Preface |
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xv | |
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xvii | |
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xxvii | |
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xxix | |
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xxxiii | |
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1 Mechanical Design of Micromechanical Silicon Oscillating Accelerometer |
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1 | (24) |
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1 | (2) |
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1.2 Mechanical Structure Design |
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3 | (16) |
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1.2.1 Theory of Operation |
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3 | (1) |
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1.2.2 Modelling of DETF Resonator for Closed-form Analysis |
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4 | (4) |
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1.2.3 Micro Lever Mechanism and Amplification Factor |
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8 | (5) |
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1.2.4 System Amplification Factor n' |
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13 | (1) |
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13 | (1) |
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14 | (1) |
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1.2.7 Thermal Sensitivity |
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15 | (1) |
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1.2.8 Stiffness Nonlinearity |
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16 | (3) |
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1.3 Fabrication and Testing |
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19 | (4) |
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19 | (2) |
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21 | (2) |
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23 | (1) |
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23 | (2) |
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2 Front-end Amplifiers for MEMS Silicon Oscillating Accelerometers |
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25 | (38) |
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2.1 Capacitive Sensing in MEMS Sensors |
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25 | (4) |
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2.2 Front-end Amplifiers for MEMS Oscillators |
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29 | (13) |
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2.2.1 Single-Stage Resistive Feedback TIA |
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29 | (1) |
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2.2.1.1 Stability and bandwidth |
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30 | (1) |
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2.2.1.2 Input-referred noise |
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31 | (3) |
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2.2.2 Two-Stage Resistive Feedback TIA |
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34 | (2) |
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2.2.3 T-Network Resistive Feedback TIA |
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36 | (1) |
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2.2.4 Charge-Sensing Amplifier (CSA) |
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37 | (3) |
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2.2.5 Capacitive Feedback TIA |
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40 | (2) |
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2.3 Front-end Amplifier for MEMS SOA |
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42 | (15) |
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2.3.1 Concept of MEMS SOA and its Front-end |
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42 | (3) |
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2.3.2 Continuous-Time Integrator-Differentiator-Based TIA |
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45 | (4) |
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2.3.3 Discrete-Time Integrator-Differentiator-Based Amplifier |
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49 | (5) |
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2.3.4 Front-end Based on Passive Charge Sensing |
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54 | (3) |
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57 | (2) |
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59 | (4) |
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3 MEMS Silicon Oscillating Accelerometer Readout Circuit |
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63 | (30) |
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64 | (5) |
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3.1.1 Concept of MEMS Silicon Oscillating Accelerometer (SOA) |
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64 | (1) |
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3.1.2 Readout Circuits for MEMS SOA |
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65 | (1) |
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3.1.3 Acceleration Noise Characterization |
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66 | (3) |
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69 | (7) |
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69 | (1) |
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3.2.1.1 Front-end amplifier |
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69 | (1) |
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3.2.1.2 Oscillation-sustaining circuit |
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70 | (1) |
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70 | (1) |
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3.2.2.1 Amplitude-stiffness effect |
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70 | (1) |
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3.2.2.2 Noise model of the AAC loo |
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71 | (2) |
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3.2.3 Phase Noise of the MEMS Oscillator |
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73 | (3) |
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3.3 Circuit Implementation |
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76 | (11) |
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3.3.1 Overall Readout Circuit at System Level |
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76 | (1) |
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3.3.2 Front-end Amplifier |
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76 | (3) |
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79 | (2) |
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81 | (1) |
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82 | (1) |
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83 | (3) |
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3.3.7 Variable Gain Amplifier (VGA) |
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86 | (1) |
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87 | (3) |
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90 | (1) |
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91 | (2) |
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4 An MEM Silicon Oscillating Accelerometer Employing a PLL and a Noise Shaping Frequency-to-Digital Converter |
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93 | (40) |
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93 | (2) |
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95 | (6) |
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96 | (3) |
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99 | (1) |
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99 | (2) |
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4.3 PLL-Based Sigma-Delta FDC |
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101 | (9) |
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4.3.1 A Brief Review of Existing FDCs |
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102 | (1) |
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4.3.1.1 Reset counter-based FDC |
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102 | (1) |
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4.3.1.2 Delta-sigma FDC (X A FDC) |
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103 | (1) |
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4.3.1.3 PLL-based FDC (PLL-FDC) |
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104 | (1) |
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4.3.2 A Modified PLL-based FDC (MPLL-FDC) |
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105 | (2) |
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4.3.3 Analysis of Quantization Error in MPLL-FDC |
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107 | (3) |
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4.4 Stability of the PLL with a Hybrid PFD |
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110 | (4) |
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4.5 Noises in PLL-Based MEMS SOA |
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114 | (2) |
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4.6 Key Circuit Designs for PLL-based MEMS SOA |
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116 | (6) |
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4.6.1 Analog Front-end Amplifier |
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116 | (2) |
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4.6.2 Hybrid Mode Phase Frequency Detector |
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118 | (3) |
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4.6.3 Phase-Lock Loop with FDC |
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121 | (1) |
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4.7 Experiment Results of a Prototype PLL-based MEMS SOA |
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122 | (6) |
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4.7.1 Prototype Implementation |
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122 | (1) |
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4.7.2 FDC Measurement Results |
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123 | (1) |
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4.7.3 MEMS SOA Measurement Results |
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123 | (5) |
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128 | (1) |
