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E-raamat: Fracture Nanomechanics 2nd edition [Taylor & Francis e-raamat]

(Osaka University, Japan), , (Kyoto University, Japan), (Kyoto University, Japan)
  • Formaat: 334 pages, 193 Illustrations, color; 16 Illustrations, black and white
  • Ilmumisaeg: 18-Dec-2015
  • Kirjastus: Pan Stanford Publishing Pte Ltd
  • ISBN-13: 9780429091681
Teised raamatud teemal:
  • Taylor & Francis e-raamat
  • Hind: 207,73 €*
  • * hind, mis tagab piiramatu üheaegsete kasutajate arvuga ligipääsu piiramatuks ajaks
  • Tavahind: 296,75 €
  • Säästad 30%
  • Formaat: 334 pages, 193 Illustrations, color; 16 Illustrations, black and white
  • Ilmumisaeg: 18-Dec-2015
  • Kirjastus: Pan Stanford Publishing Pte Ltd
  • ISBN-13: 9780429091681
Teised raamatud teemal:

Materials of micro-/nanometer dimensions have aroused remarkable interest, motivated by the diverse utility of unconventional mechanical and electronic properties distinguished from the bulk counterpart and various industrial applications such as electronic/optic devices and MEMS/NEMS. The size of their elements is now, ultimately, approaching nanometer and atomic scales. Since the conventional theory of "fracture mechanics" is based on the continuum-body approximation, its applicability to the nanoscale components is questionable owing to the discreteness of atoms. Moreover, for describing the fracture behavior of atomic components, it is necessary to understand not only the mechanical parameters (e.g., stress and strain) but also the fracture criterion in the atomic scale.

This book systematically provides recent understanding of unusual fracture behaviors in nano/atomic elements (nanofilms, nanowires, etc.) and focuses on the critical initiation and propagation of interface crack and the mechanical instability criteria of atomic structures through the introduction of state-of-the-art experimental and theoretical techniques. It covers the fundamentals and the applicability of top-down (conventional fracture mechanics to nanoscale) and bottom-up (atomistic mechanics, including quantum mechanical effects) concepts. This second edition of Fracture Nanomechanics newly includes dramatic advances in unconventional fracture mechanics in nanofilms, extraordinary fatigue mechanics and mechanisms in nanometals, and a new area of multiphysics properties in nanoelements.

