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1 | (16) |
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1.1 A strong market growth from 1999 to 2008 |
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1 | (1) |
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1.2 A technology coming to maturity: crystalline silicon |
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2 | (2) |
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1.3 High-efficiency crystalline silicon solar cells |
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4 | (1) |
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1.4 The silicon feed-stock issue: a trigger for thin-film deployment |
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5 | (3) |
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1.5 Thin-film silicon: a unique thin-film technology with a "long" history |
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8 | (1) |
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1.6 Amorphous silicon, microcrystalline silicon and "micromorph" devices |
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9 | (2) |
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1.7 Synergy with the display sector and emergence of a large PV sector |
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11 | (2) |
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1.8 Perspectives and challenges for thin-film silicon technology |
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13 | (2) |
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15 | (2) |
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2 Basic Properties of Hydrogenated Amorphous Silicon (a-Si: H) |
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17 | (80) |
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17 | (7) |
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2.1.1 Structure of amorphous silicon |
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18 | (4) |
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2.1.2 "Free" and "trapped" carriers (electrons and holes); mobility gap |
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22 | (2) |
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24 | (11) |
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24 | (3) |
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2.2.2 Midgap states: dangling bonds |
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27 | (3) |
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2.2.3 Light-induced degradation (Staebler-Wronski effect) |
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30 | (5) |
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2.3 Optical absorption: optical gap and sub-bandgap absorption |
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35 | (12) |
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2.3.1 Absorption coefficient plot |
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36 | (2) |
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2.3.2 Link between density of states and absorption coefficient |
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38 | (2) |
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2.3.3 Exponential density of states in bandtails and Urbach energy in plot of absorption coefficient |
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40 | (1) |
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2.3.4 Determination of the optical gap |
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41 | (3) |
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2.3.5 Relationship between sub-bandgap absorption |
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44 | (1) |
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2.3.6 Measurement of sub-bandgap absorption |
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44 | (3) |
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2.4 Transport, conductivity and recombination |
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47 | (14) |
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47 | (1) |
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2.4.2 Measurement of conductivity in a co-planar configuration |
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48 | (1) |
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2.4.3 Dark conductivity σ dark |
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49 | (4) |
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53 | (5) |
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58 | (3) |
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2.5 Doping of amorphous silicon layers |
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61 | (3) |
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64 | (10) |
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64 | (1) |
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2.6.2 Hydrogen incorporation |
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65 | (2) |
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2.6.3 Hydrogen dilution during deposition |
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67 | (1) |
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2.6.4 Hydrogen effusion and hydrogen surface desorption |
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67 | (3) |
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70 | (1) |
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2.6.6 Hydrogen solubility effects |
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70 | (3) |
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2.6.7 Hydrogen effects on optoelectronic properties |
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73 | (1) |
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2.6.8 Effect of hydrogen incorporation on the bandgap of a-Si: H |
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73 | (1) |
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2.6.9 Stability of dangling bond passivation |
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74 | (2) |
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2.6.10 Hydrogen and material microstructure |
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74 | (1) |
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2.6.11 Role of hydrogen in light-induced degradation |
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74 | (2) |
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2.7 Amorphous silicon-germanium and silcon-carbon Alloys |
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76 | (11) |
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76 | (1) |
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77 | (2) |
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2.7.3 Structure of a-Si: Ge: H and a-Si: C: H alloys |
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79 | (1) |
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2.7.4 Hydrogen incorporation, effusion, surface desorption and diffusion |
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80 | (2) |
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2.7.5 Microstructural effects (voids) |
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82 | (1) |
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2.7.6 Dangling bonds, density of defect states |
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83 | (1) |
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2.7.7 Hydrogen stability versus alloy composition |
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84 | (1) |
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84 | (1) |
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2.7.9 Light-induced degradation |
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84 | (1) |
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2.7.10 Optical absorption |
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84 | (1) |
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2.7.11 Electronic transport properties |
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85 | (1) |
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2.7.12 Slope of the valence bandtail; Urbach energy |
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86 | (1) |
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2.7.13 Strategies for obtaining good quality alloys |
