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Introduction to Electromagnetic Compatibility 3rd edition [Kõva köide]

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(Mercer University; University of Kentucky, Lexington), (University of Detroit-Mercy), (Jet Propulsion Laboratory (JPL), Pasadena, CA)
  • Formaat: Hardback, 848 pages, kõrgus x laius x paksus: 259x188x38 mm, kaal: 1293 g
  • Ilmumisaeg: 07-Nov-2022
  • Kirjastus: John Wiley & Sons Inc
  • ISBN-10: 1119404347
  • ISBN-13: 9781119404347
Teised raamatud teemal:
Introduction to Electromagnetic Compatibility 3rd editionSuurem pilt
  • Formaat: Hardback, 848 pages, kõrgus x laius x paksus: 259x188x38 mm, kaal: 1293 g
  • Ilmumisaeg: 07-Nov-2022
  • Kirjastus: John Wiley & Sons Inc
  • ISBN-10: 1119404347
  • ISBN-13: 9781119404347
Teised raamatud teemal:
Püsilink: https://www.kriso.ee/db/9781119404347.html
Märksõnad:
"New contributing authors Robert Scully and Mark Steffka have created a third edition of Dr. Clayton Paul's Introduction to Electromagnetic Compatibility that reflects the many advances that have occured in the field since the second edition was published in 2006. The new edition maintains the intuitive treatment of EMC topics ranging from basic to advanced concepts, as well as the comfortable presentation style that was a hallmark of the first two editions. The authors include detailed, worked-out examples throughout the text. In addition, readers can assess their grasp of the material using review exercises that follow the discussion of each important topic. This edition features several new appendices, including Phasor Analysis of Electric Circuits, The Electromagnetic Fields Equations and Waves, Computer Codes for Calculating the Per-Unit Length Parameters and Crosstalk of Multiconductor Transmission Lines, and a SPICE (PSPICE) tutorial"--

INTRODUCTION TO ELECTROMAGNETIC COMPATIBILITY

The revised new edition of the classic textbook is an essential resource for anyone working with today’s advancements in both digital and analog devices, communications systems, as well as power/energy generation and distribution.

Introduction to Electromagnetic Compatibility provides thorough coverage of the techniques and methodologies used to design and analyze electronic systems that function acceptably in their electromagnetic environment. Assuming no prior familiarity with electromagnetic compatibility, this user-friendly textbook first explains fundamental EMC concepts and technologies before moving on to more advanced topics in EMC system design.

This third edition reflects the results of an extensive detailed review of the entire second edition, embracing and maintaining the content that has “stood the test of time”, such as from the theory of electromagnetic phenomena and associated mathematics, to the practical background information on U.S. and international regulatory requirements. In addition to converting Dr. Paul’s original SPICE exercises to contemporary utilization of LTSPICE, there is new chapter material on antenna modeling and simulation. This edition will continue to provide invaluable information on computer modeling for EMC, circuit board and system-level EMC design, EMC test practices, EMC measurement procedures and equipment, and more such as:

  • Features fully-worked examples, topic reviews, self-assessment questions, end-of-chapter exercises, and numerous high-quality images and illustrations
  • Contains useful appendices of phasor analysis methods, electromagnetic field equations and waves.

The ideal textbook for university courses on EMC, Introduction to Electromagnetic Compatibility, Third Edition is also an invaluable reference for practicing electrical engineers dealing with interference issues or those wanting to learn more about electromagnetic compatibility to become better product designers.

