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E-raamat: Measurement Technology for Micro-Nanometer Devices [Wiley Online]

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  • Formaat: 352 pages
  • Ilmumisaeg: 30-Dec-2016
  • Kirjastus: John Wiley & Sons Inc
  • ISBN-10: 111871797X
  • ISBN-13: 9781118717974
Teised raamatud teemal:
  • Wiley Online
  • Hind: 158,59 €*
  • * hind, mis tagab piiramatu üheaegsete kasutajate arvuga ligipääsu piiramatuks ajaks
Measurement Technology for Micro-Nanometer DevicesSuurem pilt
  • Formaat: 352 pages
  • Ilmumisaeg: 30-Dec-2016
  • Kirjastus: John Wiley & Sons Inc
  • ISBN-10: 111871797X
  • ISBN-13: 9781118717974
Teised raamatud teemal:
Wiley Online e-raamatudRohkem infot Wiley Online kohta
Raamatu kodulehekülg: https://onlinelibrary.wiley.com/doi/book/10.1002/9781118717974
A fully comprehensive examination of state-of-the-art technologies for measurement at the small scale

• Highlights the advanced research work from industry and academia in micro-nano devices test technology
• Written at both introductory and advanced levels, provides the fundamentals and theories
• Focuses on the measurement techniques for characterizing MEMS/NEMS devices
• Companion website includes Lab View soft, micro-vision system test software, and algorithm software, enhancing the learning experience
About the Authors ix
Preface xi
1 Introduction 1(10)
1.1 Micro/Nanotechnology
1(4)
1.1.1 Development of MEMS
1(2)
1.1.2 Development of NEMS
3(2)
1.2 Development of Micro/Nanoscale Measurements
5(4)
1.2.1 Significance
5(1)
1.2.2 Types of Micro/Nanoscale Measurements
6(1)
1.2.3 Conclusion and Outlook
7(2)
References
9(2)
2 Geometry Measurements at the Micro/Nanoscale 11(68)
2.1 Microvision Measurement
11(4)
2.1.1 Micro/Nanoscale Plane Geometry Parameter Tests
11(1)
2.1.2 Integrality Tests and Analysis of Micro/Nanometer Structures
12(1)
2.1.3 Micro/Nanoscale Plane Dynamic Characteristic Tests
13(2)
2.2 3D Morphology Measurements in Contact Mode
15(21)
2.2.1 Scanning Probe Microscopy
15(6)
2.2.2 Near-Field Scan Optics Microscopy (NSOM)
21(5)
2.2.3 Scanning Electron Microscopy
26(5)
2.2.4 Transmission Electron Microscopy
31(5)
2.3 3D Morphology Optics Measurements with Non-Contact Modes
36(27)
2.3.1 Laser Scanning Microscopy
37(3)
2.3.2 White Light Interferometry Morphology Measurements
40(23)
2.4 Micro/Nanoscale Tricoordinate Measurements
63(8)
2.4.1 Basics
64(3)
2.4.2 Experimental Techniques
67(4)
2.5 Measurement of Film Thickness
71(6)
References
77(2)
3 Dynamic Measurements at the Micro/Nanoscale 79(42)
3.1 Stroboscopic Dynamic Vision Imaging
79(11)
3.1.1 Principles of Plane Dynamic Measurements
80(1)
3.1.2 Equipment
81(3)
3.1.3 Block Matching and Phase Correlation Methods
84(2)
3.1.4 Optical Flow Field Measurement Method
86(4)
3.2 Stroboscopic Microscopy Interference Measurements
90(4)
3.2.1 Principles
90(2)
3.2.2 Equipment
92(1)
3.2.3 System
93(1)
3.3 Laser Doppler Microscope Vibration Measurements
94(10)
3.3.1 Differential Doppler Vibration Measurements
98(1)
3.3.2 Laser Torsional Vibration Measurements
99(1)
3.3.3 Laser Doppler Vibration Measurements of Single Torsional Vibrations and Single Bend Vibrations
100(3)
3.3.4 Laser Doppler Flutter Measurements
103(1)
3.4 Conclusion
104(15)
3.4.1 Mechanical Processes in AFM
104(2)
3.4.2 Measurement Theory and Methods of Micro/Nanometer Mechanics in AFM
106(6)
3.4.3 Micro/Nano Measurement System and Reference Cantilever Measurement Method in AFM
112(3)
3.4.4 Measurement of Spring Constant of Cantilever and System Verification
115(2)
3.4.5 Application of AFM to Nanometrology
117(2)
References
119(2)
4 Mechanical Characteristics Measurements 121(70)
4.1 Residual Stress Measurements of Microstructures
122(9)
