Muutke küpsiste eelistusi

Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators 2010 ed. [Pehme köide]

Edited by , Edited by , Edited by
Teised raamatud teemal:
  • Pehme köide
  • Hind: 187,67 €*
  • * hind on lõplik, st. muud allahindlused enam ei rakendu
  • Tavahind: 220,79 €
  • Säästad 15%
  • Raamatu kohalejõudmiseks kirjastusest kulub orienteeruvalt 2-4 nädalat
  • Kogus:
  • Lisa ostukorvi
  • Tasuta tarne
  • Tellimisaeg 2-4 nädalat
  • Lisa soovinimekirja
Teised raamatud teemal:
A NATO Advanced Research Workshop (ARW) entitled Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific issues that pertain to the use of micro- and nano-electromechanical systems (MEMS and NEMS), devices and technologies in next generation commercial and defen- related applications. Micro- and nano-electromechanical systems represent rather broad and diverse technological areas, such as optical systems (micromirrors, waveguides, optical sensors, integrated subsystems), life sciences and lab equipment (micropumps, membranes, lab-on-chip, membranes, microfluidics), sensors (bio-sensors, chemical sensors, gas-phase sensors, sensors integrated with electronics) and RF applications for signal transmission (variable capacitors, tunable filters and antennas, switches, resonators). From a scientific viewpoint, this is a very multi-disciplinary field, including micro- and nano-mechanics (such as stresses in structural materials), electronic effects (e. g. charge transfer), general electrostatics, materials science, surface chemistry, interface science, (nano)tribology, and optics. It is obvious that in order to overcome the problems surrounding next-generation MEMS/NEMS devices and applications it is necessary to tackle them from different angles: theoreticians need to speak with mechanical engineers, and device engineers and modelers to listen to surface physicists. It was therefore one of the main objectives of the workshop to bring together a multidisciplinary team of distinguished researchers.
Preface ix
MEMS/NEMS TECHNOLOGIES AND APPLICATIONS
History of Early Research on MEMS in Russia (U.S.S.R.)
3(14)
V. Vaganov
Challenges of Complete CMOS/MEMS Systems Integration
17(14)
V. Vaganov
MEMS for Practical Applications
31(10)
M. Esashi
Nanochip: A MEMS-Based Ultra-High Data Density memory Device
41(26)
N. Belov
D. Adams
P. Ascanio
T.-K. Chou
J. Heck
B. Kim
G. Knight
Q. Ma
J.-S. Park
V. Rao
R. Stark
G. Tchelepi
Low Cost Silicon Coriolis' Gyroscope Paves the way to Consumer IMU
67(8)
B. Vigna
F. Pasolini
R. De Nuccio
M. Capovilla
L. Prandi
F. Biganzoli
Microwave and Millimetre Wave Devices Based on Micromachining of III-V Semiconductors
75(14)
A. Muller
D. Neculoiu
G. Konstantinidis
T. Vaha-Heikila
Monocrystalline-Silicon Microwave MEMS Devices
89(12)
J. Oberhammer
M. Sterner
N. Somjit
Three-Dimensional Photonic Crystals Based on Opal-Semiconductor and Opal-Metal Nanocomposites
101(16)
V. G. Golubev
MEMS DEVICE AND RELIABILITY PHYSICS
Pull-in Dynamics of Electrostatically Actuated Bistable Micro Beams
117(12)
S. Krylov
N. Dick
Path Following and Numerical Continuation Methods for Non-Linear MEMS and NEMS
129(12)
P. G. Steeneken
J. Stulemeijer
The Impact of Dielectric Material and Temperature on Dielectric Charging in RF MEMS Capacitive Switches
141(16)
G. Papaioannou
ADVANCED PROCESSES AND MATERIALS
Development of DRIE for the Next Generation of MEMS Devices
157(10)
H. Ashraf
J. Hopkins
L. M. Lea
Low-Temperature Processes for MEMS Device Fabrication
167(12)
J. Kiihamaki
H. Kattelus
M. Blomberg
R. Puurunen
M. Laamanen
P. Pekko
J. Saarilahti
H. Ritala
A. Rissanen
High-Temperature Stable Au-Sn and Cu-Sn Interconnects for 3D Stacked Applications
179(12)
N. Hoivik
H. Liu
K. Wang
G. Salomonsen
K. Aasmundtveit
3D Integration of MEMS and IC: Design, Technology and Simulations
191(14)
M.M.V. Taklo
K. Schjolberg-Henriksen
N. Lietaer
J. Prainsack
A. Elfving
J. Weber
M. Klein
P. Schneider
S. Reitz
Low-Frequency Electronic Noise in the Back-Gated and Top-Gated Graphene Devices
205(10)
G. Liu
Q. Shao
A.A. Balandin
W. Tillmann
M. Shur
S. Rumyantsev
Modeling of Dry Etching in Production of MEMS
215(10)
A. Rusakov
P. Bystrov
A. Knizhnik
B. Potapkin
XRD and Raman Study of Low Temperature AIGaAs/GaAs(100) Heterostructures
225(12)
P. Seredin
A. Glotov
E. Domashevskaya
I. Arsentyev
D. Vinokurov
A. Stankevich
I. Tarasov
Internal Stresses in Martensite Formation in Copper Based Shape Memory Alloys
237(12)
O. Adiguzel
SENSORS
Smart Sensors: Advantages and Pitfalls
249(12)
P.J. French
Vertically Integrated MEMS SOI Composite Porous Silicon-Crystalline Silicon Cantilever-Array Sensors: Concept for Continuous Sensing of Explosives and Warfare Agents
261(14)
S. Stolyarova
A. Shemesh
O. Aharon
O. Cohen
L. Gal
Y. Eichen
Y. Nemirovsky
Integration of Diverse Biological Materials in Micro/Nano Devices
275(12)
R. Ghodssi
P. Dykstra
M. Meyer
S. Koev
K. Gerasopoulos
X. Luo
G. Rubloff
W. Bentley
G. Payne
J. Culver
Force Sensing Optimization and Applications
287(12)
J.C. Doll
S.-J. Park
A.J. Rastegar
N. Harjee
J.R. Mallon Jr.
G.C. Hill
A.A. Barlian
B.L. Pruitt
Using Parametric Resonance to Improve Micro Gyrsocope Robustness
299(12)
L. Oropeza-Ramos
C.B. Burgner
K.L. Turner
Subject Index 311(2)
Author Index 313