Preface xiii
1 Introduction to Electromagnetic Compatibility (EMC)
1(34)
1.1 Aspects of EMC
2(7)
1.2 Electrical Dimensions and Waves
9(7)
1.3 Decibels and Common EMC Units
16(14)
1.3.1 Signal Source Specification
24(6)
1.4 Summary
30(5)
Problems
31(3)
References
34(1)
2 EMC Requirements for Electronic Systems
35(36)
2.1 Governmental Requirements
36(26)
2.1.1 Requirements for Commercial Products Marketed in the United States
36(4)
2.1.2 Requirements for Commercial Products Marketed Outside the United States
40(4)
2.1.3 Requirements for Military Products Marketed in the United States
44(4)
2.1.4 Measurement of Emissions for Verification of Compliance
48(1)
2.1.4.1 Radiated Emissions
49(2)
2.1.4.2 Conducted Emissions
51(3)
2.1.5 Typical Product Emissions
54(6)
2.1.6 A Simple Example to Illustrate the Difficulty in Meeting the Regulatory Limits
60(2)
2.2 Additional Product Requirements
62(1)
2.2.1 Radiated Susceptibility (Immunity)
62(1)
2.2.2 Conducted Susceptibility (Immunity)
62(1)
2.2.3 Electrostatic Discharge (ESD)
62(1)
2.2.4 Requirements for Commercial Aircraft
63(1)
2.2.5 Requirements for Commercial Vehicles
63(1)
2.3 Design Constraints for Products
63(1)
2.4 Advantages of EMC Design
64(7)
Problems
66(3)
References
69(2)
3 Signal Spectra--the Relationship between the Time Domain and the Frequency Domain
71(62)
3.1 Periodic Signals
71(22)
3.1.1 The Fourier Series Representation of Periodic Signals
74(8)
3.1.2 Response of Linear Systems to Periodic Input Signals
82(4)
3.1.3 Important Computational Techniques
86(7)
3.2 Spectra of Digital Waveforms
93(20)
3.2.1 The Spectrum of Trapezoidal (Clock) Waveforms
93(3)
3.2.2 Spectral Bounds for Trapezoidal Waveforms
96(1)
3.2.2.1 Effect of Rise/Falltime on Spectral Content
97(8)
3.2.2.2 Bandwidth of Digital Waveforms
105(3)
3.2.2.3 Effect of Repetition Rate and Duty Cycle
108(1)
3.2.2.4 Effect of Ringing (Undershoot/Overshoot)
109(2)
3.2.3 Use of Spectral Bounds in Computing Bounds on the Output Spectrum of a Linear System
111(2)
3.3 Spectrum Analyzers
113(5)
3.3.1 Basic Principles
115(2)
3.3.2 Peak Versus Quasi-Peak Versus Average
117(1)
3.4 Representation of Nonperiodic Waveforms
118(3)
3.4.1 The Fourier Transform
119(2)
3.4.2 Response of Linear Systems to Nonperiodic Inputs
121(1)
3.5 Representation of Random (Data) Signals
121(12)
Problems
124(8)
References
132(1)
4 Transmission Lines and Signal Integrity
133(88)
4.1 The Transmission-Line Equations
136(3)
4.2 The Per-Unit-Length Parameters
139(16)
4.2.1 Wire-Type Structures
141(10)
4.2.2 Printed Circuit Board (PCB) Structures
151(4)
4.3 The Time-Domain Solution
155(15)
4.3.1 Graphical Solutions
156(11)
4.3.2 The Branin Method
167(3)
4.4 High-Speed Digital Interconnects and Signal Integrity
170(22)
4.4.1 Effect of Terminations on the Line Waveforms
170(4)
4.4.1.1 Effect of Capacitive Terminations
174(2)
4.4.1.2 Effect of Inductive Terminations
176(1)
4.4.2 Matching Schemes for Signal Integrity
177(2)
4.4.3 When Does the Line Not Matter, i.e., When is Matching Not Required?
179(1)
4.4.4 Effects of Line Discontinuities
180(12)
4.5 Sinusoidal Excitation of the Line and the Phasor Solution
192(18)
4.5.1 Voltage and Current as Functions of Position
193(6)
4.5.2 Power Flow
199(1)
4.5.3 Inclusion of Losses
200(2)
4.5.4 Effect of Losses on Signal Integrity
202(8)
4.6 Lumped-Circuit Approximate Models
210(11)
Problems
212(7)
References
219(2)
5 Nonideal Behavior of Components
221(66)
5.1 Wires
222(10)
5.1.1 Resistance and Internal Inductance of Wires
223(6)
5.1.2 External Inductance and Capacitance of Parallel Wires
229(1)
5.1.3 Lumped Equivalent Circuits of Parallel Wires
230(2)
5.2 Printed Circuit Board (PCB) Lands
