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Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms 2006 ed. [Kõva köide]

  • Formaat: Hardback, 186 pages, kõrgus x laius: 297x210 mm, kaal: 1060 g, XIV, 186 p., 1 Hardback
  • Ilmumisaeg: 05-Jul-2006
  • Kirjastus: Springer-Verlag New York Inc.
  • ISBN-10: 1402048254
  • ISBN-13: 9781402048258
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  • Formaat: Hardback, 186 pages, kõrgus x laius: 297x210 mm, kaal: 1060 g, XIV, 186 p., 1 Hardback
  • Ilmumisaeg: 05-Jul-2006
  • Kirjastus: Springer-Verlag New York Inc.
  • ISBN-10: 1402048254
  • ISBN-13: 9781402048258
Teised raamatud teemal:
We are presently observing a paradigm change in designing complex SoC as it occurs roughly every twelve years due to the exponentially increasing number of transistors on a chip. This design discontinuity, as all previous ones, is characterized by a move to a higher level of abstraction. This is required to cope with the rapidly increasing design costs. While the present paradigm change shares the move to a higher level of abstraction with all previous ones, there exists also a key difference. For the ?rst time shrinking geometries do not leadtoacorrespondingincreaseofperformance. InarecenttalkLisaSuofIBM pointed out that in 65nm technology only about 25% of performance increase can be attributed to scaling geometries while the lion share is due to innovative processor architecture [ 1]. We believe that this fact will revolutionize the entire semiconductor industry. What is the reason for the end of the traditional view of Moores law? It is instructive to look at the major drivers of the semiconductor industry: wireless communications and multimedia. Both areas are characterized by a rapidly increasingdemandofcomputationalpowerinordertoprocessthesophisticated algorithmsnecessarytooptimallyutilizethepreciousresourcebandwidth. The computational power cannot be provided by traditional processor architectures and shared bus type of interconnects. The simple reason for this fact is energy ef ciency: there exist orders of magnitude between the energy ef ciency of an algorithm implemented as a ?xed functionality computational element and of a software implementation on a processor.

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From the reviews:









"The book covers most of the major areas of system-level design and modeling, and much of the work described has been incorporated into a commercial ESL tool . This books scope and range of pragmatic ideas make it valuable for a wide audience. When combined with the extensive list of references (260!), this is a very valuable resource for anyone interested in the area . It should resonate with students, researchers, and practical designers ." (Grant Martin, IEEE Design and Test of Computers, May-June, 2007)

Dedication v
Foreword xi
Preface xiii
1. INTRODUCTION
1(8)
1.1 Organization of the Book
Chapters
6(3)
2. EMBEDDED SOC APPLICATIONS
9(6)
2.1 Networking Domain
9(1)
2.2 Multimedia Domain
10(1)
2.3 Wireless Communications
11(1)
2.4 Application Trends
12(1)
2.5 First Order Application Partitioning
13(2)
3. CLASSIFICATION OF PLATFORM ELEMENTS
15(18)
3.1 Architecture Metrics
15(2)
3.2 Processing Elements
17(3)
3.3 On-Chip Communication
20(10)
3.4 Summary
30(3)
4. SYSTEM LEVEL DESIGN PRINCIPLES
33(10)
4.1 The Platform Based Design Paradigm
34(1)
4.2 Design Phases
35(1)
4.3 Abstraction Mechanisms
36(2)
4.4 Models of Computation
38(2)
4.5 Object versus Actor Oriented Design
40(1)
4.6 System Level Design Requirements
41(2)
5. RELATED WORK
43(16)
5.1 Traditional HW/SW Co-Design
43(3)
5.2 SystemC based Transaction Level Modeling
46(4)
5.3 Current Research on MP-SoC Design Methodologies
50(8)
5.4 Summary
58(1)
6. METHODOLOGY OVERVIEW
59(20)
6.1 Application Modeling
60(4)
6.2 Architecture Modeling
64(5)
6.3 Envisioned Design Flow
69(6)
6.4 MP-SoC Simulation Framework
75(4)
7. UNIFIED TIMING MODEL
79(34)
7.1 Tagged Signal Model Introduction
79(6)
7.2 Reactive Process Network
85(7)
7.3 Architecture Model
92(16)
7.4 Performance Metrics
108(4)
7.5 Summary
112(1)
8. MP-SOC SIMULATION FRAMEWORK
113(28)
8.1 The Generic Synchronization Protocol
113(6)
8.2 Generic VPU Model
119(1)
8.3 NoC Framework
120(11)
8.4 Tool Support
131(8)
8.5 Summary
139(2)
9. CASE STUDY
141(12)
9.1 IPv4 Forwarding with QoS Support
141(2)
9.2 Intel IXP2400 Reference NPU
143(3)
9.3 Custom IPv4 Platform
146(3)
9.4 Simulation Results
149(4)
10. SUMMARY 153(6)
Appendices 159(12)
A The OSCI TLM Standard
159(4)
B The OCPIP TL3 Channel
163(4)
C The Architects View Framework
167(4)
List of Figures 171(4)
List of Tables 175(2)
References 177(18)
About the Authors 195(2)
Index 197