4.1.1 Residual Stress
122(1)
4.1.2 Measurements
122(9)
4.2 Axial Tensile Measurement
131(9)
4.2.1 Traditional Tensile Method
131(5)
4.2.2 Conversion Tensile Method
136(1)
4.2.3 Integrated Tensile Method
137(1)
4.2.4 Displacement Measurement of Uniaxial Tension
138(2)
4.3 Nano-Indentation Measurements Using Contact Dode
140(11)
4.3.1 Basic Principles of Nano-Indentation Technology
140(8)
4.3.2 Nano-Indentation Measurements
148(2)
4.3.3 Features of Nano-Indentation Technology
150(1)
4.4 Bend Method
151(6)
4.4.1 Principles
151(3)
4.4.2 Micro/Nanobeams
154(3)
4.4.3 Advantages and Disadvantages of the Bend Method
157(1)
4.5 Resonance Method
157(3)
4.5.1 Resonance Frequency
158(1)
4.5.2 Intrinsic Resonance Frequency
159(1)
4.6 Stress Measurements Based on Raman Spectroscopy
160(14)
4.6.1 Raman Scattering
160(1)
4.6.2 Theory
161(1)
4.6.3 Experimental Techniques
162(2)
4.6.4 System
164(8)
4.6.5 Experiments
172(1)
4.6.6 Conclusion and Prospects
173(1)
4.7 Bonding Strength Measurements
174(15)
4.7.1 Principles
174(9)
4.7.2 Crack Spread Method
183(6)
References
189(2)
5 SPM for MEMS/NEMS Measurements 191(36)
5.1 Introduction
191(1)
5.2 Atomic Force Measurement
192(7)
5.2.1 Atomic Force Measurement Methods
192(7)
5.3 Instruments
199(6)
5.3.1 Schematic of the AFM Unit
199(1)
5.3.2 Fiber and Sample Approach Stages
200(2)
5.3.3 Tube Scanner
202(2)
5.3.4 Vibration Isolation System
204(1)
5.4 Interferometer Detection Method
205(4)
5.4.1 Optical Interference Theory
205(2)
5.4.2 Interferometer Detection
207(2)
5.5 Cantilever and Tip
209(2)
5.6 SPM System
211(1)
5.7 Applications of SFM in Micro/Nano Measurements
212(10)
5.7.1 Three-Dimensional (3D) Imaging
212(3)
5.7.2 Micro/Nanoelectronics
215(2)
5.7.3 Metrology
217(1)
5.7.4 Manipulation and Spectroscopy
218(4)
5.8 Conclusion
222(1)
References
222(5)
6 MEMS Online Measurements 227(28)
6.1 Bulk Silicon Micromachining
228(7)
6.1.1 Principles
228(1)
6.1.2 Location Platform
229(6)
6.2 Surface Micromachining
235(10)
6.2.1 Surface Sacrificial Layer Microfabrication Process
236(3)
6.2.2 Thermal Conductivity Measurements of Polysilicon Thin Films
239(6)
6.3 Polymer Materials Processing
245(7)
6.3.1 Principles
245(2)
6.3.2 Photosensitive Polyimide (PSPI) Microvalve
247(5)
6.4 Conclusion
252(1)
References
253(2)
7 Typical Micro/Nanoscale Device Measurements 255(72)
7.1 MEMS Pressure Transducer Measurements
255(21)
7.1.1 Introduction
255(1)
7.1.2 Principles of MEMS Pressure Transducers
255(6)
7.1.3 Electrical Property Measurements
261(6)
7.1.4 Static Testing of MEMS Pressure Sensors
267(4)
7.1.5 Dynamic Measurements
271(1)
7.1.6 Impact Factors of Pressure Sensor Testing
272(1)
7.1.7 Reliability Measurements
273(3)
7.2 MEMS Accelerator Measurements
276(20)
7.2.1 Introduction
276(1)
7.2.2 Low- and Medium-Range Accelerator Measurements
277(7)
7.2.3 High-g MEMS Accelerator Measurements
284(12)
7.3 RF MEMS Testing Technology
296(8)
7.4 Micro/Nanoscale Devices for Infrared Measurement
304(7)
7.4.1 Infrared Imaging System
305(2)
7.4.2 Infrared Imaging Measurement
307(4)
7.5 Typical NEMS Device Measurement
311(14)
7.5.1 NEMS Accelerometer Measurements
312(6)
7.5.2 Working Principles of a NEMS Acoustic Sensor
318(7)
References
325(2)
Index 327
WENDONG ZHANG, North University of China, China

XIUJIAN CHOU, North University of China, China

TIELIN SHI, Huazhong University of Science and Technology, China

ZONGMIN MA, North University of China, China

HAIFEI BAO, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China

JING CHEN, Peking University, China

LIGUO CHEN, Soochow University, China

DACHAO LI, Tianjin University, China

CHENYANG XUE, Key Laboratory of Instrument Science and Dynamic Measurement, Ministry of Education, China
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