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Materials for Rigid and Flexible Printed Wiring Boards [Kõva köide]

(The Boeing Company, El Segundo, California, USA), (Jaw-Mac Enterprise, Las Vegas, Nevada, USA)
  • Formaat: Hardback, 192 pages, kõrgus x laius: 229x152 mm, kaal: 520 g, 50 Tables, black and white; 37 Illustrations, black and white
  • Sari: Electrical and Computer Engineering
  • Ilmumisaeg: 22-Sep-2006
  • Kirjastus: CRC Press Inc
  • ISBN-10: 082472433X
  • ISBN-13: 9780824724337
Teised raamatud teemal:
Materials for Rigid and Flexible Printed Wiring BoardsSuurem pilt
  • Formaat: Hardback, 192 pages, kõrgus x laius: 229x152 mm, kaal: 520 g, 50 Tables, black and white; 37 Illustrations, black and white
  • Sari: Electrical and Computer Engineering
  • Ilmumisaeg: 22-Sep-2006
  • Kirjastus: CRC Press Inc
  • ISBN-10: 082472433X
  • ISBN-13: 9780824724337
Teised raamatud teemal:
Püsilink: https://www.kriso.ee/db/9780824724337.html
Märksõnad:
Complex electronic circuits and devices are flooding applications in nearly every facet of commercial and industrial activity, from automated equipment to all types of consumer products. Proper selection of materials is crucial to meet the end-use requirements of flexible and rigid printed wiring boards. While there are many useful books and articles on the fabrication of printed circuit boards, Materials for Rigid and Flexible Printed Wiring Boards is the first book to detail the properties of the materials used and how they are made.

The authors present important manufacturing information and material properties for reinforcement materials, resins, flexible films, copper foils, rigid laminates, high-speed/high-frequency laminates, and metal core and constraining core materials. They offer practical guidance to help designers, engineers, and fabricators choose suitable materials to successfully meet strength, weight, thickness, performance, cost, and other requirements. In most cases, the material data comes directly from manufacturers' data sheets, representing typical values. The book illustrates the comparative strengths and limitations of the materials, highlights their basic properties, and details the manufacturing processes used to make them.

Offering practical guidance based on years of experience, Materials for Rigid and Flexible Printed Wiring Boards is a one-stop source of crucial information for anyone designing or building printed circuit boards for any application.
1 Reinforcement Materials 1(20)
1.0 Reinforcement Materials — Rigid
1(1)
1.1 Glass
1(1)
1.2 Glass Composition
2(3)
1.2.1 D-Glass
2(1)
1.2.2 E-Glass
3(1)
1.2.3 S-Glass
4(1)
1.2.4 Quartz
4(1)
1.3 Glass Fiber Manufacturing
5(2)
1.4 From Yarn to Fabric
7(1)
1.5 Glass Types and Construction
7(2)
1.6 Glass Fabric Weave
9(2)
1.6.1 Plain Weave
9(1)
1.6.2 Twill Weave
9(1)
1.6.3 Long-Shaft Satin
10(1)
1.6.4 Basket Weave
10(1)
1.6.5 Leno Weave
11(1)
1.7 Surfacing Mat, Paper, or Veil
11(1)
1.8 Glass Fiber Paper
12(1)
1.9 Quartz
12(1)
1.10 Properties of Glass Fabrics
13(1)
1.10.1 Moisture and Chemical Resistance
13(1)
1.10.2 Electrical Properties
13(1)
1.10.3 Heat and Fire Resistance
