The 116 papers selected for the November 2017 conference present new research on techniques for analyzing the failure of semiconductor devices and preparing samples for examination. Case studies analyze a DDR loopback test failure encountered on a map ball grid array packaged device, Zynq system-on-chip cache failure, single metal contact open induced scan chain failure, and signal corruption in scan chain. Other papers analyze failure in 3D devices, focused ion beam circuits, packaging and assembly, space applications, hardware security, and at the board and system level. Black and white photographs and micrographs are provided. Annotation ©2018 Ringgold, Inc., Portland, OR (protoview.com)
