| Sponsors |
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v | |
| Committees and Members |
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vi | |
| Preface |
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ix | |
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Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone |
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1 | (6) |
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Study on the Subsurface Damage of Single Crystal MgO Substrates |
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7 | (6) |
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Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer |
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13 | (5) |
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Comparative Study on the Materials Removal Mechanism of Ceramics and Steels |
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18 | (6) |
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Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters |
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24 | (6) |
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Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool |
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30 | (6) |
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Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers |
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36 | (6) |
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Fractal Analysis of Self-Sharpening Phenomenon in cBN Grinding |
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42 | (6) |
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Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model |
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48 | (7) |
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II. Grinding Systems and Tools |
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Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB |
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55 | (6) |
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Experimental Trial of Fullerene Wheel Fabrication |
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61 | (6) |
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Research of Ultrahigh Speed Grinding Spindle System Based on Squeeze Film Damping Technology |
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67 | (5) |
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Development of CNT-Coated Diamond Grains Using Self-Assembly Techniques for Improving Electroplated Diamond Tools |
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72 | (5) |
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Proposal of Pulverization Method Based on Grinding Process in Order to Recycle FRP Waste |
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77 | (6) |
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III. Measurement and Modeling |
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Error Analysis and Robust Position Measurement for Vertex of a Small Polyhedron |
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83 | (7) |
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Grinding Burn and Chatter Classification Using Genetic Programming |
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90 | (6) |
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Control of Nano-Topography on an Axisymmetric Ground Surface |
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96 | (6) |
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Measurement of High-NA Axisymmetric Aspherical Surface with Continuous Interference Method |
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102 | (6) |
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Observation of Grinding Wheel Wear Patterns by Means of a 3-Dimensional Digital Measuring Method |
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108 | (6) |
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Numerical Analysis for Thermal Deformation of Workpiece in Cylindrical Plunge Grinding |
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114 | (6) |
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Fuzzy Rules for Surface Roughness of Ground Steels |
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120 | (6) |
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Geometrical Simulation of Surface Finish Improvement in Helical Scan Grinding Method by Means of 3D-CAD Model |
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126 | (6) |
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Planing of Cobalt-Free Tungsten Carbide Using a Diamond Tool - Cutting Temperature and Tool Wear |
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132 | (6) |
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Cutting Temperature Measurement in Turning with Actively Driven Rotary Tool |
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138 | (6) |
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Coolant Effects on Tool Wear in Machining Single-Crystal Silicon with Diamond Tools |
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144 | (7) |
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Machinability Investigation of Reaction-Bonded Silicon Carbide by Single-Point Diamond Turning |
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151 | (6) |
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High Speed Cutting of Titanium Alloy with PCD Tools |
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157 | (6) |
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Development of DLC Coated Tool for Cutting of Aluminum Alloy - Influence of Deposition Condition on Cutting Characteristic --- |
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163 | (6) |
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Observations on Orthogonal Cutting Processes - Effect of Friction between Tool and Work Material |
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169 | (6) |
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Development of A New Cutting Fluid Supply System for Near Dry Machining Process |
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175 | (6) |
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V. Field-Assisted Machining |
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Study on the Surface Quality of Optical Glass in Ultrasonic-Magnetorheological Compound Finishing |
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181 | (6) |
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Quartz Wafer Machining Using MCF (Magnetic Compound Fluid) Polishing Liquid Frozen with Liquid Nitrogen |
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187 | (6) |
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Simulation and Experimental Analysis of Electromagnetic Inductor for Magnetic Abrasive Finishing |
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193 | (6) |
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The Research of NC Magnetic Abrasive Finishing for Mould Parting Surface |
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199 | (6) |
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VI. New Grinding Processes |
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Computer Aided Design and Grinding for Helical Drill Points |
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205 | (6) |
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A New CBN Crystal for Improved Grinding Performance in Vitrified Bonds |
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211 | (6) |
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Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film |
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217 | (6) |
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Fundamental Study on the Precision Abrasive Machining Using a Cavitation in Reversing Suction Flow |
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223 | (6) |
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Researches on Effect of Impact Micro-Damages in Contact Layer on Machinability in Quick-Point Grinding |
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229 | (6) |
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Study on Abrasive Geometry of Quick-Point Grinding |
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235 | (5) |
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Model-Based Compensation of Geometry-Errors when Grinding Material Compounds |
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240 | (6) |
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A New Type of Drill Grinder Based on the Special Universal Joint |
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246 | (6) |
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Simulation of Dynamic Performance for Hydro-Hybrid Spindle-Bearing System of Superhigh Speed Grinder |
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252 | (6) |
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Model Based Characterization of the Grinding Wheel Effective Topography |
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258 | (6) |
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VII. Vibration-Assisted Machining |
