress Singularity in Power Law Plasticity |
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17 | (2) |
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2.3.2 Stress Singularity in Power Law Creep |
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19 | (4) |
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19 | (2) |
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2.3.2.2 Transition from SSC to LSC |
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21 | (2) |
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2.4 Fracture Mechanics on an Interface Crack |
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23 | (5) |
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2.4.1 Stress Singularity along the Interface of an Elastic Bimaterial |
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23 | (2) |
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2.4.2 Energy Release Rate |
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25 | (2) |
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2.4.3 Stress Singularity in a Power Law Plastic Bimaterial |
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27 | (1) |
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2.5 Stress Singularity in the Vicinity of an Interface Edge |
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28 | (3) |
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28 | (2) |
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2.5.2 Stress Singularity in a Power Law Plastic Bimaterial |
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30 | (1) |
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31 | (10) |
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31 | (1) |
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2.6.2 Subcritical Crack Growth |
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32 | (9) |
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34 | (1) |
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35 | (1) |
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2.6.2.3 Environment-assisted crack growth |
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36 | (5) |
| 3 Elastoplastic Deformation of Thin Films |
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41 | (48) |
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3.1 Fabrication Techniques of Thin Films |
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41 | (3) |
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3.1.1 Physical Vapor Deposition |
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41 | (1) |
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3.1.2 Chemical Vapor Deposition |
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42 | (1) |
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3.1.3 Oxidation (Nitridation) |
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43 | (1) |
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43 | (1) |
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44 | (11) |
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45 | (1) |
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46 | (1) |
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47 | (1) |
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3.2.4 Bilayer Tensile and Bending Tests |
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48 | (1) |
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49 | (2) |
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3.2.6 Thermal Stress Method |
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51 | (1) |
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3.2.7 Surface Acoustic Wave Method |
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52 | (1) |
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3.2.8 Vibration Lead Method |
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52 | (1) |
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3.2.9 Bending Test of a Cantilever |
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53 | (1) |
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3.2.10 Compression Test of Bar |
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54 | (1) |
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3.3 Deformation Properties |
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55 | (17) |
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55 | (2) |
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57 | (6) |
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3.3.2.1 Tensile test of a freestanding film |
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60 | (1) |
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60 | (2) |
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3.3.2.3 Bending of the cantilever |
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62 | (1) |
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63 | (9) |
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3.3.3.1 Tensile creep test for freestanding thin films |
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65 | (4) |
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3.3.3.2 Multilayer cantilever bending |
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69 | (3) |
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3.4 Challenge to Evaluation of Elastoplastic Property in a Nano-Element |
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72 | (5) |
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3.4.1 Nanocantilever Bending |
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72 | (1) |
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3.4.2 Compression of a Nanobar |
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73 | (4) |
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3.5 Limitation of Continuum Mechanics in the Deformation of Thin Films |
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77 | (12) |
| 4 Fracture of Thin Films |
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89 | (24) |
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4.1 Strength of Thin Films |
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89 | (6) |
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89 | (3) |
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92 | (3) |
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4.2 Fracture Mechanics of Thin Films |
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95 | (18) |
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95 | (3) |
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4.2.2 Creep Crack Propagation |
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98 | (2) |
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4.2.3 Fatigue Crack Propagation |
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100 | (13) |
| 5 Growth of Interface Crack |
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113 | (32) |
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5.1 Interface Fracture Toughness |
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113 | (17) |
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5.1.1 Measurement Methods |
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113 | (12) |
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5.1.1.1 Indentation method |
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115 | (1) |
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5.1.1.2 Superlayer indentation method |
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116 | (1) |
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5.1.1.3 Line scratch test |
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116 | (1) |
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117 | (1) |
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118 | (2) |
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5.1.1.6 Four-point bend test |
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120 | (1) |
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5.1.1.7 Double-cantilever beam/compact tension test |
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121 | (2) |
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5.1.1.8 Cantilever method |
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123 | (1) |
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124 | (1) |
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124 | (1) |
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5.1.2 Applicability of the Fracture Mechanics Concept to Delamination of Submicron Films |
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125 | (5) |
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130 | (15) |
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130 | (5) |
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135 | (4) |
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5.2.3 Environment-Assisted Crack Growth |
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139 | (6) |
| 6 Initiation of Interface Cracks |
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145 | (50) |
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6.1 The Smallest Limit of the Fracture Mechanics Concept |
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145 | (1) |
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146 | (29) |
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6.2.1 Crack Initiation at the Interface Edge between Thin Film and Substrate |
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146 | (6) |
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6.2.2 Crack Initiation at the Interface Edge of an Island on a Substrate |
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152 | (8) |
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6.2.3 In situ Observation of Crack Initiation and Stress Singularity in the Nanoscale |
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160 | (7) |
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6.2.4 Design of Stress Field at Fracture |