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87 | (1) |
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87 | (2) |
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89 | (8) |
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3 Basic Properties of Hydrogenated Microcrystalline Silicon |
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97 | (48) |
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97 | (4) |
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3.2 Structural properties of μ-Si: H |
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101 | (23) |
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101 | (6) |
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3.2.2 Defects and gap states |
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107 | (6) |
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3.2.3 Hydrogen, defect passivation, impurities and doping |
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113 | (5) |
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3.2.4 Schematic picture for the structure of μ-Si: H |
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118 | (4) |
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3.2.5 Relationships between structural and other properties of μ-Si: H material |
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122 | (2) |
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124 | (2) |
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3.4 Electronic properties and transport |
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126 | (5) |
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3.5 Metastability - instability |
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131 | (1) |
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132 | (2) |
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134 | (1) |
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135 | (10) |
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4 Theory of Solar Cell Devices (Semi-Conductor Diodes) |
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145 | (31) |
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Part I Introduction and "pin-Type" Diodes |
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145 | (1) |
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4.1 Conversion of light into electrical carriers by a semi-conductor diode |
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145 | (9) |
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4.1.1 First step: generation of electron-hole pairs |
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145 | (7) |
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4.1.2 Second step: separation of electrons and holes |
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152 | (2) |
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4.2 The "pn-type" or "classical" diode: dark characteristics |
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154 | (4) |
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4.3 The "pn-type" or "classical" diode: Properties under illumination |
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158 | (11) |
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4.3.1 Photo-generation and superposition principle (ideal case) |
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158 | (2) |
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4.3.2 Limitations of a "real" diode (under illumination) |
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160 | (3) |
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4.3.3 Maximum power point (MPP) and fill factor (FF) of a solar cell |
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163 | (1) |
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4.3.4 Basic solar cell parameters JSC, VOC, FF |
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164 | (5) |
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4.4 Limits on solar cell efficiency |
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169 | (7) |
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4.4.1 Limits at standard test conditions (STC) |
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169 | (2) |
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4.4.2 Variation in light intensity |
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171 | (1) |
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4.4.3 Variation in operating temperature |
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172 | (3) |
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4.4.4 Variation in the specturm of the incoming light |
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175 | (1) |
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4 Theory of Solar Cell Devices (Semi-Conductor Diodes) |
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176 | (61) |
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Part II "pin-Type" Solar Cells |
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176 | (1) |
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4.5 Introduction to "pin-type" solar cells |
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176 | (13) |
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4.5.1 Basic structure and properties |
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176 | (3) |
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4.5.2 Formation of the internal electric field |
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179 | (4) |
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4.5.3 Carrier profiles in the intrinsic layer: free carriers pf and nf |
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183 | (3) |
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4.5.4 Trapped charge carriers pt and nt in bandtails |
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186 | (3) |
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4.6 Effect of trapped charge in valence and conduction bandtails on electric field and carrier transport |
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189 | (4) |
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4.6.1 Deformation of electric field in i-layer by trapped carriers: Concept |
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189 | (1) |
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4.6.2 Deformation of electric field in i-layer by trapped carriers: numerical simulations for amorphous silicon |
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190 | (2) |
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4.6.3 Mobilities in amorphous and microcrystalline silicon |
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192 | (1) |
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4.7 Dangling bonds and their role in field deformation |
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193 | (8) |
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4.7.1 Dangling bond charge states |
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193 | (3) |
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4.7.2 Field deformation by charged dangling bonds within the i-layer: Concept |
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196 | (2) |
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4.7.3 Field deformation by charged dangling bonds within the i-layer: numerical simulation for an amorphous silicon solar cell with di= 300 nm |
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198 | (1) |
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4.7.4 Field deformation within the i-layer: summary of situation for different i-layer thicknesses |
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198 | (3) |
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4.8 Recombination and Collection |
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201 | (4) |
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4.8.1 p/i and i/n interfaces |
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201 | (2) |
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203 | (1) |
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4.8.3 Collection and drift lengths |
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204 | (1) |
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4.9 Electrical description of the pin-solar cell |
