The 115 papers selected for the November 2016 conference present new research on techniques for analyzing the failure of semiconductor devices and preparing samples for examination. Microscopes help investigate phase change memory confined cell endurance, sub-20nm structures in devices, contaminants in wafers and packaging, copper solder discoloration, and DQ failures in SRAM. Case studies analyze the failure of a multiplexer, conductive thin films, automotive ultrasonic parking sensors, a bipolar transistor, and MEMS gyroscopes. A database of counterfeit electronics, the authentication of printed circuit boards, and X-ray inspection for detecting counterfeit ICs address the problem of preventing counterfeit microelectronics. Annotation ©2017 Ringgold, Inc., Portland, OR (protoview.com)