14(1)
1.10.4 Thermal Conductivity
14(1)
1.11 Aramids
14(2)
1.11.1 Nonwoven Aramid (Thermount®)
14(2)
1.12 Constraining Dielectric Materials (Kevlar)
16(3)
References
19(2)
2 Resins 21(18)
2.0 Introduction
21(1)
2.1 Polyester Resin
22(1)
2.2 Epoxy
23(8)
2.2.1 Difunctional Epoxy
24(1)
2.2.2 Multifunctional Epoxy
25(2)
2.2.2.1 General-Purpose Systems Having a Tg between 135 and 145°C
26(1)
2.2.2.2 Higher-Performance Multifunctional Epoxies with a Tg between 150 and 165°C
26(1)
2.2.2.3 High-Temperature Multifunctional Epoxy with a Tg between 170 and 185°C
27(1)
2.2.3 Tetrafunctional Epoxy
27(1)
2.2.4 Curing Agent
27(3)
2.2.5 High-Tg Epoxy
30(1)
2.3 Polyimide
31(2)
2.3.1 Epoxy-Blended Polyimide
32(1)
2.4 Cyanate Ester and Cyanate Ester Blends (BT Resin)
33(1)
2.4.1 Cyanate Ester Resins
33(1)
2.5 Polyphenylene Oxide (PPO) Epoxy Blends
34(1)
2.5.1 Getek® Resins
35(1)
2.6 Polytetrafluoroethylene Resin (PTFE)
35(2)
References
37(2)
3 Flexible Films 39(26)
3.0 Introduction
39(1)
3.1 Types of Flexible Materials
40(8)
3.1.1 Polyethylene Terephthalate ([ PET] Polyester)
40(2)
3.1.1.1 Polyester/Epoxy
42(1)
3.1.2 Polyethylene Naphthalate (PEN)
42(1)
3.1.3 Fluorocarbons (FEP)
42(2)
3.1.4 Polyimide
44(2)
3.1.4.1 Tear Resistance
45(1)
3.1.4.2 Dimensional Stability
45(1)
3.1.5 Aramid
46(2)
3.2 Adhesives
48(7)
3.2.1 Types and Use of Adhesive
49(1)
3.2.2 Coating Process (Adhesive)
50(2)
3.2.2.1 Major Adhesive Types
50(2)
3.2.3 Adhesiveless Systems
52(2)
3.2.3.1 Cast to Foil
53(1)
3.2.3.2 Vapor Deposition on Film
53(1)
3.2.3.3 Direct Vapor/Sputter Metallization onto Polyimide Film
53(1)
3.2.3.4 Plated on Film
54(1)
3.2.4 Adhesiveless Properties
54(3)
3.2.4.1 Electrical Advantage
54(1)
3.2.4.2 Mechanical Advantage
55(1)
3.2.4.3 Thermal Advantage
55(1)
3.3 Cover Coat/Cover Layer
55(2)
3.4 Bond Plies
57(1)
3.5 Conductive Materials
57(2)
3.5.1 Electrodeposited Copper
58(1)
3.5.2 Rolled Annealed Copper (RA)
59(1)
3.6 Copper-Clad Laminates
59(4)
References
63(2)
4 Copper Foils 65(12)
4.0 Introduction
65(1)
4.1 Electrodeposited Copper Foil (also called ED foil)
65(2)
4.2 Rolled Copper Foils (also called RA foil)
67(4)
4.2.1 Fabricating Rolled Copper Foils
67(2)
4.2.2 Foil Treatment
69(2)
4.2.2.1 Heat Treatment
69(1)
4.2.2.2 Foil Processing
69(2)
4.3 Grades
71(4)
4.3.1 Electrodeposited
71(2)
4.3.1.1 Grade-1 or Standard Electrodeposited (STD-Type E)
71(1)
4.3.1.2 Grade-2 or High-Ductility Electrodeposited Foils (HDE-Type E)
71(1)
4.3.1.3 Grade-3 or High-Temperature Elongation Foil (HTE-Type E)
72(1)
4.3.1.4 Grade-4 Annealed Electrodeposited or "Super High Duct" (ANN-Type E)
73(1)
4.3.2 Rolled Copper Foil
73(2)
4.3.2.1 Grade-5 "As Rolled" Wrought Copper (AR-Type W)
73(1)
4.3.2.2 Grade-6 or Light Cold Rolled Wrought (LCR-Type W Special Temper)
73(1)
4.3.2.3 Grade-7 or Rolled Annealed Wrought (ANN-Type W)
74(1)
4.3.2.4 Grade-8 or "As Rolled" Wrought Low-Temperature Annealable (Type LTA)
75(1)
4.3.3 Properties
75(1)
4.3.4 Application
75(1)
4.4 Nickel Foil
75(1)
References
76(1)
5 Laminates, Rigid 77(36)
5.0 Introduction
77(1)
5.1 NEMA Grades
77(3)
5.1.1 Paper-Based Laminates
77(1)
5.1.2 Types of Laminates
78(2)
5.1.2.1 XPC