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205 | (11) |
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4.9.1 Equivalent circuit and extended "superposition principle" |
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205 | (5) |
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210 | (1) |
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4.9.3 Variable illumination measurements (VIM) |
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211 | (2) |
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4.9.4 Reverse saturation current Jo and open ciruit voltage Voc |
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213 | (1) |
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4.9.5 Fill factor in pin-type thin-film silicon solar cells |
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214 | (1) |
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4.9.6 Limits for the short-circuit current Jsc in pin-type thin-film silicon solar cells |
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215 | (1) |
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4.10 Light-induced degradation or "Staebler-Wronski effect" in thin-film silicon solar cells |
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216 | (2) |
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4.11 Spectral response, light trapping and efficiency limits |
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218 | (13) |
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4.11.1 Spectral response (SR) and external quantum efficiency (EQE) measurements |
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218 | (3) |
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4.11.2 Light trapping in thin-film silicon solar cells |
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221 | (4) |
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4.11.3 Limits for the efficiency η in pin-type thin-film silicon solar cells |
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225 | (4) |
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4.11.4 Summary and conclusions |
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229 | (2) |
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231 | (6) |
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5 Tandem and Multi-Junction Solar Cells |
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237 | (32) |
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5.1 Introduction, general concept |
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237 | (3) |
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5.2 Principle of the two-terminal tandem cell |
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240 | (6) |
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5.2.1 Construction of basic J-V diagram: Rules for finding tandem Jsc, Voc, FF |
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240 | (2) |
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5.2.2 Recombination (tunnel) junction |
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242 | (1) |
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5.2.3 Efficiency limits for tandems |
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243 | (3) |
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5.3 Practical problems of two-terminal tandem cells |
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246 | (5) |
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246 | (2) |
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5.3.2 Efficiency variation due to changes in the solar spectrum |
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248 | (1) |
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5.3.3 Temperature coefficients |
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248 | (1) |
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5.3.4 Pinholes and Shunts |
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249 | (1) |
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250 | (1) |
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5.4 Typical tandem and multi-junction cells |
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251 | (4) |
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5.4.1 Amorphous tandem cells a-Si: H/a-Si: H |
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251 | (1) |
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5.4.2 Triple-junction amorphous cells with germanium |
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252 | (1) |
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5.4.3 Micromorph (a-Si: H/μc-Si: H) tandem cells |
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253 | (1) |
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5.4.4 Triple-junctions with microcrystalline silicon |
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254 | (1) |
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5.5 Spectral response (SR) and External Quantum Efficiency (EQE) measurements |
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255 | (9) |
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255 | (1) |
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5.5.2 Use of "colored" bias light beams for SR/EQE- measurements on tandems and triple-junction cells |
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256 | (1) |
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5.5.3 SR/EQE measurements for a-Si: H/a-Si: H tandem cells |
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257 | (1) |
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5.5.4 Shunt detection in sub-cells by SR/EQE measurements |
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258 | (2) |
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5.5.5 SR/EOE measurements for triple-junction cells |
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260 | (1) |
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5.5.6 SR/EQE measurements for "micromorph" tandem cells |
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260 | (2) |
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5.5.7 Necessity for voltage correction (with bias voltage) |
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262 | (2) |
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264 | (2) |
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266 | (3) |
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6 Module Fabrication and Performance |
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269 | (100) |
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6.1 Plasma-enhanced chemical vapor deposition (PECVD) |
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269 | (37) |
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6.1.1 Electrical Plasma properties |
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273 | (4) |
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6.1.2 VHF plasma excitation |
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277 | (6) |
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6.1.3 Device-grade material |
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283 | (3) |
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6.1.4 Deposition parameters |
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286 | (1) |
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287 | (5) |
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6.1.6 Deposition regimes for a-Si: H and μc-Si: H |
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292 | (5) |
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297 | (2) |
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299 | (1) |
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6.1.9 Roll-to-roll depositions |
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300 | (4) |
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6.1.10 Novel deposition systems |
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304 | (2) |
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6.2 Hot-wire chemical vapor deposition (HWCVD) |
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306 | (5) |
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306 | (1) |
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6.2.2 Description of the HWCVD technique |
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306 | (1) |
