The 92 papers selected for the November 2019 conference present new research on techniques for analyzing the failure of semiconductor devices and preparing samples for examination. The papers are arranged into sections exploring fault isolation, FIB circuit analysis, microscopy, nanoprobing and electrical characterization, packing and assembly, product yield, and scanning probe analysis. Case studies investigate high signal-noise ratio captured by electro-optical probing, faults in PCB assemblies using infrared lock-in thermography, artefacts from characterization techniques, and 3D printed samples for EXLO/INLO practice. Black and white images are provided. Annotation ©2020 Ringgold, Inc., Portland, OR (protoview.com)
