Keynote Address Assessment of High-Heat Flux Thermal Management Schemes 1(20) Issam Mudawar Interfaces And Contacting Surfaces Percolation Theory Applied to the Analysis of Thermal Interface Materials in Flip-Chip Technology 21(8) Amit Devpura Patrick E. Phelan Ravi S. Prasher Modeling Contact Between Rigid Sphere and Elastic Layer Bonded to Rigid Substrate 29(7) Mirko Stevanovic M. M. Yovanovich J. R. Culham Characterization of a Thermal Interface Material for Burn-in Application 36(6) Nancy F. Dean Anurag Gupta Understanding the Performance Characteristics of Phase-Change Thermal Interface Materials 42(6) Bob Rauch The Development of a Tool to Predict Package Level Thermal Interface Material Performance 48(7) Gary L. Solbrekken Chia-Pin Chiu Ben Byers David Reichenbacher Thermal Modeling and Experimental Validation of Thermal Interface Performance Between Non-Flat Surfaces 55(8) Chia-Pin Chiu Gary L. Solbrekken Todd M. Young Flow Network Modeling Experimental Verification of a Model for the Optimization of Pin Fin Heatsinks 63(7) Trevor Zapach Todd Newhouse Jeff Taylor Peter Thomasing Flow Network Modeling: A Case Study in Expedient System Prototyping 70(8) Angie Minichiello Flow Network Modeling For Improving Flow Distribution of Microelectronics Burn-in Oven 78(4) Bin Lian Terrance Dishongh David Pullenood Hongfei Ya Jing Chen Application of Flow Network Modeling and CFD to Computer System Design 82(8) Sukhvinder S. Kang Analysis of Flow Distribution in a Power Supply Using Flow Network Modeling (FNM) 90(9) Gamal Refai-Ahmed Amir Radmehr Kanchan M. Kelkar Application of a Semi-Empirical Approach to the Thermal Design of Electronic Equipment 99(8) Masaru Ishizuka Shinji Hayama Hideo Iwasaki MEMs-Micro-Electro Mechanical Components & Systems Packaging of a MEMS Based Safety and Arming Device 107(6) Michael Deeds Peter Sandborn Rajesh Swaminathan Wafer-Level Packaging Technology for MEMS 113(7) A. R. Mirza Thermal Evaluation and Modelling of the SIP9 and SP10 MEMS Packages 120(7) Marta Rencz Vladimir Szekely Zsolt Kohari Bernard Courtois A High Force Low Area MEMS Thermal Actuator 127(6) Michael J. Sinclair Test and Evaluation of Chip-to-Chip Attachment of MEMS Devices 133(8) Peter Sandborn Rajesh Swaminatha Gowrishankar Subramanian Michael Deeds Kevin Cochran Heat Sink Characterization and Optimization - 1 Design for Manufacturability of SISE Parallel Plate Forced Convection Heat Sinks 141(8) Madhusudan Iyengar Avram Bar-Cohen Heat Sinks with Fluted and Wavy Fins In Natural and Low-Velocity Forced Convection 149(8) K. K. Sikka K. E. Torrrance C. U. Scholler P. I. Salanova Thermofluid Analysis of Staggered and Inline Pin Fin Heatsinks 157(8) A. Dvinsky A. Bar-Cohen M. Strelets Characterization of Compact Heat Sink Models in Natural Convection 165(15) Susheela Narasimhan Ali Mira Optimization of the ArctiCooler for Lowest Thermal Resistance in a Minimum Volume 180(5) Guy R. Wagner Modeling of the Thermal and Hydraulic Performance of Plate Fin, Strip Fin, and Pin Fin Heat Sinks - Influence of Flow Bypass 185(8) Hans Jonsson Bahram Moshfegh Simulation and Modeling: Thermal - 1 Benchmarking Mid-Range CAD Tools in a Diverse Product Environment: Recommendations and Results 193(22) Richard A. Bauernschub Don E. King The Solution of Incompressible Navier Stokes Equations Using the Sinc Collocation Method 199 Susheela Narasimhan Kuan Chen A Methodology For The Design of Perforated Tiles in Raised Floor Data Centers Using Computational Flow Analysis 215(10) Sukhwinder Kang Roger Schmidt Kanchan M. Kelkar Amir Radmehr Suhas V. Patankar Development of Compact Thermal Models for Advanced Electronic Packaging: Methodology and Experimental Validation for a Single-Chip CPGA Package 225(8) Attila Aranyosi Alfonso Ortega Jeremy Evans Thomas Tarter John Pursel Jagadeesh Radhakrishnan An Approach to Thermal