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1 | (24) |
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1 | (2) |
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Main Objectives of LoC Systems |
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1 | (2) |
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From Macro to Micro Bioassays |
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3 | (6) |
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Micro-scale Liquid Handling |
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3 | (1) |
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Thermal Management in Microenvironment |
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4 | (1) |
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5 | (1) |
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5 | (3) |
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Advantages of Performing Bioassays in Microscale |
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8 | (1) |
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9 | (13) |
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10 | (2) |
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12 | (2) |
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14 | (2) |
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16 | (1) |
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17 | (1) |
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18 | (3) |
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21 | (1) |
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Objectives and Organization of Book |
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22 | (3) |
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Capacitive Sensing Electrodes |
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25 | (10) |
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On-Chip Microelectrode Configurations |
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25 | (4) |
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25 | (2) |
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27 | (1) |
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Sensitivity-Enhanced Passivated Electrodes |
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27 | (1) |
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Quasi Interdigitated Electrodes |
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27 | (1) |
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Gold Electrodes on CMOS Chip |
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28 | (1) |
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Microfluidic Channel Integrated Atop Sensing Electrodes |
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28 | (1) |
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Micromachining Gold Electrode on CMOS Chip |
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29 | (2) |
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Electrical Model of Sensing Electrodes |
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31 | (2) |
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33 | (2) |
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Capacitive Bio-interfaces |
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35 | (16) |
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Biochemical Capacitive Sensing Methods |
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36 | (9) |
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36 | (1) |
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Antibody---Antigen Recognition |
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37 | (1) |
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38 | (2) |
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40 | (1) |
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Bacteria Growth Monitoring |
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41 | (2) |
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Polyelectrolyte Monolayer |
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43 | (1) |
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Detection of Protein Conformation |
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44 | (1) |
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Design of Recognition Element: An Example for Continuous Glucose Monitoring |
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45 | (5) |
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Introduction to Glucokinase-Based Glucose Sensor |
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46 | (1) |
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Immobilization of Glucokinase on Gold Electrode |
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47 | (1) |
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48 | (2) |
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50 | (1) |
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Capacitive Interface Circuits for LoC Applications |
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51 | (40) |
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51 | (3) |
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51 | (1) |
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52 | (1) |
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On-Chip Sensing Electrodes |
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53 | (1) |
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53 | (1) |
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53 | (1) |
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54 | (6) |
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SC-Based Interface Circuit |
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54 | (1) |
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55 | (1) |
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Capacitive Inverter Amplifier |
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56 | (3) |
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59 | (1) |
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Core---CBCM Interface Circuit |
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60 | (19) |
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Principle of CBCM for Sensing Applications |
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60 | (1) |
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Two Transistors CBCM Sensor |
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61 | (3) |
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Opamp-Based Integrator Incorporated with CBCM Sensor |
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64 | (1) |
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Differential Current CBCM Techniques |
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65 | (1) |
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Current Mirror Integrated with CBCM Structure |
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66 | (13) |
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Core-CBCM ΣΔ Capacitive Sensor |
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79 | (7) |
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79 | (1) |
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Charge to Digital Converter |
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79 | (3) |
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82 | (1) |
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Circuit Level Simulation Results |
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83 | (1) |
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84 | (2) |
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Core-CBCM Capacitive Sensing System |
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86 | (4) |
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A System Level Realization |
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86 | (1) |
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87 | (3) |
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90 | (1) |
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Microfluidic Packaging Process |
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91 | (28) |
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Microfluidic Packaging Methods |
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92 | (3) |
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On-Chip Micromachining Procedures |
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92 | (1) |
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93 | (1) |
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Rapid Prototyping Techniques |
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94 | (1) |
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Direct-Write Microfabrication Process |
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95 | (10) |
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95 | (1) |
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96 | (2) |
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Direct-Write Microfluidic Fabrication Process |
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98 | (7) |
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Direct-Write Microfluidic Packaging Procedure |
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105 | (7) |
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Encapsulation of Bonding Pads and Wires |
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106 | (1) |
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106 | (4) |
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110 | (1) |
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110 | (1) |
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Ink Encapsulation and Filling Process |
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110 | (1) |
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Ink Removal and Analyte Injection |
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110 | (2) |
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Emerging Applications of DWFP |
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112 | (6) |
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112 | (2) |
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Direct-Write Heat Exchanger |
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114 | (1) |
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Optical Waveguide for Biosensing Applications |
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115 | (3) |
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118 | (1) |
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Current Technology and Future Works |
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119 | (8) |
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Conventional Impedometric and Capacitive Measurement Systems |
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119 | (3) |
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Handheld Impedance Measurement Systems |
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122 | (2) |
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Towards Fully Integrated Capacitive Sensing LoC |
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124 | (2) |
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124 | (1) |
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Capacitance Characterization |
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124 | (1) |
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Electrical Modeling of Biological Sample |
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125 | (1) |
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126 | (1) |
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126 | (1) |
References |
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127 | (16) |
Index |
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143 | |