Some 100 papers consider such areas as emerging concepts and techniques in testing and failure analysis, fault isolation and failure analysis of three-dimensional packages, rethinking the failure analysis process, photon-based techniques, improving fault isolation with software, packaging and assembly analysis, detecting and mitigating counterfeit electronics device-level and chip-level sample preparation, and test and diagnosis. Annotation ©2013 Book News, Inc., Portland, OR (booknews.com)