Analysis of PCB with Components Having Cyclic Electrical Loading 233(7) Ron S. Li Steven E. Larson A Comparison of Using Icepak and Flotherm in Electronic Cooling 240(7) Michael C. Yang Space Systems: Earth Orbiting and Deep Space Missions Thermal Management for High Performance Computing In Spaceborne Applications 247(8) John R. Samson, Jr. Fred M. Cutting Current-Carrying Capacity of PWB Internal Conductors in Space Environments 255(9) Michael R. Jouppi Robert Mason Variable Emissivity Through MEMS Technology 264(7) Ann Garrison Darrin Robert Osiander John Champion Ted Swanson Donya Douglas Lisa M. Grob An Engineering-of-Failure Approach to Designing and Executing An Accelerated Product Qualification Test 271(6) Mark Gibbel Timothy Larson Thermal Characterization for a Modular 3-D Multichip Module 277(6) Mark S. Fan Jeannette Plante Harry Shaw Fundamentals And Applications Of Conduction Performance Analysis of an Enhanced PCM Thermal Control Unit 283(7) Esam M. Alawadhi Cristina H. Amon Thermal-Mechanical Models For Non-Conforming Surface Contacts 290(6) M. M. Yovanovich High-Pressure Polycrystalline Diamond As A Cost Effective Heat Spreader 296(8) Scott S. Dahlgren H. Tracy Hall, Jr. N-and P-Type SiGe/Si Superlattice Coolers 304(4) Xiaofeng Fan Gehong Zeng Edward Croke Gerry Robinson Chris LaBounty Ali Shakouri John E. Bowers Use of Zero Thickness Conducting Plate Object in Electronics Cooling Applications of CFD 308(14) Kamal Karimanal Rajesh Nair A Heat Spreading Resistance Model For Anisotropic Thermal Conductivity Materials In Electronic Packaging 314 T. M. Ying Simulation And Modeling: Thermal - 2 A Study of Compact Thermal Model Topologies in CFD For A Flip Chip Plastic Ball Grid Array Package 322(8) Sarang Shidore Vance Adams Tien-Yu Tom Lee Identification of Minimum Air Flow Design for a Desktop Computer using CFD Modeling 330(9) J. Y. Chang C. W. Yu R. L. Webb Electronic Cooling Technology With Use Of Turbulent Impinging Jets 339(8) R. S. Amano Thermal Analysis of Two Protruding Heaters Mounted on a Substrate Plate Suspended in an Enclosure 347(8) Eduardo B. Martins Carlos A. C. Altemani Thermally Optimised Millimeter Wave Package on an LTCC Ceramic Board 355(6) J.-P. Sommer B. Michel U. Goebel J. Jelonnek Conjugate Mixed Convection in a Cooling Duct 361(7) Claudia R. Andrade Edson L. Zaparoli Simulation And Modeling: Mechanics - 1 A Dynamic Model for Predicting The Motion of Solder Droplets During Assembly 368(9) Deepak Kulkarni Ganesh Subbarayan Response Surface Methodology for Matrix PBGA Warpage Prediction 377(8) Eric Egan Gerard Kelly Tom ODonovan Donal Murtagh Laurent Herard Qualification Guidelines for Automotive Packaging Devices 385(8) Rajiv Raghunathan Suresh K. Sitaraman A Practical Die Stress Model and Its Applications in Flip-Chip Packages 393(7) Yifan Guo Jie-Hua Zhao Numerical Simulation of Interfacial Delamination in Electronic Packaging 400(5) B. Wang X. Sun Q. S. Fan Y. Yin A Model for Assessing the Shape of Solder Joints in the Presence of Board Warpage and Volume Variation in Area-Array Packages 405(10) Terrance B. Thompson Ganesh Subbarayan Rick James Frederick P. Renken Author Index 415 Heat Sink Characterization And Optimization - 2 Study of Thermal Characteristics on Solder and Adhesive Bonded Folded Fin Heat Sink 1(7) C. K. Loh Bor-Bin Chou Dan Nelson D. J. Chou Optimization of Plate Fin Heat Sinks Using Entropy Generation Minimization 8(8) J. R. Culham Y. S. Muzychka A Novel Heat Sink Design For Low Speed Flows - A BGA Example 16(5) Bahman Tavassoli Forced Convection Air Cooling Characteristics of Plate Fins for Notebook Personal Computers 21(6) Hideo Iwasaki Masaru Ishizuka Integrated Heat Sink-Heat Pipe Thermal Cooling Device 27(4) I. Yusuf A. Wate H. Ekhlassi Electronic Systems, Photonics: Thermal Issues Fabrication and Characterization of Electrokinetic