This revised and expanded reference-text examines all important aspects of integrated circuit (IC) design, fabrication, assembly, and test processes as they relate to quality and reliability providing a complete treatment of the causes of error in ICs, showing how they alter the finished product, and how to prevent their occurrence. This edition is updated and reorganized to reflect the changes that have taken place and add to the original baseline and tool set established in the first edition. Annotation copyright Book News, Inc. Portland, Or.
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
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