| MONDAY, OCTOBER 26, 1999 |
|
| SESSION I - PLENARY |
|
|
Interconnect Limits on Gigascale Integration (Keynote) |
|
|
3 | (2) |
|
Electronic Packaging For Microwave Multichip Modules (Keynote) |
|
|
5 | (4) |
| SESSION II - SYSTEM DESIGN ISSUES I |
|
|
Challenges in the Packaging of an Eight Way Server (Invited) |
|
|
9 | (2) |
|
Physical Layer Design of a 1.6 GB/s DRAM Bus |
|
|
11 | (4) |
|
Implementation Considerations for RAMBUS™-based Systems |
|
|
15 | (6) |
| SESSION III - SYSTEM DESIGN ISSUES II |
|
|
Noise Verification Across 3 Levels of Packaging Hierarchy for the IBM G5/G6 Mainframes |
|
|
21 | (4) |
|
Noise Measurements on Power4 Test Chip |
|
|
25 | (4) |
|
Half-Conductive Coupling for Chip-to-Chip Connections |
|
|
29 | (4) |
|
RF Interconnect for Multi-Gbit/sec Board-Level Clock Distribution |
|
|
33 | (4) |
|
Operating Frequency Trends for High Performance Off-Chip Buses |
|
|
37 | (8) |
| SESSION IV - ON CHIP INTERCONNECTIONS |
|
|
On-Chip Wiring Design Challenges for GHz Operation (Invited) |
|
|
45 | (4) |
|
Reliability and Performance Tradeoffs in the Design of On-Chip Power Delivery and Interconnects (Invited) |
|
|
49 | (4) |
|
Impact of Cross-over Lines on Delay Time of Two Parallel Global Wires |
|
|
53 | (4) |
|
Asymptotically Zero Power Dissipation Gigahertz Clock Distribution Networks |
|
|
57 | (6) |
| SESSION V - MEASUREMENT |
|
|
Picosecond Time-Domain Photoconductive Sampling Method For Measuring Guided and Free-Space Pulse Propagation |
|
|
63 | (4) |
|
Limitations Due to Systematic Phase Errors on the Extraction of Loss Tangent From Micronsized Transmission Line Test Structures |
|
|
67 | (4) |
|
Parameter Extraction for Circuit Models of Electronic Packages Without Optimization |
|
|
71 | (4) |
|
Electrical Characterization of S/390 MCM Packages from S-Parameter Measurements below 3 GHz |
|
|
75 | (6) |
| SESSION VI - MODELING I |
|
|
Domain Decomposition Approach for Capacitance Computation of Non-orthogonal Interconnect Structures |
|
|
81 | (4) |
|
Improved Global Rational Approximation Macromodeling Alogrithm for Transient Simulation of Interconnects |
|
|
85 | (4) |
|
Application of Subspace Projection Approaches for Reduced-Order Modeling of Electromagnetic Systems |
|
|
89 | (6) |
| SESSION VII - OPEN FORUM (POSTERS) |
|
|
Numerical Analysis of Surface Waves on a Grounded Dielectric Plane Using the Finite Difference Time Domain Method |
|
|
95 | (4) |
|
Modeling the Effects of Non-Linear Materials in De-Coupling Components of Digital Systems |
|
|
99 | (4) |
|
Power Distribution Modeling and Decoupling of Multilayer Printed Circuit Board |
|
|
103 | (4) |
|
Electrical Performance of Buried Capacitors in Multi-layered PCBs |
|
|
107 | (4) |
|
Precise Chip and Package 3D Capacitance Simulations of Realistic Interconnects Using a General Purpose FEM-Tool |
|
|
111 | (4) |
|
RF Characterization of Low Cost MCM-D Substrates, Manufactured on Large Area Panels |
|
|
115 | (6) |
|
Validation of Integrated Capacitor-Via-Planes Model |
|
|
121 | (4) |
|
High Performance Socket Characterization Technique for Microprocessors |
|
|
125 | (4) |
|
Achieving 800 MT/s Performance with PGA370 Socket |
|
|
129 | (4) |
|