1 Introduction 1(10)
1.1 Strength of Nanocomponents
1(1)
1.2 Fracture Nanomechanics in a Structure
2(3)
1.3 Conventional Macromechanics
5(1)
1.3.1 Deformation
5(1)
1.3.2 Fracture
5(1)
1.4 Developments in Nanomechanical Testing
6(1)
1.5 Developments in Nanomechanical Simulation
7(2)
1.6 Stance in This Book
9(2)
2 Fundamentals in Fracture Mechanics 11(30)
2.1 Fracture Mechanics
11(1)
2.2 Fracture Mechanics in a Homogeneous Linear-Elastic Body
12(5)
2.2.1 Singular Stress Field in the Vicinity of the Crack Tip
12(3)
2.2.2 Energy Release Rate
15(1)
2.2.3 J-Integral
16(1)
2.3 Fracture Mechanics in a Homogeneous Elastic-Plastic Body
17(6)
2.3.1 Stress Singularity in Power Law Plasticity
17(2)
2.3.2 Stress Singularity in Power Law Creep
19(4)
2.3.2.1 Static creep
19(2)
2.3.2.2 Transition from SSC to LSC
21(2)
2.4 Fracture Mechanics on an Interface Crack
23(5)
2.4.1 Stress Singularity along the Interface of an Elastic Bimaterial
23(2)
2.4.2 Energy Release Rate
25(2)
2.4.3 Stress Singularity in a Power Law Plastic Bimaterial
27(1)
2.5 Stress Singularity in the Vicinity of an Interface Edge
28(3)
2.5.1 Elastic Bimaterial
28(2)
2.5.2 Stress Singularity in a Power Law Plastic Bimaterial
30(1)
2.6 Cracking Behavior
31(10)
2.6.1 Fracture Toughness
31(1)
2.6.2 Subcritical Crack Growth
32(9)
2.6.2.1 Fatigue
34(1)
2.6.2.2 Creep
35(1)
2.6.2.3 Environment-assisted crack growth
36(5)
3 Elastoplastic Deformation of Thin Films 41(48)
3.1 Fabrication Techniques of Thin Films
41(3)
3.1.1 Physical Vapor Deposition
41(1)
3.1.2 Chemical Vapor Deposition
42(1)
3.1.3 Oxidation (Nitridation)
43(1)
3.1.4 Electroplating
43(1)
3.2 Mechanical Testing
44(11)
3.2.1 Tensile Test
45(1)
3.2.2 Bending Test
46(1)
3.2.3 Bulge Test
47(1)
3.2.4 Bilayer Tensile and Bending Tests
48(1)
3.2.5 Indentation Test
49(2)
3.2.6 Thermal Stress Method
51(1)
3.2.7 Surface Acoustic Wave Method
52(1)
3.2.8 Vibration Lead Method
52(1)
3.2.9 Bending Test of a Cantilever
53(1)
3.2.10 Compression Test of Bar
54(1)
3.3 Deformation Properties
55(17)
3.3.1 Elasticity
55(2)
3.3.2 Plasticity
57(6)
3.3.2.1 Tensile test of a freestanding film
60(1)
3.3.2.2 Indentation test
60(2)
3.3.2.3 Bending of the cantilever
62(1)
3.3.3 Creep
63(9)
3.3.3.1 Tensile creep test for freestanding thin films
65(4)
3.3.3.2 Multilayer cantilever bending
69(3)
3.4 Challenge to Evaluation of Elastoplastic Property in a Nano-Element
72(5)
3.4.1 Nanocantilever Bending
72(1)
3.4.2 Compression of a Nanobar
73(4)
3.5 Limitation of Continuum Mechanics in the Deformation of Thin Films
77(12)
4 Fracture of Thin Films 89(24)
4.1 Strength of Thin Films
89(6)
4.1.1 Tensile Fracture
89(3)
4.1.2 Fatigue Fracture
92(3)
4.2 Fracture Mechanics of Thin Films
95(18)
4.2.1 Fracture Toughness
95(3)
4.2.2 Creep Crack Propagation
98(2)
4.2.3 Fatigue Crack Propagation
100(13)
5 Growth of Interface Crack 113(32)
5.1 Interface Fracture Toughness
113(17)
5.1.1 Measurement Methods
113(12)
5.1.1.1 Indentation method
115(1)
5.1.1.2 Superlayer indentation method
116(1)
5.1.1.3 Line scratch test
116(1)
5.1.1.4 Projection test
117(1)
5.1.1.5 Superlayer test
118(2)
5.1.1.6 Four-point bend test
120(1)
5.1.1.7 Double-cantilever beam/compact tension test
121(2)
5.1.1.8 Cantilever method
123(1)
5.1.1.9 Bulge test
124(1)
5.1.1.10 Peel test
124(1)
5.1.2 Applicability of the Fracture Mechanics Concept to Delamination of Submicron Films
125(5)
5.2 Stable Crack Growth
130(15)
5.2.1 Fatigue
130(5)
5.2.2 Creep
135(4)
5.2.3 Environment-Assisted Crack Growth
139(6)
6 Initiation of Interface Cracks 145(50)
6.1 The Smallest Limit of the Fracture Mechanics Concept
145(1)
6.2 Toughness
146(29)
6.2.1 Crack Initiation at the Interface Edge between Thin Film and Substrate
146(6)
6.2.2 Crack Initiation at the Interface Edge of an Island on a Substrate
152(8)
6.2.3 In situ Observation of Crack Initiation and Stress Singularity in the Nanoscale
160(7)
6.2.4 Design of Stress Field at Fracture
167(4)
6.2.5 Simplification of Cracking Criteria
171(4)
6.3 Creep
175(5)
6.4 Fatigue
180(15)
6.4.1 Fatigue of Nanomaterials
180(1)
6.4.2 Interface Fracture in Fatigue
181(3)
6.4.3 High-Cycle Fatigue
184(4)
6.4.4 Fatigue Mechanism
188(7)
7 Components Consisting of Nano-Elements 195(34)
7.1 Structures
195(6)
7.1.1 Dynamic Oblique Deposition Method
196(1)
7.1.2 DC Plasma-Enhanced Chemical Vapor Deposition
196(1)
7.1.3 Hydrothermal Crystallization of Colloidal Precursors
196(1)
7.1.4 Template Synthesis Method
197(1)
7.1.5 Molecular Beam Epitaxy Method
198(1)
7.1.6 Reactive Pulsed Laser Deposition Method
198(1)
7.1.7 Geometrical Features of Nano-Elements
199(2)
7.2 Mechanical Properties of Aggregated Films
201(8)
7.2.1 Fabrication
201(1)
7.2.2 Deformation Behavior of Aggregated Films and Single Helical Nano-Elements
202(7)
7.3 Design of Deformation Unisotropy
209(2)
7.4 Design of Film Property on the Basis of Element Configuration
211(4)
7.5 Disappearance of Stress Concentration/Singularity at Dissimilar Interface Edges
215(3)
7.6 Crack Initiation and Growth along a Thin Film Comprising Nano-Elements
218(11)
7.6.1 Crack Initiation
218(1)
7.6.2 Crack Growth
219(10)
8 Strength of Atomic Components 229(60)
8.1 Atomic Mechanics
229(1)
8.2 Experimental Mechanical Testing for Atomic Components
230(4)
8.2.1 Mechanical Testing of a Gold Atomic Chain Using a Scanning Electron Microscope
230(1)
8.2.2 Mechanical Testing of Carbon Nanotubes Using an Atomic Force Microscope
230(1)
8.2.3 In situ Indentation Test of Nanoparticles Using a Transmission Electron Microscope
231(3)
8.3 Molecular Dynamics Simulations
234(8)
8.3.1 Motion of Atoms
234(3)
8.3.2 Description of Interatomic Potentials
237(5)
8.3.2.1 Empirical potentials
238(1)
8.3.2.2 Semi-empirical potentials
238(2)
8.3.2.3 Nonempirical approach (first-principles calculations)
240(2)
8.4 Definitions of Stress and Strain in the Atomic Scale
242(5)
8.4.1 Definition of Strain in the Atomic Scale
242(1)
8.4.2 Definition of Stress in the Atomic Scale
243(5)
8.4.2.1 Areal density of internal force
243(2)
8.4.2.2 Definition based on strain energy
245(1)
8.4.2.3 Definition of stress, including the effect of temperature (Virial theorem)
246(1)
8.5 Definition of Elastic Coefficient in the Atomic Scale
247(1)
8.6 Strength of Atomic Components
248(16)
8.6.1 Ideal Strength
248(1)
8.6.2 Ideal Strength of Low-Dimensional Nanomaterials
249(15)
8.6.2.1 Ideal strength of Si nanofilms (2D)
255(2)
8.6.2.2 Ideal strength of Cu nanofilms (2D)
257(3)
8.6.2.3 Ideal strength of Cu nanowires and atomic chains (1D)
260(4)
8.7 Multiphysics Properties of Nano-Elements
264(25)
8.7.1 Metallic-Insulator Transition in Semiconductors
266(3)
8.7.2 Multiphysics Properties in Ferroelectric Nanomaterials
269(29)
8.7.2.1 Thin films
270(3)
8.7.2.2 Nanowires
273(2)
8.7.2.3 Domain walls and domain switching
275(3)
8.7.2.4 Closure domain in thin films
278(11)
9 Fracture Mechanics in Atomic Components 289(30)
9.1 Stress Singularity at the Atomic Scale
289(9)
9.2 Instability Criterion for an Atomic Structure
298(21)
9.2.1 Instability Criterion of a Perfect Crystal Lattice
299(6)
9.2.1.1 Lattice instability based on elastic stiffness tensors (B-criterion)
299(2)
9.2.1.2 Soft phonon mode criterion (P-criterion)
301(4)
9.2.2 Instability Criterion in an Inhomogeneous Atomic Structure
305(14)
9.2.2.1 Rigorous expression of the instability criterion in an atomic system
306(4)
9.2.2.2 Simplified evaluation of mechanical instability
310(9)
Index 319
Dr. Takayuki Kitamura, a professor at Kyoto University, Japan, since 1998, was with the Central Research Institute of Electric Power Industry, Japan (19791984), and an invited researcher at NASA (19871988). In 2007 he became the vice president of Kyoto University. From 2008 to 2014 he was a member of the Science Council of Japan and since 2014 is the president of the Society of Materials Science, Japan. His research interests include nanomaterial strength, multiphysics properties of nanomaterials, fracture nanomechanics on slow crack growth, and high-temperature strength of heat-resisting materials. He has won numerous awards from the Japan Society of Mechanical Engineers and the Society of Materials Science and has published around 300 papers.

