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E-raamat: MEMS Cost Analysis: From Laboratory to Industry [Taylor & Francis e-raamat]

Edited by (Imperial College, London, UK)
  • Formaat: 306 pages, 3 Illustrations, color; 184 Illustrations, black and white
  • Ilmumisaeg: 09-Jun-2014
  • Kirjastus: Pan Stanford Publishing Pte Ltd
  • ISBN-13: 9780429073779
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  • Taylor & Francis e-raamat
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MEMS Cost Analysis: From Laboratory to IndustrySuurem pilt
  • Formaat: 306 pages, 3 Illustrations, color; 184 Illustrations, black and white
  • Ilmumisaeg: 09-Jun-2014
  • Kirjastus: Pan Stanford Publishing Pte Ltd
  • ISBN-13: 9780429073779
Teised raamatud teemal:
Taylor & Francis e-raamatudRohkem infot Taylor & Francis e-raamatute kohta
Raamatu kodulehekülg: https://www.taylorfrancis.com/books/9780429073779

This volume demonstrates show cost analysis can be adapted to MEMS, taking into account the wide range of processes and equipment, the major differences with the established semiconductor industry, and the presence of both large-scale, product-orientated manufacturers and small- and medium-scale foundries. The content examines the processes and equipment sufficiently for the reader to appreciate how costs arise. It examines representative costs are examined in sufficient detail and accuracy for specific equipment, processes, products, or foundries to show how financial models can be introduced to estimate the cost and price for a MEMS product.

Preface xi
Acknowledgements xv
1 The World of MEMS 1(12)
1.1 Introduction
1(12)
2 Basic Fabrication Processes 13(18)
2.1 Introduction
13(2)
2.2 Lithography, Masks and Reticles
15(4)
2.3 Deposition and Etching
19(1)
2.4 The Sacrificial Layer
20(3)
2.5 Number of Dies per Wafer
23(6)
2.6 Clean Rooms
29(2)
3 Surface Micromachining 31(42)
3.1 Introduction
31(1)
3.2 Optical Mask Aligner
32(4)
3.3 Optical Wafer Stepper
36(5)
3.4 Low-Pressure Chemical Vapour Deposition
41(3)
3.5 Plasma-Enhanced Chemical Vapour Deposition
44(2)
3.6 Thermal Oxide Growth
46(5)
3.7 DC and RF Sputter Deposition
51(3)
3.8 Wet Etching
54(3)
3.9 Reactive-Ion Etching
57(4)
3.10 Chemical Mechanical Polishing
61(2)
3.11 Electron-Beam Pattern Generation
63(6)
3.12 Surface Microengineering Equipment Summary
69(4)
4 High-Aspect-Ratio Micromachining 73(42)
4.1 Introduction
73(4)
4.2 Deep Reactive-Ion Etching
77(5)
4.3 Excimer Laser Ablation
82(3)
4.4 X-Ray LIGA
85(6)
4.5 UV LIGA
91(3)
4.6 Bulk Micromachining
94(3)
4.7 Wafer Bonding
97(3)
4.8 Electrodeposition
100(4)
4.9 Critical-Point-Drying
104(3)
4.10 Injection Moulding
107(2)
4.11 High-Aspect-Ratio Equipment Summary
109(6)
5 MEMS Testing 115(10)
5.1 Introduction
115(1)
5.2 Testing of Semiconductors
116(4)
5.3 Testing of MEMS
120(5)
6 MEMS Packaging 125(22)
6.1 Introduction
125(2)
6.2 Packages
127(4)
6.3 Dicing
131(3)
6.4 Die Attach
134(2)
6.5 Wire Bonding
136(4)
6.6 Lid Seal
140(1)
6.7 Single- and Multi-Die Packaging
141(2)
6.8 MEMS Packaging Summary
143(4)
7 Clean Rooms, Buildings and Plant 147(18)
7.1 Introduction
147(3)
7.2 Clean Rooms and Buildings for Integrated Circuits
150(6)
7.3 Clean Rooms and Buildings for a MEMS Foundry
156(9)
8 The MEMSCOST Spreadsheet 165(32)
8.1 Introduction
165(1)
8.2 Basic Structure of the MEMSCOST Spreadsheet
166(1)
8.3 Master Set-Up
167(3)
8.4 Process Libraries
170(3)
8.5 Fabrication Machine Simulators
173(1)
8.6 Test and Packaging Machine Simulators
174(5)
8.7 CMOS/BiCMOS Simulation
179(7)
8.8 Financial Data
186(1)
8.9 Wafer and Die Calculations
187(1)
8.10 MEMSCOST Reports
188(2)
8.11 Unit Costs
190(7)
9 Product Costs: Accelerometers 197(28)
9.1 Introduction
197(8)
9.2 Costs for Die Fabrication
205(4)
9.3 Revenue Estimates
209(6)
9.4 Cost Comparison for Testing Regimes
215(3)
9.5 Cost Comparison between Single- and Multi-Die Assemblies
218(3)
9.6 Sensitivity of Costs to Manufacturing Parameters
221(4)
10 Product Costs: Microphones 225(22)
10.1 Introduction
225(6)
10.2 Costs for Die Fabrication
231(4)
10.3 Revenue Estimates
235(5)
10.4 Cost Comparisons for Testing Regimes
240(1)
10.5 Cost Comparison between Single- and Multi-Die Assembly
241(2)
10.6 Sensitivity to Manufacturing Costs
243(4)
11 MEMS Foundries 247(16)
11.1 Introduction
247(1)
11.2 MEMS Foundries
248(1)
11.3 Multi-Product Use of Processes and Equipment
249(1)
11.4 MEMS Foundry Lightly Loaded
250(2)
11.5 Multi-Project Wafers
252(11)
12 Financial Reporting and Analysis 263(14)
12.1 Introduction
263(1)
12.2 Key Financial Statements
263(1)
12.3 Business Case
264(1)
12.3.1 Product Specification
265(1)
12.3.2 Investment
265(1)
12.3.3 Capital Investment
266(1)
12.3.4 Start-Up Expenses
266(1)
12.3.5 Production
267(2)
12.3.6 Cash Flow
269(2)
12.4 Depreciation
271(2)
12.5 Profit, Profit Margin and Markup
273(1)
12.6 Total Cost of Ownership
273(1)
12.7 Return on Investment
274(1)
12.8 Earnings per Share
275(2)
13 Conclusions 277(6)
Index 283
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