An Accurate and Complete Frequency Dependent Transmission Line Characterization Using S-Parameter Measurements |
|
|
133 | (4) |
|
Transmission Link Radiation: Localized Defect Contribution |
|
|
137 | (4) |
|
Power Plane Decoupling Strategy for High Speed Processor Boards |
|
|
141 | (6) |
| TUESDAY, OCTOBER 27, 1999 |
|
| SESSION VIII - POWER DISTRIBUTION |
|
|
Simultaneous Switching, Noise, and Reliability Analysis of VLSI Core Logic (Invited) |
|
|
147 | (2) |
|
Modeling and Transient Simulation of Planes in Electronic Packages for GHz Systems |
|
|
149 | (4) |
|
Accuracy Considerations of Power-Ground Plane Models |
|
|
153 | (4) |
|
Computation of the Frequency Response of Multiple Planes in Gigahertz Packages and Boards |
|
|
157 | (6) |
| SESSION IX - SSN |
|
|
Simultaneous Switch Noise and Power Plane Bounce for CMOS Technology (Invited) |
|
|
163 | (4) |
|
Modeling of Simultaneous Switching Output by Equivalent Source Impedance |
|
|
167 | (4) |
|
Off-Chip Delta-I Noise Modeling and Measurement Methodology |
|
|
171 | (4) |
|
Design and Performance Evaluation of Chip Capacitors on Microprocessor Packaging |
|
|
175 | (6) |
| SESSION X - TRANSMISSION LINE MODELING |
|
|
Characteristic Impedance of Microstrip on Silicon |
|
|
181 | (4) |
|
Equivalent Circuit Modeling of Single and Coupled On-Chip Interconnects on Lossy Silicon Substrate |
|
|
185 | (4) |
|
Enhanced Skin Effect for Partial Element Equivalent Circuit (PEEC) Models |
|
|
189 | (4) |
|
Study of Meander Line Delay in Circuit Boards |
|
|
193 | (6) |
| SESSION XI - EMISSIONS |
|
|
Radiated Emission from Pin-fin Heat Sink Mounted on an EBGA Package |
|
|
199 | (4) |
|
Methods to Reduce Radiation from Split Ground Plane Structures |
|
|
203 | (4) |
|
Distributed Effects of a Gap in Power/Ground Planes |
|
|
207 | (4) |
|
A Novel Time Domain Algorithm for Field Excited Lossy Transmission Lines |
|
|
211 | (6) |
| WEDNESDAY, OCTOBER 27, 1999 |
|
| SESSION XII - MICROWAVE/RF PACKAGING I |
|
|
An Integrated Environment for the Simulation of Electrical, Thermal and Electromagnetic Interactions in High-Performance Integrated Circuits (Invited) |
|
|
217 | (4) |
|
Toward a Novel Planar Circuit Compatible Silicon Micromachined Waveguide |
|
|
221 | (4) |
|
77GHz Band Surface Mountable Ceramic Package |
|
|
225 | (6) |
| SESSION XIII - MICROWA VE/RF PACKAGING II |
|
|
Design Rule Development for Microwave Flip Chip Applications |
|
|
231 | (4) |
|
High-Performance Silicon MMIC Interconnect for Millimeter Wave Wireless Communication |
|
|
235 | (4) |
|
Simulation of Embedded RF Circuits Using Macromodels and Synthesized Equivalent Circuits |
|
|
239 | (6) |
| SESSION XIV - MODELING II |
|
|
On the Chicken-and-Egg Problem of Determining the Effect of Crosstalk on Delay In Integrated Circuits (Invited) |
|
|
245 | (4) |
|
Laguerre-SVD Reduced Order Modeling |
|
|
249 | (4) |
|
Latency Insertion Method for the Fast Simulation of Interconnection Networks |
|
|
253 | (4) |
|
A Fast Simulation Method for Single and Coupled Lossy Lines with Frequency-Dependent Parameters Based on Triangle Impulse Responses |
|
|
257 | (4) |
|
Efficient and Accurate Extraction of Frequency-Dependent Resistance and Inductance Parameters of Interconnects |
|
|
261 | (4) |
| Author Index |
|
265 | |
