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Advances in System-Integrated Intelligence: Proceedings of the 6th International Conference on System-Integrated Intelligence (SysInt 2022), September 7-9, 2022, Genova, Italy 1st ed. 2023 [Pehme köide]

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  • Formaat: Paperback / softback, 740 pages, kõrgus x laius: 235x155 mm, kaal: 1145 g, 264 Illustrations, color; 52 Illustrations, black and white; XX, 740 p. 316 illus., 264 illus. in color., 1 Paperback / softback
  • Sari: Lecture Notes in Networks and Systems 546
  • Ilmumisaeg: 05-Sep-2022
  • Kirjastus: Springer International Publishing AG
  • ISBN-10: 3031162803
  • ISBN-13: 9783031162800
  • Pehme köide
  • Hind: 95,02 €*
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  • Formaat: Paperback / softback, 740 pages, kõrgus x laius: 235x155 mm, kaal: 1145 g, 264 Illustrations, color; 52 Illustrations, black and white; XX, 740 p. 316 illus., 264 illus. in color., 1 Paperback / softback
  • Sari: Lecture Notes in Networks and Systems 546
  • Ilmumisaeg: 05-Sep-2022
  • Kirjastus: Springer International Publishing AG
  • ISBN-10: 3031162803
  • ISBN-13: 9783031162800
This book reports on cutting-edge research and developments focusing on  integrating intelligent functionalities into materials, components, systems and products. Gathering the proceedings of the 6th International Conference on System-Integrated Intelligence (SysInt 2022), held on September 7-9, in Genova, Italy, it offers a comprehensive, multidisciplinary and applied perspective on the state-of-the art and challenges in the field of intelligent, flexible and connected systems. The book covers advanced methods and applications relating to artificial, pervasive and ubiquitous intelligence, sensors, smart factory and logistics, structural health monitoring, as well as soft robotics, cognitive systems and human-machine interaction. Giving a special focus to artificial intelligence, it  extensively reports on methods and algorithms for data-driven modeling, and agent-based data processing and planning. It aims at inspiring and fostering collaboration between researchers and professionals from the different fields of  electrical, manufacturing and production engineering, and materials and computer sciences.