Micro Pumps 31(6) Shulin Zeng Chuan-Hua Chen James C. Mikkelsen, Jr. Juan G. Santiago Computational Parameter Study of Chip Scale Package Array Cooling 37(7) Sean P. Watson Bruce T. Murray Bahgat G. Sammakia Two Stage Monolithic Thin Film Coolers 44(4) Chris LaBounty Ali Shakouri Patrick Abraham John E. Bowers On Mechanism of Enhancement of Two-Phase Flow Heat Transfer in a Narrow Channel 48(8) Z. L. Yang B. Palm I. Kazachkov B. R. Sehgal Computational Methodologies Interfacial Shear Stress, Peeling Stress, and Die Cracking Stress in Trilayer Electronic Assemblies 56(9) K. Wang Y. Huang A. Chandra K. X. Hu Material Properties, Geometry and Their Effect on the Fatigue Life of Two Flip-Chip Models 65(8) Hua Lu C. Bailey Evaluation of Die Edge Cracking in Flip-Chip PBGA Packages 73(6) Lei L. Mercado Vijay Sarihan Modelling Technology To Predict Flip-Chip Assembly 79(7) D. Wheeler C. Bailey Multiphysics Modelling for Electronics Design 86(8) John Parry Chris Bailey Chris Aldham Component Temperature Prediction in Printed Circuit Boards with Boundary Integral Method 94(8) Luis Antonio Waack Bambace Ezio Castejon Garcia Clausio Melo, Jr. Heat Pipes The Precision-Engineered Heat Pipe For Cooling Pentium II in Compact PCI Design 102(4) Z. Zack Yu Tim Harvey A Computational Model for the Transient Analysis of Flat Heat Pipes 106(8) C. B. Sobhan S. V. Garimella V. V. Unnikrishnan Flat Heat Pipes Thermal Performance In Body Force Environment 114(8) Mohamed Chaker Zaghdoudi Christian Tantolin Claude Godet High Heat Flux Heat Pipe Mechanism For Cooling of Electronics 122(7) Z. J. Zuo M. T. North K. L. Wert Experimental Study on Performance of a Miniature Heat Pipe with Woven-Wired Wick 129(5) Seok Hwan Moon Choon Gi Choi Gunn Hwang Tae Goo Choy Fundamentals and Applications Of Convection Cooling Active Cooling of Integrated Circuits and Optoelectronic Devices Using a Micro Configured Thermoelectric And Fluidic System 134(6) Enchao Yu DeMing Wang Sura Kim Andrzej Przekwas Low-Order Dynamical Modeling of Natural Convective Air-Cooling System in a Vertical Channel 140(8) Ridvan A. Sahan Experimental Investigation of Flow Transition in Microchannels Using Micron-Resolution Particle Image Velocimetry 148(6) R. Zeighami D. Laser P. Zhou M. Asheghi S. Devasenathipathy T. Kenney J. Santiago K. Goodson A Novel Approach to the Design of Complex Heat Transfer Systems: Heat Spreader and Portable Computer Design - Case Studies 154(8) W. Nakayama M. Behnia D. Soodphakdee A Novel Method of Cooling Electronic Packages Using a Porous Channel Heat Sink Subjected to Oscillating Flow 162(7) H. L. Fu K. C. Leong X. Y. Huang C. Y. Liu Solder Joint Reliability A Method to Predict Failure of Solder Joints Caused by Thermal Shock Using Finite Element Analysis for RF Power Amplifier Applications 169(5) Michael C. Yang Matt Cienkus Michael Hajovsky Tom Basey Inelastic Behavior of Microelectronics Solder Joints Under Concurrent Vibration and Thermal Cycling 174(7) Y. Zhao C. Basaran A. Cartwright T. Dishongh Shape Prediction and Residual Stress Evaluation of BGA and Flip Chip Solder Joints 181(6) Hidehisa Sakai Nobuyoshi Yamaoka Kazuyuki Ujiie Masanori Motegi Masaki Shiratori Qiang Yu A Strain Rate Ratio Approach For Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading 187(6) Masao Sakane Hiroki Yamamoto Stress/Strength and Reliability Evaluations on UBM in Different Solder Systems 193(7) Yifan Guo Shun-Meen Kuo Lei Mercado Effect of Delamination on the Thermal Fatigue of Solder Joints in Flip Chips 200(8) E. T. Ong A. A. O. Tay J. H. Wu Experimental Methods: Thermal, Fluids Advanced Thermal Tester for Accurate Measurement of Internal Thermal Resistance of High Power Electronic Modules 208(5) K. K. Sikka Using Experimental Analysis to Evaluate the Influence of Printed Circuit Board Cnstruction on the Thermal Performance of Four