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167 | (4) |
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6.2.5 Simplification of Cracking Criteria |
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171 | (4) |
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175 | (5) |
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180 | (15) |
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6.4.1 Fatigue of Nanomaterials |
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180 | (1) |
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6.4.2 Interface Fracture in Fatigue |
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181 | (3) |
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184 | (4) |
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188 | (7) |
| 7 Components Consisting of Nano-Elements |
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195 | (34) |
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195 | (6) |
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7.1.1 Dynamic Oblique Deposition Method |
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196 | (1) |
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7.1.2 DC Plasma-Enhanced Chemical Vapor Deposition |
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196 | (1) |
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7.1.3 Hydrothermal Crystallization of Colloidal Precursors |
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196 | (1) |
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7.1.4 Template Synthesis Method |
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197 | (1) |
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7.1.5 Molecular Beam Epitaxy Method |
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198 | (1) |
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7.1.6 Reactive Pulsed Laser Deposition Method |
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198 | (1) |
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7.1.7 Geometrical Features of Nano-Elements |
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199 | (2) |
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7.2 Mechanical Properties of Aggregated Films |
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201 | (8) |
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201 | (1) |
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7.2.2 Deformation Behavior of Aggregated Films and Single Helical Nano-Elements |
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202 | (7) |
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7.3 Design of Deformation Unisotropy |
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209 | (2) |
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7.4 Design of Film Property on the Basis of Element Configuration |
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211 | (4) |
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7.5 Disappearance of Stress Concentration/Singularity at Dissimilar Interface Edges |
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215 | (3) |
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7.6 Crack Initiation and Growth along a Thin Film Comprising Nano-Elements |
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218 | (11) |
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218 | (1) |
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219 | (10) |
| 8 Strength of Atomic Components |
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229 | (60) |
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229 | (1) |
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8.2 Experimental Mechanical Testing for Atomic Components |
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230 | (4) |
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8.2.1 Mechanical Testing of a Gold Atomic Chain Using a Scanning Electron Microscope |
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230 | (1) |
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8.2.2 Mechanical Testing of Carbon Nanotubes Using an Atomic Force Microscope |
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230 | (1) |
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8.2.3 In situ Indentation Test of Nanoparticles Using a Transmission Electron Microscope |
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231 | (3) |
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8.3 Molecular Dynamics Simulations |
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234 | (8) |
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234 | (3) |
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8.3.2 Description of Interatomic Potentials |
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237 | (5) |
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8.3.2.1 Empirical potentials |
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238 | (1) |
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8.3.2.2 Semi-empirical potentials |
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238 | (2) |
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8.3.2.3 Nonempirical approach (first-principles calculations) |
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240 | (2) |
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8.4 Definitions of Stress and Strain in the Atomic Scale |
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242 | (5) |
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8.4.1 Definition of Strain in the Atomic Scale |
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242 | (1) |
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8.4.2 Definition of Stress in the Atomic Scale |
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243 | (5) |
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8.4.2.1 Areal density of internal force |
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243 | (2) |
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8.4.2.2 Definition based on strain energy |
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245 | (1) |
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8.4.2.3 Definition of stress, including the effect of temperature (Virial theorem) |
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246 | (1) |
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8.5 Definition of Elastic Coefficient in the Atomic Scale |
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247 | (1) |
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8.6 Strength of Atomic Components |
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248 | (16) |
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248 | (1) |
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8.6.2 Ideal Strength of Low-Dimensional Nanomaterials |
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249 | (15) |
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8.6.2.1 Ideal strength of Si nanofilms (2D) |
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255 | (2) |
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8.6.2.2 Ideal strength of Cu nanofilms (2D) |
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257 | (3) |
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8.6.2.3 Ideal strength of Cu nanowires and atomic chains (1D) |
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260 | (4) |
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8.7 Multiphysics Properties of Nano-Elements |
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264 | (25) |
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8.7.1 Metallic-Insulator Transition in Semiconductors |
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266 | (3) |
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8.7.2 Multiphysics Properties in Ferroelectric Nanomaterials |
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269 | (29) |
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270 | (3) |
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273 | (2) |
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8.7.2.3 Domain walls and domain switching |
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275 | (3) |
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8.7.2.4 Closure domain in thin films |
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278 | (11) |
| 9 Fracture Mechanics in Atomic Components |
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289 | (30) |
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9.1 Stress Singularity at the Atomic Scale |
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289 | (9) |
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9.2 Instability Criterion for an Atomic Structure |
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298 | (21) |
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9.2.1 Instability Criterion of a Perfect Crystal Lattice |
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299 | (6) |
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9.2.1.1 Lattice instability based on elastic stiffness tensors (B-criterion) |
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299 | (2) |
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9.2.1.2 Soft phonon mode criterion (P-criterion) |
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301 | (4) |
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9.2.2 Instability Criterion in an Inhomogeneous Atomic Structure |
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305 | (14) |
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9.2.2.1 Rigorous expression of the instability criterion in an atomic system |
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306 | (4) |
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9.2.2.2 Simplified evaluation of mechanical instability |
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310 | (9) |
| Index |
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319 | |