This volume features coverage of new developments in and applications relating to generation and removal of heat within semiconductor devices, and measurement of junction temperatures under various application and environmental conditions.
Welcome to Semi-Therm XIII ix(2) Overview of Components, Packaging, & Manufacturing Technology Society of the IEEE xi(4) Short Course - Experimental Methods in Air Cooling of Electronics xv Robert J. Moffatt Stanford University Alfonso Ortega University of Arizona
1. COMPUTATIONAL AND ANALYTICAL MODELING I 1(48) Chair: Gary Kromann, Motorola, Inc. Thermal Sub-Modeling of the Wirebonded Plastic Ball Grid Array Package 1(9) Zane Johnson Koneru Ramakrishna Bennett Joiner Mike Eyman Motorola, Inc. Issues in Validating Package Compact Thermal Models For Natural Convection Cooled Electronic Systems 10(14) V. H. Adams Y. Joshi University of Maryland D. L. Blackburn D. W. Berning NIST Evaluation of Isothermal and Isoflux Natural Convection Coefficient Correlations for Utilization in Electronic Package Level Thermal Analysis 24(8) Bret A. Zahn Roger Paul Stout Motorola, Inc. Recent Achievements in the Thermal Characterization of Electronic Devices By Means of Boundary Condition Independent Compact Models 32(8) H. Vinke Philips Centre for Manufacturing Technology C. J. M. Lasance Philips Research Laboratories Thermal Characterization of Electronic Parts with Compact Models: Interpretation, Application and the Need for a Paradigm Shift 40(9) Clemens J. M. Lasance Philips Research Laboratories
2. THERMAL MANAGEMENT I 49(43) Chair: Dan Rodkey, Delco Electronics Corporation High Power Multichip Modules Employing the Planar Embedding Technique and Microchannel Water Heat Sinks 49(8) R. Hahn A. Kamp A. Ginolas M. Schmidt J. Wolf V. Glaw M. Topper O. Ehrmann H. Reichl Technical University of Berlin Thermal Modeling of Grease-Type Interface Material in PPGA Application 57(7) Chia-Pin Chiu Gary Solbrekken Yoke D. Chung Intel Corporation Hinged Heat Pipes for Cooling Notebook PCs 64(9) Masataka Mochizuki Yuji Saito Kazuhiko Goto Thang Nguyen Fujikura Ltd. Phong Ho Monica Malcolm Michael P. Morando Fujikura America, Inc. EVENING TUTORIAL Final Report to SEMITHERM XIII on the European-Funded Project DELPHI - The Development of Libraries and Physical Models for an Integrated Design Environment 73(19) H. I. Rosten J. D. Parry Flomerics Limited, UK C. J. M. Lasance H. Vinke Philips Research and Philips CFT, Netherlands W. Temmerman W. Nelemans Alcatel Bell, Belgium Y. Assouad T. Gautier Thomson CSF, France O. Slattery C. Cahill M. OFlattery NMRC, Ireland C. Lacaze P. Zemlianoy Alcatel Espace, France
3. THERMAL MANAGEMENT II 92(50) Chair: Michael Boyle, University of Maine Multiobjective Optimization of Component Placement on Planar Printed Wiring Boards 92(14) Nestor V. Queipo Guy F. Gil Universidad del Zulia Thermally Constrained Placement of Smart-Power ICs and Multi-Chip Modules 106(6) K. Lampaert G. Gielen W. Sansen Katholieke Universiteit Leuven Thermal Analysis of a Chip On Board (COB) 112(7) J. De Moerloose W. Temmerman Alcatel Telecom Organic PGA Packaging - A Performance Comparison with Ceramic PGA 119(12) Ram Viswanath Chia-Pin Chiu Intel Corporation Advanced Cooling Techniques Comparison for Airborne Electronic Circuits 131(11) Yannick Assouad Michel Caplot Thierry Gautier Thomson-CSF Radars & Contre-Mesures
4. HEAT SINK MODELING AND CHARACTERIZATION 142(56) Chair: Bennett Joiner, Motorola, Inc. Surface Mount Technology Heat Sinks For D(2)PAK and D(3)PAK Power Semiconductors 142(7) E. G. Flynn C. N. Johnston S. Lee Aavid Thermal Technologies, Inc. An Experimental Study of Forced Convection Heat Transfer From In-Line Pin Fin Arrays: 149(9) Vinod K. Maudgal Philips Technologies J. E. Sunderland University of Massachusetts Characterization of Longitudinal Fin Heat Sink Thermal Performance and Flow Bypass Effects Through CFD Methods 158(7) Adam V. Barrett Thermalloy Inc. Izundu F. Obinelo Maya Heat Transfer Technologies, Ltd. Compact Air-Cooled Heat Sinks for Power Packages 165(13) A. Aranyosi L. Bolle H. Buyse Universite Catholique de Louvain SIGNIFICANT CONTRIBUTOR THERMAL AWARD WINNER 178(20) Avram Bar-Cohen - Biography 178(2) Thermal Characterization of Chip Packages - Evolutionary Development of Compact Models 180(18) Avram Bar-Cohen University of Minnesota William B. Kkrueger Rosemount Inc.
5. MEASUREMENT METHODS AND APPLICATIONS 198(26) Chair: John Sofia, ANATECH Comparison of Diodes and Resistors for Measuring Chip Temperature During Thermal Characterization of Electronic Packages Using Thermal Test Chips 198(12) Alan Claassen H. Shaukatullah IBM Corporation Thermal Testing Methods to Increase System Reliability 210(8) V. Szekely M. Rencz Technical University of Budapest B. Courtois TIMA Transient Thermal Study of Laser Diodes 218(6) Chin C. Lee Jae W. Lee David H. Chien University of California, Irvine Robert Shih Alpha Photonics
6. COMPUTATIONAL AND ANALYTICAL MODELING II 224(33) Chair: Darvin Edwards, Texas Instruments Pressure Drop and Heat Transfer in an Isothermal Channel with Impinging Flow 224(7) Catharina R. Biber Wakefield Engineering, Inc. Design of Circular Heat Spreaders on Semi-Infinite Heat Sinks in Microelectronics Device Applications 231(7) P. Hui H. S. Tan Nanyang Technological University Y. S. Lye JVC Electronics Singapore Pte. Ltd. Pressure Loss Modeling for Surface Mounted, Cuboid-Shaped Packages in Channel Flow 238(9) P. Teertstra M. M. Yovanovich J. R. Culham University of Waterloo Thermal Management in PowerPC Microprocessor Multichip Modules Applications 247(10) Tsorng-Dih Yuan IBM Microelectronics Division Past Proceedings and Other Publications 257