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129 | (4) |
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5 A System-decomposition Model for MEMS Silicon Oscillating Accelerometer |
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133 | (30) |
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133 | (3) |
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5.2 Silicon Oscillating Accelerometer |
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136 | (1) |
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137 | (1) |
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137 | (1) |
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137 | (1) |
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138 | (4) |
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5.4.1 Additive and Multiplicative Noises |
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139 | (1) |
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5.4.2 Stiffness Modulation Noise |
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139 | (1) |
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5.4.3 Noise Classification Examples |
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140 | (2) |
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5.5 System Decomposition Model |
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142 | (7) |
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5.5.1 Time-domain Decomposition for Damped MEMS Resonator |
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142 | (3) |
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5.5.2 Frequency-domain Decomposition for Damped MEMS Resonator |
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145 | (1) |
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146 | (1) |
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5.5.4 Decomposition of a Practical MEMS Oscillation System |
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146 | (2) |
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5.5.5 Phase Noise Modeling of Entire MEMS SOA Encompassing Nonlinearities |
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148 | (1) |
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5.6 Noise Estimation with System Decomposition Phase Noise Model |
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149 | (7) |
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156 | (3) |
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5.7.1 Performance Prediction |
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157 | (2) |
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5.7.2 The Optimal MEMS Resonator Displacement Amplitude |
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159 | (1) |
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159 | (1) |
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160 | (3) |
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6 Resonant Seismic Sensor |
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163 | (96) |
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163 | (1) |
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164 | (28) |
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164 | (2) |
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6.2.2 Mechanical Structure Design |
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166 | (1) |
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6.2.3 Resonant Sensing Element |
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166 | (1) |
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166 | (4) |
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6.2.3.2 Scale factor optimization |
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170 | (2) |
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6.2.3.3 Nonlinearity of scale factor |
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172 | (3) |
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175 | (1) |
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6.2.4 Inertial Force Amplifier |
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175 | (1) |
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6.2.4.1 Micro-leverage mechanism |
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175 | (1) |
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6.2.4.2 Lever amplification factor |
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176 | (6) |
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6.2.4.3 Effective amplification factor |
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182 | (2) |
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184 | (1) |
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6.2.5 Proof Mass and Suspension Frame |
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185 | (1) |
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6.2.5.1 Proof-mass design |
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185 | (2) |
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6.2.5.2 Suspensions design |
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187 | (1) |
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6.2.6 Mechanical Structure Design Evaluation |
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188 | (4) |
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6.3 Electronic Circuitry Design |
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192 | (15) |
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6.3.1 Electro-mechanical Transducer Design For DETF Sensing Element |
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193 | (2) |
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6.3.2 Electro-mechanical Model of DETF Sensing Element |
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195 | (1) |
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6.3.2.1 Linear model of DETF sensing element |
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195 | (3) |
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6.3.2.2 Nonlinear model of DETF sensing element |
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198 | (6) |
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6.3.3 Design of Frequency Tracking Oscillator |
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204 | (2) |
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206 | (1) |
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6.4 Seismic Acceleration Resolution |
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207 | (23) |
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6.4.1 Frequency Noise Model |
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207 | (3) |
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6.4.1.1 PSD of phase/frequency noise |
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210 | (1) |
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211 | (2) |
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6.4.2 Factors Influencing Resolution |
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213 | (1) |
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6.4.2.1 Phase noise of the DETF sensing element |
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213 | (3) |
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6.4.2.2 Noise in semiconductor amplifiers |
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216 | (4) |
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6.4.2.3 Noise in the frequency tracking oscillator |
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220 | (4) |
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6.4.3 Estimation of Resonant Seismic Sensors' Resolution |
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224 | (1) |
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6.4.3.1 Mechanical-thermal noise limited resolution |
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224 | (3) |
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6.4.3.2 Electronic noise-limited resolution |
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227 | (3) |
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6.4.3.3 Combinative resolution estimation |
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230 | (1) |
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230 | (1) |
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6.5 Drift in Resonant Seismic Sensors |
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230 | (12) |
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231 | (1) |
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6.5.1.1 Temperature-dependent elasticity |
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231 | (3) |
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6.5.1.2 Thermal expansion and thermal stress |
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234 | (4) |
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6.5.1.3 Temperature-dependent DC bias voltage |
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238 | (1) |
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6.5.2 Pressure-Induced Drift |
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239 | (2) |
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6.5.3 Charge-Induced Drift |
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241 | (1) |
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6.6 Device Fabrication and Integration |
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242 | (11) |
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6.6.1 Micromachining Process |
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242 | (1) |
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6.6.2 Low Pressure Package |
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243 | (1) |
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6.6.3 Laboratory Calibration and Results |
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244 | (1) |
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6.6.3.1 Experimental setu |
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245 | (1) |
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246 | (1) |
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6.6.4.1 Accelerometer scale factor |
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246 | (1) |
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6.6.4.2 Accelerometer resolution |
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247 | (4) |
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6.6.5 Dynamic Calibration |
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251 | (1) |
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252 | (1) |
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253 | (6) |
Index |
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259 | (4) |
About the Editor |
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263 | |