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High-Performance Computing and Artificial Intelligence in Process Engineering [Kõva köide]

Edited by (Sun Yat-sen University (China)), Edited by (California State Polytechnic University (United States))
  • Formaat: Hardback, kõrgus x laius x paksus: 254x178x19 mm, kaal: 753 g, With figures in colour and black and white
  • Sari: IOP ebooks
  • Ilmumisaeg: 04-Apr-2025
  • Kirjastus: Institute of Physics Publishing
  • ISBN-10: 0750361727
  • ISBN-13: 9780750361729
Teised raamatud teemal:
High-Performance Computing and Artificial Intelligence in Process EngineeringSuurem pilt
  • Formaat: Hardback, kõrgus x laius x paksus: 254x178x19 mm, kaal: 753 g, With figures in colour and black and white
  • Sari: IOP ebooks
  • Ilmumisaeg: 04-Apr-2025
  • Kirjastus: Institute of Physics Publishing
  • ISBN-10: 0750361727
  • ISBN-13: 9780750361729
Teised raamatud teemal:
Püsilink: https://www.kriso.ee/db/9780750361729.html
Märksõnad:

High-performance computing (HPC) and artificial intelligence (AI) boost production efficiency, lower costs, and enhance system stability in process engineering, fostering industrial intelligence and smart manufacturing.