78(1)
5.1.2.2 XXXPC
79(1)
5.1.2.3 FR-1
79(1)
5.1.2.4 FR-2
79(1)
5.1.2.5 FR-3
80(1)
5.1.3 Properties, Construction, and Specifications (Paper-Based Laminates)
80(1)
5.1.4 Processing Paper-Grade Laminates
80(1)
5.2 Composite Laminates
80(12)
5.2.1 Reinforcing Mats
82(5)
5.2.1.1 Surfacing Mats, Paper, or Veil
86(1)
5.2.1.2 Glass Fiber "Paper"
86(1)
5.2.1.3 Polyester Glass Mat
86(1)
5.2.2 Types of Composite Laminate
87(1)
5.2.2.1 CEM-1
87(1)
5.2.2.2 CEM-3
87(1)
5.2.2.3 CRM-5
87(1)
5.2.2.4 FR-6
88(1)
5.2.2.5 Properties, Construction, and Specifications (Composite Laminates)
88(1)
5.2.3 Storage
88(4)
5.2.4 Material Recommendation
92(1)
5.3 Rigid Laminates (Glass-Reinforced)
92(3)
5.3.1 Electrical Characteristics
94(1)
5.3.2 Laminate Thickness
94(1)
5.4 Laminates, Rigid Glass Reinforcement
95(7)
5.4.1 Epoxy Laminate (FR-4)
95(3)
5.4.1.1 Difunctional Epoxies
96(2)
5.4.2 Cyanate Ester
98(2)
5.4.3 Polyimide Laminates
100(2)
5.4.3.1 Polyimide/Glass
100(1)
5.4.3.2 Polyimide Glass and Copper-Invar-Copper
101(1)
5.4.3.3 Polyimide Quartz
101(1)
5.4.4 Polyphenylene Oxide (PPO®)
102(1)
5.5 Aramid Laminates
102(4)
5.5.1 Epoxy Thermount®
102(2)
5.5.1.1 Multifunctional Epoxy/Nonwoven Aramid Reinforcement
104(1)
5.5.2 Epoxy on Woven Kevlar°
104(2)
5.6 Prepreg
106(1)
5.6.1 Manufacturing Prepreg
106(1)
5.7 Additive Laminates
107(3)
5.7.1 Additive Circuitry
107(1)
5.7.2 Semiadditive Laminates
107(6)
5.7.2.1 Ultrathin Copper Foil Clad
108(1)
5.7.2.2 Unclad
108(1)
5.7.2.3 Unclad or Adhesive-Coated
109(1)
5.7.2.4 Catalytic or Seeded
109(1)
References
110(3)
6 High-Speed/High-Frequency Laminates 113(20)
6.0 Introduction
113(1)
6.1 High-Speed/High-Frequency Laminates
113(3)
6.1.1 RF Analog Circuit Characteristics
114(1)
6.1.2 Digital Circuit Characteristics
114(1)
6.1.3 Two Major Classes of Reinforcements
114(1)
6.1.4 Goal of Each Application Area
115(1)
6.2 Thin Laminates
116(1)
6.3 Resins
116(6)
6.3.1 Polytetrafluoroethylene Laminates
116(4)
6.3.2 Ceramic-Filled Polytetrafluoroethylene
120(1)
6.3.3 New Fluoropolymer Composite Materials
120(2)
6.3.4 Epoxy Resin
122(1)
6.4 High-Frequency Laminate Designations
122(7)
6.4.1 GRN Type Laminates with Glass Microfibers
122(2)
6.4.1.1 GRN Type Laminates with Nonwoven Fiberglass
123(1)
6.4.2 GTN Type Laminates with E-Glass
124(1)
6.4.3 Type GXN Laminates with E-Glass
124(1)
6.4.4 GYN Type Laminates with E-Glass
125(1)
6.4.5 High-Dk (6.0 to 10.5) Laminates with E-Glass
126(1)
6.4.6 Temperature-Stable Dielectric Constant and Low-CTE Laminates with E-Glass
127(1)
6.4.7 Commercial-Grade Laminates
128(1)
6.5 Laminate Construction
129(1)
6.5.1 Cross-Plied and Non-Cross-Plied Construction (meet type GT)
129(1)
6.6 Bonding
130(1)
6.7 Dimensional Stability
130(1)
6.8 Drilling
131(1)
References
131(2)
7 Metal Core and Constraining Core Materials 133(10)
7.0 Introduction
133(1)
7.1 Copper-Invar-Copper (CIC)
134(1)
7.2 Copper-Molybdenum-Copper (CMC)
135(3)
7.3 Silicon Carbide—Reinforced Aluminum (SiC/A1)
138(2)
7.4 Coefficient of Thermal Expansion Trade-Offs (CTE)
140(1)
References
141(2)
Appendix Abbreviations, Definitions, and Terms 143(10)
Index 153


Martin W. Jawitz, Michael J. Jawitz