The 65 delivered and 27 poster papers consider such areas of testing and failure analysis as emerging techniques and concepts, fault isolation, focused ion beam sample preparation, scanning probe analysis, three-dimensional devices, detecting counterfeit microelectronics, metrology and in-line device characterization, device failure analysis, nanoprobing and electrical characterization, packaging and assembly level failure analysis, sample preparation and device deprocessing, case studies and failure analysis process. Annotation ©2016 Ringgold, Inc., Portland, OR (protoview.com)
