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3D Imaging Technologies and Deep Learning: Proceedings of the 3DIT-MSP&DL 2024 [Kõva köide]

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  • Formaat: Hardback, 298 pages, kõrgus x laius: 235x155 mm, 80 Illustrations, color; 13 Illustrations, black and white; X, 298 p. 93 illus., 80 illus. in color., 1 Hardback
  • Sari: Smart Innovation, Systems and Technologies 120
  • Ilmumisaeg: 06-Sep-2025
  • Kirjastus: Springer Nature Switzerland AG
  • ISBN-10: 9819652480
  • ISBN-13: 9789819652488
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  • Formaat: Hardback, 298 pages, kõrgus x laius: 235x155 mm, 80 Illustrations, color; 13 Illustrations, black and white; X, 298 p. 93 illus., 80 illus. in color., 1 Hardback
  • Sari: Smart Innovation, Systems and Technologies 120
  • Ilmumisaeg: 06-Sep-2025
  • Kirjastus: Springer Nature Switzerland AG
  • ISBN-10: 9819652480
  • ISBN-13: 9789819652488

This book presents high-quality research in the field of 3D imaging technology. The sixth edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL 2024) continues the good traditions already established by the first five editions of the conference to provide a wide scientific forum for researchers, academia, and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in two volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms, and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.

Chapter 1: Protection and Inheritance of Intangible Cultural Heritage
Based on Virtual Reality Technology - Taking Dongguan as an Example.-Chapter
2: On the Application of Virtual Reality Technology in Digital Services of
College Libraries.-Chapter 3: Research on User Experience Oriented to Digital
Exhibition and Presentation Narratives in Museums.-
Chapter 4: Research on User Experience Design in Virtual Museums under the
Concept of Interaction Design.-Chapter 5: Design of an Immersive Museum
Navigation APP in the Context of Audiovisual Integration.-Chapter 6: Soil
Nutrient Dynamic Monitoring using Hyperspectral Imaging and Artificial
Intelligence.-Chapter 7: Research on the Application of VR and Deep Learning
in Plant Landscape Design.-Chapter 8: Post-processing and Visual Effect
Optimization of Digital Films in the Information Technology Context.-Chapter
9: Optimization and Application of 3D Point Cloud Deep Learning Algorithm.-
Chapter 10: Optimization of 3D Model Defect Detection Algorithm Based on Deep
Learning.-Chapter 11: Data Recognition and Scoring Path in English Oral
Training Platform Based on Deep Learning Model.-Chapter 12: Sentiment
Analysis Combining Large Models and Deep Learning: Multi-Source Data Fusion
from Text to Speech.-Chapter 13: English Speech Distortion Detection and
Repair Based on Deep Learning.-Chapter 14: Design of a Micro-Landmark
Recognition and Intelligent Navigation System Based on Immersive Virtual
Reality Technology.-Chapter 15: A Framework for Human Skeleton Keypoint
Detection in Low-Light Environments Based on Deep Learning.-Chapter 16:
Application and Optimization in Ship Inspection and Intelligent
Maintenance.-Chapter 17: CVI-LayoutXLM: Enhanced Multimodal Resume
Information Extraction Model.-Chapter 18: Research on Personal Credit Fault
Prediction Method Based on Improved Logistic Regression Model.-Chapter 19:
Remote Sensing Image Semantic Segmentation Prediction and Enhancement System
Based on Deep Learning.-Chapter 20: Analysis of Chinese Learners' Behavioral
Patterns and Teaching Applications Based on Data Mining.-Chapter 21:
Detection of Chemical Pollutants in Water and Ecological Risk Assessment
based on ResNet Convolutional Neural Network.-Chapter 22: Water Conservancy
Engineering Quality Monitoring and Early Warning System Based on BP Neural
Network.-Chapter 23: Construction of UHPC Compressive Strength Prediction
System Based on GA-BP Neural Network.-Chapter 24: Deep Learning-Based Feature
Extraction and Analysis of 3D Models.-Chapter 25: Optimization of 3D Image
Deep Learning Super-Resolution Algorithm.
Professor Lakhmi C. Jain, PhD, Dr H.C., ME, BE (Hons), Fellow (Engineers Australia), is with the Liverpool Hope University and the University of Arad. He was formerly with the University of Technology Sydney, the University of Canberra and Bournemouth University. Professor Jain founded the KES International for providing a professional community the opportunities for publications, knowledge exchange, cooperation and teaming. Involving around 5,000 researchers drawn from universities and companies world-wide, KES facilitates international cooperation and generate synergy in teaching and research. KES regularly provides networking opportunities for professional community through one of the largest conferences of its kind in the area of KES.





 





Roumiana Kountcheva got her M.Sc. and PhD at the Technical University of Sofia, Bulgaria and in 1992 she got the title Senior Researcher. At present, she is the Vice president of TK Engineering, Sofia. She had postgraduate trainings in Fujitsu and Fanuc, Japan. Her main scientific interests are in image processing, image compression, digital watermarking, pattern recognition, image tensor representation, neural networks, CNC and programmable controllers. She has more than 200 publications and 5 international patents (EU and USA). R. Kountcheva was the plenary speaker at 25 international scientific conferences and scientific events. She edited several books published in Springer SIST series and is a co-editor of Special issues for Symmetry MDPI. She is a member of international organizations: Bulgarian Association for Pattern Recognition, International Research Institute for Economics and Management (IRIEM), the Institute of Data Science and Artificial Intelligence (IDSAI), and is a Honorary Member  of the Honorable Editorial Board of the nonprofit peer reviewed open access IJBST Journal Group. 





 





Prof. Srikanta Patnaik is presently working as director of Interscience Institute of Management & Technology, Bhubaneswar, India. He has received his Ph. D. (Engineering) on Computational Intelligence from Jadavpur University, India in 1999. He has  supervised 32 Ph. D. Theses and more than 60 Master theses in the area of Computational Intelligence, Soft Computing Applications and Re-Engineering. Dr. Patnaik has published more than 100 research papers in international journals and conference proceedings. He is author of 3 text books and more than 100 edited volumes and few invited book chapters, published by leading international publisher like IEEE, ACM, Elsevier, Springer-Verlag, Kluwer Academic, SPIE, IOS Press and others. Dr. Patnaik is the Editor-in-Chief of International Journal of Information and Communication Technology and International Journal of Computational Vision and Robotics published by Inderscience Publishing House, England and also Editor-in-chief of Book Series on Modeling and Optimization in Science and Technology published by Springer, Germany. He is the Editor of Journal of Information and Communication Convergence Engineering, published by Korean Institute of Information and Communication Convergence Engineering. Prof. Patnaik is a Guest Professor to Hunan University of Finance and Economics, Changsha and Kunming University of Science and Technology, Kunming, China and visiting professors to some of the B-Schools  of Europe and South East Asia. He is a member of Institute of Electrical and Electronics Engineering (IEEE) and Association for Computing Machinery (ACM). He is also Fellow of IETE, Life Member of ISTE, and CSI. Dr. Patnaik has visited various countries such as Japan, China, Hong Kong, Singapore, Indonesia, Iran, Malaysia, Philippines, South Korea, United Arab Emirates, Morocco, Algeria, Thailand and Vietnam for delivering Key note addresses at various conferences and symposiums.