Topics covered in this book include: active devices; automotive electronics; ball grid array package; chip scale packages; design, modelling, simulation; flex circuits; HDTV; high density packaging; intelligent transportation; interconnects, bonding; and laser processing.
Active devices; automative electronics; ball grid array package; chip
scale packages; design, modeling, simulation; flex circuits; HDTV; high
density packaging; intelligent transportation; interconnects, bonding; laser
processing; management and marketing; medical electronics; mircowave
packaging; mobile electronics; multichip modules; polymeric materials; power
packaging; printed wiring boards; programmes in Mexican maquiladoras;
satellite communications; sensors; actuators; MEMS; surface mount technology;
thick film materials; thin film materials; wireless packaging.
