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Micromachining and Micropackaging of Transducers [Kõva köide]

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Micromachining and Micropackaging of Transducers
Teised raamatud teemal:
Püsilink: https://www.kriso.ee/db/9780444425607.html
Märksõnad:
Covering the technology of the formation and packaging of microstructures for transducer applications, the papers in this book address isotropical and anisotropical etching of silicon and other materials by electrochemical, chemical and other techniques; and describe the adaptation of advanced integrated circuit technology and laser drilling to novel microstructures. Packaging considerations and materials (including various encapsulants, adhesives and specialty polymers) are emphasized to provide potentially high reliability transducer assemblies. The many application examples given include sensor structures and systems for chemical sensing, flow measurement, pressure measurement, enzyme reaction and other biomedical and industrial applications. Engineers and researchers in the industrial and academic community will value this book, as it describes the state of the art of machining and microsensor packaging, identifies existing techniques, will be useful when applying these techniques to other microstructures and devices.
I. Overview. Silicon micromachining and its application to high
performance integrated sensors (K.D. Wise). Epoxy encapsulants, adhesives and
specialty polymers for microelectronic applications (D.R. Owen, R.M. Zone).
II. Micropackaging and Encapsulation. Packaging considerations for the
microdielectrometer and related chemical sensors (S.D. Senturia, D.R. Day).
Bonding techniques for microsensors (W.H. Ko et al.). Corrosion protection
for implantable integrated sensors by CO 2 laser processing for glass and
silicon (Y. Naruse et al.). Electrical contacts to implantable integrated
sensors by CO 2 laser-drilled bias through glass (L. Bowman et al.).
Packaging of an intracranial pressure telemetering unit for chronic
implantation (T. Spear et al.). III. Etching Techniques. Orientations of the
third kind: the coming of age of (110) silicon (D.L. Kendall,G.R. de Guel).
The use of a certain fluorocarbon surfactant and fluorocarbon conformal
coating improves KOH silicon etching quality (B. Block, M. Sierakowsky).
Ellipsometric study of bias-dependent etching and the etch-stop mechanism for
silicon in aqueous KOH (E.D. Palik et al.). Submicron accuracies in
anisotropic etched silicon piece parts - a case study (T.L. Poteat). Deep
etching of silicon using plasma (C.D. Fung, J.R. Linkowski). IV.
Microstructures. Microfabrication technology for microsensors (L.T.
Romankiw). Polycrystalline silicon microstructures (R.T. Howe).
Micromachining technology for flexible sensor arrays (P.W. Barth). Planar
processed, integrated displacement sensors (H. Guckel et al.).
Electrochemical shaping of three dimensional continuously modulated surface
contours (U. Langau et al.). V. Applications. A microtransducer for air flow
and differential pressure sensing applications (G.B. Hocker et al.). V-groove
capillary for low flow control and measurement (M.G. Guvenc). Fabrication of
biomedical sensors using thin and thick film microelectronic technology (M.R.
Neuman, C.-C. Liu). Microelectronic microelectrode glucose sensor at low
potentials (L.-T. Chan et al.). Potential applications of micromachining to
semiconductor chemical sensors (P.W. Cheung).