232(3)
5.3 Effect of Component Leads
235(2)
5.4 Resistors
237(6)
5.5 Capacitors
243(8)
5.6 Inductors
251(4)
5.7 Ferromagnetic Materials--Saturation and Frequency Response
255(3)
5.8 Ferrite Beads
258(3)
5.9 Common-Mode Chokes
261(3)
5.10 Electromechanical Devices
264(5)
5.10.1 DC Motors
265(2)
5.10.2 Stepper Motors
267(1)
5.10.3 AC Motors
267(1)
5.10.4 Solenoids
268(1)
5.11 Digital Circuit Devices
269(1)
5.12 Effect of Component Variability
270(1)
5.13 Mechanical Switches
270(17)
5.13.1 Arcing at Switch Contacts
271(3)
5.13.2 The Showering Arc
274(1)
5.13.3 Arc Suppression
275(3)
Problems
278(6)
References
284(3)
6 Conducted Emissions and Susceptibility
287(38)
6.1 Measurement of Conducted Emissions
288(6)
6.1.1 The Line Impedance Stabilization Network (LISN)
288(3)
6.1.2 Common- and Differential-Mode Currents Again
291(3)
6.2 Power Supply Filters
294(16)
6.2.1 Basic Properties of Filters
294(3)
6.2.2 A Generic Power Supply Filter Topology
297(1)
6.2.3 Effect of Filter Elements on Common- and Differential-Mode Currents
298(5)
6.2.4 Separation of the Conducted Emissions into Common- and Differential-Mode Currents for Diagnostic Purposes
303(7)
6.3 Power Supplies
310(9)
6.3.1 Linear Power Supplies
311(1)
6.3.2 Switched-Mode Power Supplies (SMPS)
312(3)
6.3.3 Effect of Power Supply Components on Conducted Emissions
315(4)
6.4 Power Supply and Filter Placement
319(2)
6.5 Conducted Susceptibility
321(4)
Problems
321(2)
References
323(2)
7 Antennas
325(72)
7.1 Elemental Dipole Antennas
325(7)
7.1.1 The Electric (Hertzian) Dipole
325(5)
7.1.2 The Magnetic Dipole (Loop)
330(2)
7.2 The Half-Wave Dipole and Quarter-Wave Monopole Antennas
332(10)
7.3 Antenna Arrays
342(7)
7.4 Characterization of Antennas
349(16)
7.4.1 Directivity and Gain
349(5)
7.4.2 Effective Aperture
354(2)
7.4.3 Antenna Factor
356(3)
7.4.4 Effects of Balancing and Baluns
359(3)
7.4.5 Impedance Matching and the Use of Pads
362(3)
7.5 The FRIIs Transmission Equation
365(3)
7.6 Effects of Reflections
368(13)
7.6.1 The Method of Images
368(1)
7.6.2 Normal Incidence of Uniform Plane Waves on Plane, Material Boundaries
368(8)
7.6.3 Multipath Effects
376(5)
7.7 Broadband Measurement Antennas
381(7)
7.7.1 The Biconical Antenna
381(4)
7.7.2 The Log-Periodic Antenna
385(3)
7.8 Antenna Modeling and Simulation
388(9)
7.8.1 Why Model Antennas?
388(1)
7.8.2 Modeling Methods
389(1)
7.8.3 Summary
389(1)
Problems
390(5)
References
395(2)
8 Radiated Emissions and Susceptibility
397(48)
8.1 Simple Emission Models for Wires and PCB Lands
398(25)
8.1.1 Differential-Mode Versus Common-Mode Currents
398(4)
8.1.2 Differential-Mode Current Emission Model
402(3)
8.1.3 Common-Mode Current Emission Model
405(5)
8.1.4 Current Probes
410(4)
8.1.5 Experimental Results
414(9)
8.2 Simple Susceptibility Models for Wires and PCB Lands
423(22)
8.2.1 Experimental Results
433(2)
8.2.2 Shielded Cables and Surface Transfer Impedance
435(3)
Problems
438(5)
References
443(2)
9 Crosstalk
445(112)
9.1 Three-Conductor Transmission Lines and Crosstalk
446(3)
9.2 The Transmission-Line Equations for Lossless Lines
449(3)
9.3 The Per-Unit-Length Parameters
452(24)
9.3.1 Homogeneous Versus Inhomogeneous Media
452(2)
9.3.2 Wide-Separation Approximations for Wires
454(9)
9.3.3 Numerical Methods for Other Structures
463(5)
9.3.3.1 Wires with Dielectric Insulations (Ribbon Cables)
468(4)
9.3.3.2 Rectangular Cross-Section Conductors (PCB Lands)
472(4)
9.4 The Inductive-Capacitive Coupling Approximate Model
476(24)
9.4.1 Frequency-Domain Inductive-Capacitive Coupling Model
479(2)
9.4.1.1 Inclusion of Losses: Common-Impedance Coupling
481(3)
9.4.1.2 Experimental Results
484(6)
9.4.2 Time-Domain Inductive-Capacitive Coupling Model
