One hundred papers discuss emerging concepts and techniques; novel research-level techniques and concepts; three-dimensional packages; detecting counterfeit devices; photon-based techniques; packaging and assembly analysis; microscopy; electrical characterization and nano-probing; case studies and the failure analysis process; preparing samples and deprocessing devices; circuit edit; defect characterization and metrology; and software-based techniques, tests, diagnosis, and yield. Among specific topics are laser logic state imaging, the physical isolation of a die in a stacked-die configuration, in-line defects overlaying with functional failures and characterization for fast defect learning and fast yield improvement, a continuous-wave 1064 nanometer laser for laser voltage imaging and probing applications, self-decapsulation techniques using viton caulk, and characterizing foil capacitors and analyzing failure with special respect to noise filter applications. Annotation ©2015 Ringgold, Inc., Portland, OR (protoview.com)