Dr. Takashi Sumigawa, an associate professor at Kyoto University since 2011, was a researcher at the Mechanical Engineering Research Laboratory, Hitachi Ltd. (20022005); a research associate at the Department of Intelligent Machinery and Systems, Kyushu University (2005); a research fellow at the Centers of Excellence, Department of Material Engineering and Science, Kyoto University (20062007); and a lecturer at Kyoto University (20072010). He won the JSME Young Engineers Award in 2005 and the JSME Medal for Outstanding Paper in 2011. His research interests are in nanomaterial strength and fatigue behavior.

Dr. Hiroyuki Hirakata is an associate professor at Osaka University, Japan, since 2007. From 2003 to 2007, he was a research associate at Kyoto University. He won the JSME Medal for Outstanding Paper in 2004, the JSMS Award for Scientific Papers in 2007, and the JSMS Award for Promising Researchers in 2010. His research interests are in the strength and fracture mechanics of nano-/micromaterials.

Dr. Takahiro Shimada is an assistant professor at Kyoto University since 2008. He won the JSME Medal for Outstanding Paper in 2012, the JSME Young Engineers Award in 2013, and the Young Scientists Prize (Commendation for Science and Technology by the Minister of Education) in 2014. His research interests are in the strength and multiphysics properties of nanostructures.