490(4)
9.4.2.1 Inclusion of Losses: Common-Impedance Coupling
494(1)
9.4.2.2 Experimental Results
495(5)
9.5 Shielded Wires
500(29)
9.5.1 Per-Unit-Length Parameters
500(3)
9.5.2 Inductive and Capacitive Coupling
503(7)
9.5.3 Effect of Shield Grounding
510(8)
9.5.4 Effect of Pigtails
518(1)
9.5.5 Effects of Multiple Shields
519(2)
9.5.6 MTL Model Predictions
521(8)
9.6 Twisted Wires
529(28)
9.6.1 Per-Unit-Length Parameters
530(3)
9.6.2 Inductive and Capacitive Coupling
533(6)
9.6.3 Effects of Twist
539(7)
9.6.4 Effects of Balancing
546(3)
Problems
549(6)
References
555(2)
10 Shielding
557(36)
10.1 Shielding Effectiveness
561(2)
10.2 Shielding Effectiveness: Far-Field Sources
563(13)
10.2.1 Exact Solution
564(3)
10.2.2 Approximate Solution
567(1)
10.2.2.1 Reflection Loss
568(2)
10.2.2.2 Absorption Loss
570(1)
10.2.2.3 Multiple-Reflection Loss
570(3)
10.2.2.4 Total Loss
573(3)
10.3 Shielding Effectiveness: Near-Field Sources
576(5)
10.3.1 Near Field Versus Far Field
576(4)
10.3.2 Electric Sources
580(1)
10.3.3 Magnetic Sources
580(1)
10.4 Low-Frequency, Magnetic Field Shielding
581(4)
10.5 Effects of Apertures
585(8)
Problems
589(1)
References
590(3)
11 System Design for EMC
593(90)
11.1 Changing the Way we Think About Electrical Phenomena
597(8)
11.1.1 Nonideal Behavior of Components and the Hidden Schematic
597(4)
11.1.2 "Electrons Do Not Read Schematics"
601(2)
11.1.3 What Do We Mean by the Term "Shielding"
603(2)
11.2 What do we Mean by the Term "Ground"
605(31)
11.2.1 Safety Ground
608(2)
11.2.2 Signal Ground
610(2)
11.2.3 Ground Bounce and Partial Inductance
612(3)
11.2.3.1 Partial Inductance of Wires
615(5)
11.2.3.2 Partial Inductance of PCB Lands
620(1)
11.2.4 Currents Return to Their Source on the Paths of Lowest Impedance
621(5)
11.2.5 Utilizing Mutual Inductance and Image Planes to Force Currents to Return on a Desired Path
626(3)
11.2.6 Single-Point Grounding, Multipoint Grounding, and Hybrid Grounding
629(5)
11.2.7 Ground Loops and Subsystem Decoupling
634(2)
11.3 Printed Circuit Board (PCB) Design
636(19)
11.3.1 Component Selection
637(1)
11.3.2 Component Speed and Placement
637(2)
11.3.3 Cable I/O Placement and Filtering
639(2)
11.3.4 The Important Ground Grid
641(1)
11.3.5 Power Distribution and Decoupling Capacitors
641(10)
11.3.6 Reduction of Loop Areas
651(1)
11.3.7 Mixed-Signal PCB Partitioning
652(3)
11.4 System Configuration and Design
655(17)
11.4.1 System Enclosures
655(1)
11.4.2 Power Line Filter Placement
656(1)
11.4.3 Interconnection and Number of Printed Circuit Boards
657(1)
11.4.4 Internal Cable Routing and Connector Placement
658(1)
11.4.5 PCB and Subsystem Placement
659(1)
11.4.6 PCB and Subsystem Decoupling
659(1)
11.4.7 Motor Noise Suppression
660(1)
11.4.8 Electrostatic Discharge (ESD)
661(11)
11.5 Diagnostic Tools
672(11)
11.5.1 The Concept of Dominant Effect in the Diagnosis of EMC Problems
674(6)
Problem
680(1)
References
681(2)
Appendix A The Phasor Solution Method
683(10)
A.1 Solving Differential Equations for their Sinusoidal, Steady-State Solution
683(4)
A.2 Solving Electric Circuits for Their Sinusoidal, Steady-State Response
687(6)
Problems
689(3)
Reference
692(1)
Appendix B The Electromagnetic Field Equations and Waves
693(60)
B.1 Vector Analysis
694(7)
B.2 Maxwell's Equations
701(19)
B.2.1 Faraday's Law
701(10)
B.2.2 Ampere's Law
711(5)
B.2.3 Gauss' Laws
716(3)
B.2.4 Conservation of Charge
719(1)
B.2.5 Constitutive Parameters of the Medium
719(1)
B.3 Boundary Conditions
720(4)
B.4 Sinusoidal Steady State
724(1)
B.5 Power Flow
725(1)
B.6 Uniform Plane Waves
726(15)
B.6.1 Lossless Media
729(5)
B.6.2 Lossy Media
734(3)
B.6.3 Power Flow
737(1)
