For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electronic Device Failure Analysis Society). Coverage includes failure analysis process flow, verification, classifications, special devices, non destructive analysis techniques, fault localization at the die level (depackaging, photo emission techniques, microthermography, laser & particle beam-based techniques), and deprocessing and imaging techniques. Appended are failure analysis terms and definitions, and JEDEC standards for failure analysis. The included CD-ROM presumably contains the complete text for those who prefer to access material on a screen. Annotation ©2004 Book News, Inc., Portland, OR (booknews.com)
