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Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation 2023 ed. [Pehme köide]

  • Formaat: Paperback / softback, 311 pages, kõrgus x laius: 235x155 mm, 7 Illustrations, color; 686 Illustrations, black and white; XV, 311 p. 693 illus., 7 illus. in color., 1 Paperback / softback
  • Ilmumisaeg: 03-Jun-2024
  • Kirjastus: Springer Verlag, Singapore
  • ISBN-10: 9819914574
  • ISBN-13: 9789819914579
Teised raamatud teemal:
  • Pehme köide
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  • Formaat: Paperback / softback, 311 pages, kõrgus x laius: 235x155 mm, 7 Illustrations, color; 686 Illustrations, black and white; XV, 311 p. 693 illus., 7 illus. in color., 1 Paperback / softback
  • Ilmumisaeg: 03-Jun-2024
  • Kirjastus: Springer Verlag, Singapore
  • ISBN-10: 9819914574
  • ISBN-13: 9789819914579
Teised raamatud teemal:
This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms a complete system from design theory, circuit simulation, full-wave electromagnetic simulation, and fabrication to measurement. Five representative microwave and millimeter-wave passive chips based on TFIPD technology are taken as examples to demonstrate the complete process from theory, design, simulation, fabrication, and measurement, which is comprehensive, systematical, and easy to learn and understand, convenient to operate, and close to the practical application. 





This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun. 





This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities.

















 
Introduction.- Design and Simulation of Balanced Bandpass Filter.- Design and Simulation of Millimeter-Wave Microstrip Bandpass Filter.- Design and Simulation of Input-Absorptive Bandstop Filter.- Design and Simulation of Impedance-Transforming Power Divider.- Design and Simulation of Bandpass Filtering Marchand Balun.

Prof. Yongle Wu received his Ph.D. degree in electronic engineering from Beijing University of Posts and Telecommunications (BUPT), China, in 2011. He was a Research Assistant at the City University of Hong Kong (CityU) from April to October 2010. Prof Wu is currently a Professor with the School of Integrated Circuits, BUPT. His research interests include integrated circuits, microwave components, antennas, and wireless systems design. Weimin Wang received the M.S. degree in Electromagnetic Field and Microwave Technology and the Ph. D. degree in Electronic Science and Technology from Beijing University of Posts and Telecommunications (BUPT), in 2004 and 2014 She is currently an Associate Professor in the School of Electronic Engineering, BUPT. Her research interests include electromagnetic field, antennas, microwave circuits and antenna measurement.