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Gallium Oxide: Materials Properties, Crystal Growth, and Devices 2020 ed. [Kõva köide]

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  • Formaat: Hardback, 764 pages, kõrgus x laius: 235x155 mm, kaal: 1346 g, 393 Illustrations, color; 80 Illustrations, black and white; XXVIII, 764 p. 473 illus., 393 illus. in color., 1 Hardback
  • Sari: Springer Series in Materials Science 293
  • Ilmumisaeg: 25-Apr-2020
  • Kirjastus: Springer Nature Switzerland AG
  • ISBN-10: 3030371522
  • ISBN-13: 9783030371524
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  • Formaat: Hardback, 764 pages, kõrgus x laius: 235x155 mm, kaal: 1346 g, 393 Illustrations, color; 80 Illustrations, black and white; XXVIII, 764 p. 473 illus., 393 illus. in color., 1 Hardback
  • Sari: Springer Series in Materials Science 293
  • Ilmumisaeg: 25-Apr-2020
  • Kirjastus: Springer Nature Switzerland AG
  • ISBN-10: 3030371522
  • ISBN-13: 9783030371524

This book provides comprehensive coverage of the new wide-bandgap semiconductor gallium oxide (Ga2O3). Ga2O3 has been attracting much attention due to its excellent materials properties. It features an extremely large bandgap of greater than 4.5 eV and availability of large-size, high-quality native substrates produced from melt-grown bulk single crystals. Ga2O3 is thus a rising star among ultra-wide-bandgap semiconductors and represents a key emerging research field for the worldwide semiconductor community.

Expert chapters cover physical properties, synthesis, and state-of-the-art applications, including materials properties, growth techniques of melt-grown bulk single crystals and epitaxial thin films, and many types of devices. The book is an essential resource for academic and industry readers who have an interest in, or plan to start, a new R&D project related to Ga2O3.


Preface.- 1. Introduction (20 pages): General materials properties
(polymorphs, bandgap, device application etc) (Roberto Fornari, Univ. of
Parma, Italy).- Part I: Bulk growth (40 pages).- 2. Czochralski (CZ)
(Zbigniew Galazka, IKZ Berlin, Germany).- 3. Edge-defined film-fed growth
(EFG) (Akito Kuramata, Tamura Corp., Japan).- 4. Vertical Bridgman (Keigo
Hoshikawa, Shinshu Univ., Japan).- 5. Wafer manufacturing (Akito Kuramata,
Tamura Corp., Japan).- Part II: Epitaxial growth (110 pages).- 6.
Plasma-assisted MBE (Growth kinetics) (Oliver Bierwagen, Paul Drude Institute
Berlin, Germany).- 7. Plasma-assisted MBE (Homoepitaxial and heterostructure
growth) (Jim Speck, UCSB, USA).- 8. Ozone MBE (Debdeep Jena, Cornell Univ.,
USA).- 9 Pulsed laser deposition (PLD) (Akira Ohtomo, Tokyo Institute of
Technology, Japan).- 10. Homoepitaxial growth of -Ga2O3 thin films on
-Ga2O3 substrates (Michele Baldini, IKZ Berlin, Germany).- 11.
Heteroepitaxial growth of -Ga2O3 on sapphire substrates (Roberto Fornari,
Univ. of Parma, Italy).- 12. Homoepitaxial growth of -Ga2O3 thin films on
-Ga2O3 substrates (Yoshinao Kumagai, Tokyo Univ. of Agriculture and
Technology, Japan).- 13. Heteroepitaxial growth of -Ga2O3 and -Ga2O3 on
sapphire substrates (Yuichi Oshima, NIMS, Japan).- 14. -Ga2O3 (Shizuo
Fujita, Kyoto Univ., Japan).- 15. -Ga2O3 (Hiroyuki Nishinaka, Kyoto
Institute of Technology, Japan).- 16. Low-pressure Chemical Vapor Deposition
(Hongping Zhao, Ohio State Univ., USA).- Part III: Materials properties (120
pages).- 17. Theoretical DFB calculation 1 (Chris G. Van de Walle, UCSB,
USA).- 18. Theoretical DFB calculation 2 (Joel Varley, Lawrence Livermore
National Laboratory, USA).- 19. Optical properties (Takeyoshi Onuma, Kogakuin
Univ., Japan).- 20. Phonon properties (Mathias Schubert, Univ. of Nebraska,
Lincoln, USA).- 21. Thermal properties (Tengfei Luo,Univ. of Notre Dame
and/or Debdeep Jena, Cornell Univ. USA).- 22. Structural properties (TEM,
X-ray topography) (Osamu Ueda, Kanazawa Institute of Technology and/or
Hirotaka Yamaguchi, AIST, Japan).- 23. Electrical properties (Electron
mobility and velocity) (Uttam Singisetti, Univ. at Buffalo, The State Univ.
of New York, USA).- 24. Electrical properties (Leakage current of EFG bulk)
(Makoto Kasu, Saga Univ., Japan).- 25. Annealing effects on electrical
properties (Takayoshi Oshima, Saga Univ., Japan).- 26. Vacancy defects by
positron annihilation spectroscopy (Filip Tuomisto, Helsinki University of
Technology, Finland).- 27. Deep-level traps (Steve Ringel, Ohio State Univ.,
USA).- 28. Scintillation properties (Takayuki Yanagida, Nara Institute of
Science and Technology, Japan).-  Part IV: Devices (110 pages).- 29.
Transistors for wireless applications (Gregg Jessen, Air Force Research Lab.,
USA).- 30. Transistors for power and radiation-hard electronics (Man Hoi
Wong, NICT, Japan).- 31. (AlGa)2O3/Ga2O3 HEMT (Siddharth Rajan, Ohio State
Univ., USA).- 32. Nano-membrane Ga2O3 FET (Peide Ye, Purdue Univ., USA).- 33,
Amorphous Ga2O3 TFT (Junghwan Kim, Tokyo Institute of Technology,
Japan).- 34. Vertical Schottky barrier diodes on native substrates (Masataka
Higashiwaki, NICT, Japan).- 35. Free-standing -Ga2O3 Schottky barrier diodes
(T. Shinohe, FLOSFIA, Japan).- 36. Schottky and n-Ga2O3/p-oxide semiconductor
hetero bipolar diodes (Marius Grundmann, Univ. of Leipzig, Germany).- 37. UV
photodiodes (Dong-Sing Wuu, National Chung Hsing Univ., Taiwan).- 38.
High-power InGaN LEDs on Ga2O3 substrates (Akito Kuramata, Tamura Corp.,
Japan).- 40. Image sensor (Keitada Mineo, Japan Broadcasting Corp.,
Japan).-  Index.