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E-raamat: Power Hybrid Circuit Design & Manufacture [Taylor & Francis e-raamat]

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Power Hybrid Circuit Design & ManufactureSuurem pilt
Teised raamatud teemal:
Taylor & Francis e-raamatudRohkem infot Taylor & Francis e-raamatute kohta
Raamatu kodulehekülg: https://www.taylorfrancis.com/books/9781315214443
Discusses the design principles, capabilities, and applications of power hybrid microcircuits and modules, detailing the operation of power semiconductors and passive components, the properties of materials, design guidelines, thermal management and control, and manufacturing technologies. Emphasizes the high reliability needed in off-the-counter power hybrids for commercial or military use. The topics include electronic packaging techniques, a variety of components and the principles of their operation, criteria for selecting specific materials, thermal management and control, and manufacturing. Addressed to engineers with little experience in the technology, though some parts would be of more use to managers. Annotation c. by Book News, Inc., Portland, Or.

"Discusses the fundamental design principles, capabilities, and applications of power hybrid microcircuits and modules--detailing the operation of power semiconductor and passive components, the properties of materials, design guidelines, thermal management, and manufacturing technologies."
Preface v
1 Hybrid Microcircuit Technology
1(8)
1.1 Introduction
1(1)
1.2 Electronic Packaging Techniques
2(2)
1.3 Hybrids in Electronic Systems
4(5)
2 Components Parts
9(60)
2.1 Introduction
9(1)
2.2 Passive Chip Components
9(18)
2.2.1 Resistors
10(6)
2.2.2 Capacitors
16(7)
2.2.3 Inductors and Transformers
23(4)
2.3 Semiconductor Chip Components
27(26)
2.3.1 Diodes
27(8)
2.3.2 Transient Voltage Suppressors
35(3)
2.3.3 Transistors
38(13)
2.3.4 Integrated Circuit
51(1)
2.3.5 Smart Power Integrated Circuits
51(2)
2.4 Packages
53(13)
2.4.1 Introduction
53(1)
2.4.2 Construction
54(6)
2.4.3 Lead Feedthrough
60(5)
2.4.4 Covers
65(1)
References
66(3)
3 Materials
69(26)
3.1 Introduction
69(1)
3.2 Substrates
69(10)
3.3 Interconnecting Wires
79(4)
3.4 Adhesives
83(1)
3.4.1 Electrical Characteristics
83(1)
3.4.2 Mechanical Characteristics
83(1)
3.4.3 Chemical Characteristics
84(1)
3.5 Solders
84(9)
References
93(2)
4 Power Hybrid Design
95(54)
4.1 Introduction
95(1)
4.2 Functional Design Flow
96(6)
4.3 Physical Design
102(45)
4.3.1 Circuit Partitioning
102(4)
4.3.2 Area Study
106(3)
4.3.3 Package Design
109(6)
4.3.4 Layout Design
115(29)
4.3.5 Detail Documentation
144(3)
References
147(2)
5 Thermal Management and Control
149(42)
5.1 Introduction
149(1)
5.2 Heat Flow
149(20)
5.2.1 Thermal Resistance
149(3)
5.2.2 Thermal Analysis
152(17)
5.3 Thermal Partitioning
169(1)
5.4 Thermal Effects on Device Performance
170(4)
5.5 Thermal Measurements
174(14)
5.5.1 Electrical
177(1)
5.5.2 Thermal Imaging
178(10)
References
188(3)
6 Manufacturing
191(30)
6.1 Introduction
191(1)
6.2 Manufacturing Flow
191(30)
7 Applications
221(12)
7.1 Introduction
221(1)
7.2 Markets and Applications
221(12)
7.2.1 Motion Control
225(6)
7.2.2 Power Conversion
231(2)
Appendix A: Glossary of Hybrid Microcircuits Packaging Terms 233(60)
Appendix B: Unit Conversion Tables 293(20)
Index 313
Haim Taraseiskey
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