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307 | (1) |
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6.2.4 Types of materials deposited by HWCVD |
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307 | (1) |
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6.2.5 Mechanisms of the deposition process |
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308 | (1) |
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309 | (1) |
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6.2.7 Amorphous and microcrystalline silicon films, and microcrystalline silicon carbide alloys |
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309 | (2) |
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6.2.8 Silicon nitride and silicon oxynitride films |
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311 | (1) |
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311 | (5) |
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312 | (2) |
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6.3.2 Doped microcrystalline layers |
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314 | (2) |
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6.4 Transparent conductive oxides (TCO) as contact materials |
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316 | (15) |
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6.4.1 Glass substrates and specific TCO materials |
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316 | (1) |
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6.4.2 Qualification of TCO materials |
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317 | (2) |
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6.4.3 Surface texture of TCO |
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319 | (5) |
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324 | (2) |
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6.4.5 Light management in cells |
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326 | (2) |
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328 | (3) |
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6.5 Laser scribing and series connection of cells |
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331 | (5) |
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6.5.1 Cell interconnection scheme |
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331 | (2) |
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6.5.2 Power losses due to the series connection of cells |
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333 | (3) |
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336 | (15) |
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336 | (2) |
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338 | (3) |
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341 | (5) |
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346 | (5) |
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351 | (8) |
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352 | (3) |
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6.7.2 Module certification |
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355 | (1) |
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6.7.3 Long-term stability |
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356 | (3) |
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359 | (1) |
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360 | (9) |
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7 Examples of Solar Module Applications |
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369 | (32) |
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7.1 Building-integrated photovoltaics (BIPV): aspects and examples |
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369 | (13) |
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7.1.1 PV Facade in Munich (Germany) |
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371 | (2) |
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7.1.2 Alpine roof integrated PV |
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373 | (1) |
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7.1.3 PV Roof at Auvernier, Switzerland (by Reto Tscharner) |
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374 | (2) |
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7.1.4 PV installation in Brazil |
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376 | (4) |
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7.1.5 Stillwell Avenue Station, New York City |
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380 | (2) |
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7.2 Stand-alone and portable applications |
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382 | (3) |
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7.3 Indoor applications of amorphous silicon solar cells |
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385 | (3) |
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7.3.1 Why is amorphous silicon well suited for indoor applications? |
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386 | (1) |
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7.3.2 Design guidelines for solar powering of indoor applications |
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387 | (1) |
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388 | (8) |
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388 | (2) |
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7.4.2 Satellite power generators and specific power density |
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390 | (2) |
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7.4.3 Radiation resistance of a-Si: H and other PV technologies |
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392 | (1) |
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7.4.4 a-Si: H based cells for space |
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393 | (2) |
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7.4.5 Space applications of a-Si: H modules |
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395 | (1) |
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396 | (1) |
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397 | (4) |
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401 | (24) |
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8.1 Thin-film transistors and display technology |
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401 | (12) |
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401 | (1) |
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8.1.2 TFTs and flat panel displays |
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402 | (3) |
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8.1.3 TFT configurations and basic characteristics |
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405 | (2) |
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8.1.4 a-Si: H TFT operation |
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407 | (6) |
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8.1.5 μc-Si: H and poly-Si TFT performance and other issues |
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413 | (1) |
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413 | (2) |
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8.2.1 Introduction and device configuration |
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413 | (2) |
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8.2.2 Performance and limitations |
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415 | (1) |
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8.3 Thin-film sensors on CMOS Chips |
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415 | (5) |
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415 | (2) |
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8.3.2 a-Si: H sensor integration |
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417 | (1) |
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8.3.3 Performance and limitations |
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418 | (2) |
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420 | (1) |
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421 | (4) |
| Index |
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425 | |