B.6.4 Conductors versus Dielectrics
738(2)
B.6.5 Skin Depth
740(1)
B.7 Static (DC) Electromagnetic Field Relations--a Special Case
741(12)
B.7.1 Maxwell's Equations for Static (DC) Fields
742(1)
B.7.1.1 Range of Applicability for Low-Frequency Fields
742(1)
B.7.2 Two-Dimensional Fields and Laplace's Equation
743(1)
Problems
744(8)
References
752(1)
Appendix C Computer Codes for Calculating the Per-Unit-Length (PUL) Parameters and Crosstalk of Multiconductor Transmission Lines
753(12)
C.1 WTDESEP.FOR for Computing the PUL Parameter Matrices of Widely Spaced Wires
754(4)
C.2 RIBBON.FOR for Computing the PUL Parameter Matrices of Ribbon Cables
758(2)
C.3 PCB.FOR for Computing The PUL Parameter Matrices of Printed Circuit Boards
760(1)
C.4 MSTRP.FOR for Computing the PUL Parameter Matrices of Coupled Microstrip Lines
761(1)
C.5 STRPLINE.FOR for Computing the PUL Parameter Matrices of Coupled Striplines
762(3)
Appendix D A Spice (PSPICE, LTSPICE, etc.) Tutorial and Applications Guide
765(58)
D.1 Creating a Spice or Pspice Simulation
766(11)
D.1.1 Circuit Description
767(4)
D.1.2 Execution Statements
771(2)
D.1.3 Output Statements
773(1)
D.1.4 Examples
774(3)
D.2 Creating an Ltspice Simulation
777(8)
D.3 Lumped-Circuit Approximate Models
785(3)
D.4 An Exact Spice (Pspice) Model for Lossless, Coupled Lines
788(17)
D.4.1 Computed Versus Experimental Results for Wires
792(6)
D.4.2 Computed Versus Experimental Results for PCBs
798(7)
D.5 Use of Spice (Pspice) in Fourier Analysis
805(10)
D.6 Spicemtl.For for Computing a Spice (Pspice) Subcircuit Model of a Lossless, Multiconductor Transmission Line
815(2)
D.7 Spicelpi.For for Computing a Spice (Pspice) Subcircuit of a Lumped-Pi Model of a Lossless, Multiconductor Transmission Line
817(6)
Problems
818(2)
References
820(3)
Appendix E A Brief History of Electromagnetic Compatibility
823(4)
E.1 History of EMC
823(2)
E.2 Examples
825(2)
Index 827
Clayton R. Paul was Professor and Sam Nunn Chair of Aerospace Systems Engineering at Mercer University and Emeritus Professor of Electrical Engineering at the University of Kentucky, where he served on the faculty for 27 years. Dr. Paul authored twelve textbooks and published numerous technical papers in scientific journals and symposia. He was a Fellow of the IEEE and Honorary Life Member of the IEEE EMC Society.

Robert C. Scully a Principal Electromagnetic Compatibility Engineer, practicing at Jet Propulsion Laboratory (JPL) in Pasadena, CA., previously the Johnson Space Center (JSC) Electromagnetic Compatibility Group Lead Engineer for 20 years. He earned his PhD in Electrical Engineering from the University of Texas at Arlington, USA, and is a Fellow of the IEEE. At JSC, he supported NASAs major space programs including the Space Shuttle, the International Space Station, the Multi-Purpose Crew Vehicle, the Commercial Crew Development Program, and the Gateway Program. At JPL he is currently supporting development of major satellite projects including NISAR and Europa.

Mark A. Steffka is a Professor at the University of Detroit-Mercy. He joined the Electrical and Computer Engineering department as a full-time faculty member after his retirement from General Motors, where spent 20 years in the EMC Group. He received his B.S.E.E. from the University of Michigan and his M.S. from Indiana Wesleyan University. He has over 35 years experience in the design, development, and testing of military communication systems, aerospace instrumentation, automotive electrical/electronic systems, and vehicle antennas. Steffka is a Senior Member of the IEEE and has co-authored / authored many publications on EMC, Radio Frequency Interference and more.