Package Types in both Natural and Forced Convection 213(13) John Lohan Pekka Tiilikka Peter Rodgers Carl-Magnus Fager Jukka Rantala Experimental Investigation of a Porous Heat Sink Characterized by Straight Circular Ducts 226(6) H. Y. Zhang X. Y. Huang Experimental Methods: Mechanics Measurement of Thermally Induced Strains On Flip Chip and Chip Scale Packages 232(8) D. Vogel E. Kaulfersch J. Simon R. Kuhnert A. Schubert B. Michel Thermomechanical Diagnostics of BGA Packages Using Digital Image/Speckle Correlation 240(6) Peng Zhou Ken Goodson A Comparison between Moire Interferometry and Strain Gages for Effective CTE Measurement In Electronic Packages 246(7) T. Ratanawilai B. Hunter G. Subbarayan D. Rose Applications of Speckle Metrology To Vibration And Deformation Measurements Of Electronic Devices 253(3) G. C. Jin X. F. Yao N. K. Bao Preliminary Examination of the Modified Lower-bound Meso-damage Constitutive Model for Porous Materials 256(7) Yajun Yin Qinshan Fan Bo Wang Estimation of the Thermal-Mechanical Fatigue Behavior of Sn/PB Solder Joints 263(7) Xi-Shu Wang Shou-Wen Yu Norio Kawagoishi Power Electronics Systems: Thermomechanical Issues Thermomechatronics of Power Electronic Packages 270(9) E. R. Brown M. C. Shaw Effects of Plasticity on Reliability in Multilayered Electronic Packages 279(8) M. C. Shaw Jun He J. C. Mather R. C. Addison, Jr. A New Power Module Packaging Technology for Enhanced Thermal Performance 287(10) B. Ozmat C. S. Korman P. McConnelee M. Kheraluwala E. Delgado R. Fillion Thermal Management Analysis of High-Power Electronic Modules Using Cu Bonded AIN Substrates 297(6) Nobuyoshi Tatoh Yoshiyuki Hirose Masaki Nagai Kazutaka Sasaki Natsuo Tatsumi Kenjiro Higaki Hirohiko Nakata Tadashi Tomikawa Finite-Element Modeling of Thermal and Thermomechanical Behavior for Three-dimensional Packaging of Power Electronics Modules 303(7) Simon Wen Guo-Quan Lu Phase Change Materials and Thermosyphons Immersion-Cooled Heat Sinks For Electronics: Insight From High Speed Photography 310(11) Sushil H. Bhavnani Gilbert Fournelle Richard C. Jaeger Single Chamber Compact Thermosyphons with Micro-Fabricated Components 321(7) Sunil S. Murthy Yogendra K. Joshi Wataru Nakayama Vibration-Induced Droplet Cooling of Microelectronic Components 328(5) S. N. Heffington W. Z. Black A. Glezer An Experimental and Numerical Investigation of Pressure Drop in a Closed Loop Two Phase Thermosyphon System 333(7) Rahmatollah Khodabandeh Bjorn Palm Simulation And Modelling: Mechanics - 2 Solder Reflow Prediction of Hybrid Pad Packaging System 340(9) Kuo-Ning Chiang Chang-Ming Liu Thermomechanical Behavior of BGA Solder Joints Under Vibrations: An Experimental Observation 349(7) Y. Zhao C. Basaran A. Cartwright T. Dishongh Numerical Study of Interfacial Delamination in a System-on-Package (SOP) Integrated Substrate Under Thermal Loading 356(6) Weidong Xie Suresh K. Sitaraman Mechanical Characterization of Solder Mask Materials in Electronic Packaging Applications 362(4) Han Zhu Wen-Ying Li Ampere A. Tseng Gifan Guo Power Electronics Systems: Thermal Issues Electronic Package Thermal Response Prediction to Power Surge 366(6) Yong Li Xu Roger Stout David Billings Thermal Characterization of Point of Used Power Supply 372(6) Gamal Refai-Ahmed Salman Basit Characterisation of Die Attach for Power Devices Using Thermal Impedance Measurement-Practice and Experiment 378(7) Matthias Ludwig Alexander Gaedke Orla Slattery John Flannery Sean Cian OMathuna Numerical And Experimental Thermal Characterization of a Liquid Cooled AlSiC Power Electronics Base Plate with Integral Pin Fins 385(6) Kevin A. Moores Yogendra K. Joshi Gerhard Schiroky IGBT Package Design for High Power Aircraft Electronic Systems 391(8) Farhad Sarvar David C. Whalley Author Index 399(2) Overview of CPMT Society 401(2) Past ITHERM Proceedings 403