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Fabrication of High-Aspect Ratio Micro Holes on Hard Brittle Materials -Study on Electrorheological Fluid-Assisted Micro Ultrasonic Machining- |
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264 | (7) |
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Grinding of Soft Steel with Assistance of Ultrasonic Vibrations |
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271 | (6) |
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Ultrasonic Vibration-Assisted Cutting of Titanium Alloy |
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277 | (6) |
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Effects of Grain Size and Concentration of Grinding Wheel in Ultrasonically Assisted Grinding |
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283 | (6) |
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Electrochemical Finishing with an Electrode Vibrated with Biaxial Ultrasonic Transducer |
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289 | (6) |
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Synchronous Finish Processes Using Grinding and Ultrasonic Electrochemical Finishing on Hole-Wall Surface |
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295 | (7) |
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Development of a Three-Dimensional Tool Oscillation System for Finishing Metal Molds |
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302 | (6) |
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VIII. Fluids for Machining |
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Engineering a Next Generation Water-Based Grinding Fluid |
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308 | (6) |
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Evaluation of Bearing Grinding Fluids |
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314 | (6) |
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The Correlation and Spectrum Research on Cylindrical Surface Lapping Machined with Abrasive Jet Finishing Restricted by Grinding Wheel |
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320 | (6) |
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Application of a Floating Nozzle to Grinding Process Using an Edge of Grinding Wheel |
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326 | (6) |
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A Study on Airflow Field of Super-High Speed Pectination Grinding Wheel Based on PIV |
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332 | (6) |
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Actively Cooled and Activated Coolant for Grinding Brittle Materials |
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338 | (6) |
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Spatial Distribution of Cooling Mist for Precision Grinding |
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344 | (6) |
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A Truing Technique of Flattening Diamond Grains for Fabricating Microstructures with Fine Surfaces |
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350 | (6) |
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The Possibility of Dressless Restoration of Grindactivity in Dry Grinding of Carbon |
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356 | (6) |
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Virtual Truing and Dressing of Grinding Wheel |
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362 | (6) |
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Effects of Cutting Edge Truncation on Ultrasonically Assisted Grinding |
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368 | (7) |
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X. Abrasive Jet Machining |
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A Preliminary Study of the Erosion Process in Micro-Machining of Glasses with a Low Pressure Slurry Jet |
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375 | (6) |
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Hole Machining of Glass by Micro Abrasive Suspension Jets |
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381 | (6) |
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Simulation and Analysis of Abrasive Jet Machining with Wheel Restriction in Grinding |
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387 | (5) |
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Profit Optimization of Abrasive Blasting Systems |
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392 | (6) |
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Design of Double Nozzle Type Powder Jet Device Optimized for PJD |
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398 | (6) |
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XI. Non-Conventional Machining |
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Thermal Deformation of Base Sheet and Local Deformation Around Laser Cutting Edge |
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404 | (6) |
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Grinding Combination of Electrochemical Smoothing On SKH 51 Surface |
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410 | (7) |
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Fundamental Study on Influence of Surface Topography on Photocatalytic Reaction |
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417 | (7) |
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Fundamental Research on Generation of Nanostructure by Means of Local Anodic Oxidation |
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424 | (6) |
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An Investigation into Surface Roughness of EDM Using Soft Particles Suspension in Silicone Oil |
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430 | (6) |
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XII. Slicing and Edge Processing |
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Analysis on the Fracture Failure of Brazed Diamonds in Wire Sawing |
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436 | (6) |
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Effects of Thermal Deformation of Multi-Wire Saw's Wire Guides and Ingot on Slicing Accuracy |
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442 | (6) |
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Study on Glass Strength at High Speed Edge Rounding for LCD |
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448 | (5) |
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XIII. CMP and Semiconductor Processing |
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The Deformation Mechanism at Pop-In: Monocrystalline Silicon under Nanoindentation with a Berkovich Indenter |
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453 | (6) |
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Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW) |
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459 | (6) |
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Subsurface Structures of Monocrystalline Silicon Generated by Nanogrinding |
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465 | (4) |
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Complete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd:YAG Laser Irradiation |
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469 | (6) |
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Study on Adhesion Removal Model in CMP SiO2 ILD |
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475 | (6) |
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Study on the CMP Pad Life with its Mechanical Properties |
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481 | (6) |
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Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad |
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487 | (6) |
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A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing Condition |
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493 | (5) |
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Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization |
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498 | (6) |
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Achieving a Damage-Free Polishing of Mono-Crystalline Silicon |
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504 | (6) |
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Effect of Polishing Time and Pressure on Polishing Pad Performance |
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510 | (5) |
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Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives |
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515 | (6) |
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Scale Effect of Nano-Indentation of Silicon - A Molecular Dynamics Investigation |
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521 | (6) |
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| Author Index |
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527 | (4) |
| Keyword Index |
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531 | |
