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Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures 2010 ed. [Kõva köide]

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  • Formaat: Hardback, 284 pages, kõrgus x laius: 235x155 mm, kaal: 1310 g, XII, 284 p., 1 Hardback
  • Sari: Integrated Circuits and Systems
  • Ilmumisaeg: 10-Dec-2009
  • Kirjastus: Springer-Verlag New York Inc.
  • ISBN-10: 1441907831
  • ISBN-13: 9781441907837
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  • Formaat: Hardback, 284 pages, kõrgus x laius: 235x155 mm, kaal: 1310 g, XII, 284 p., 1 Hardback
  • Sari: Integrated Circuits and Systems
  • Ilmumisaeg: 10-Dec-2009
  • Kirjastus: Springer-Verlag New York Inc.
  • ISBN-10: 1441907831
  • ISBN-13: 9781441907837
"This book provides the reader with a complete understanding of why three dimensional IC design is a promising solution to continue performance scaling, the possible ways to do 3D integration (fabrication), the EDA challenges and solutions to facilitate designers to do 3D IC design, the architectural benefits of using 3D technology, and the design issues at the architecture level.

The work covers the background on 3D integration, fabrication options for 3D ICs, EDA flows and algorithms for 3D design, architecture level design techniques for 3D microarchitecture. The book includes an introduction on the background of 3D IC, a motivation that explains why the 3D IC is important and how it will trend, 3D process (fabrication) options, 3D EDA algorithms and tools (physical level and architectural level tools), 3D microarchitecture, including 3D FPGA, 3D single core/multi core processors, 3D Network-onchip designs."--pub. desc.

This book presents an overview of the field of 3D IC design. There is emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design.



This book provides the reader with a complete understanding of why three dimensional IC design is a promising solution to continue performance scaling, the possible ways to do 3D integration (fabrication), the EDA challenges and solutions to facilitate designers to do 3D IC design, the architectural benefits of using 3D technology, and the design issues at the architecture level.

The work covers the background on 3D integration, fabrication options for 3D ICs, EDA flows and algorithms for 3D design, architecture level design techniques for 3D microarchitecture. The book includes an introduction on the background of 3D IC, a motivation that explains why the 3D IC is important and how it will trend, 3D process (fabrication) options, 3D EDA algorithms and tools (physical level and architectural level tools), 3D microarchitecture, including 3D FPGA, 3D single core/multi core processors, 3D Network-onchip designs.

Introduction
1(14)
Kerry Bernstein
3D Process Technology Considerations
15(18)
Albert M. Young
Steven J. Koester
Thermal and Power Delivery Challenges in 3D ICs
33(30)
Pulkit Jain
Pingqiang Zhou
Chris H. Kim
Sachin S. Sapatnekar
Thermal-Aware 3D Floorplan
63(40)
Jason Cong
Yuchun Ma
Thermal-Aware 3D Placement
103(42)
Jason Cong
Guojie Luo
Thermal Via Insertion and Thermally Aware Routing in 3D ICs
145(16)
Sachin S. Sapatnekar
Three-Dimensional Microprocessor Design
161(28)
Gabriel H. Loh
Three-Dimensional Network-on-Chip Architecture
189(30)
Yuan Xie
Narayanan Vijaykrishnan
Chita Das
PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers
219(42)
Taeho Kgil
David Roberts
Trevor Mudge
System-Level 3DIC Cost Analysis and Design Exploration
261(20)
Xiangyu Dong
Yuan Xie
Index 281