The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples.
Topics include:
Failure Analysis Process and Managementwafer, package, and board level failure analysis flow. Incoming Inspection Toolsoptical, x-ray, and scanning acoustic microscopy. Fault Isolationfront and backside sample preparation, CAD navigation, laser-assisted device alteration (LADA), soft defect location (SDL), lock-in thermography, laser voltage probing (LVP), photon emission, EOTPR/TDR/TDT, and current imaging. Device and Circuit Characterizationscanning electron microscopy (SEM)-based and atomic force microscopy (AFM)-based nanoprobing. FIB Technique and Circuit Edit FIB overview and advanced circuit edit for first silicon debug. Physical Analysisdeprocessing, cross section analysis, scanning electron microscopy, material analysis techniques, transmission electron microscopy (TEM), and scanning probe microscopy. Memory FADRAM, semiconductor memory failure signature analysis. Special Applicationsautomotive FA, 2.5 and 3D packaging failure analysis, microelectromechanical systems (MEMS), optoelectronics, solar, and counterfeit electronics. Fundamental Topicsintegrated circuit testing, analog design, reliability, quality, and training.
Seven new topics have been added and all themes covered in earlier editions are included in the Seventh Edition. Many previous articles have been updated.
