Foreword from the Authors |
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ix | |
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1 Basic Principles and Components in the Microwave Techniques and Power Systems |
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1 | (36) |
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1.1 History in Brief - From Alternating Current to Electromagnetic Waves and to Microwaves |
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1 | (2) |
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3 | (2) |
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1.3 Waveguides and Electromagnetic Modes in Wave Propagation |
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5 | (9) |
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1.3.1 The Cut-off Frequency and the Wavelength in Waveguides |
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7 | (2) |
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1.3.2 Waveguides Filled by Dielectrics |
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9 | (1) |
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1.3.3 Wave Impedance and Standing Waves in Waveguides |
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10 | (2) |
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1.3.4 Coaxial Transmission Lines |
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12 | (2) |
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1.3.5 Microwave Resonators |
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14 | (1) |
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1.4 Waveguide Power Lines |
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14 | (14) |
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1.4.1 Magnetron Tube Microwave Generator |
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16 | (1) |
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1.4.2 Microwave Insulators |
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16 | (1) |
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17 | (2) |
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1.4.4 Directional Couplers |
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19 | (1) |
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1.4.5 Passive Waveguide Components - Bends, Flanges, Vacuum Windows |
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20 | (2) |
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1.4.6 Tapered Waveguides and Waveguide Transformers |
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22 | (1) |
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1.4.7 Power Loads and Load Tuners |
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23 | (2) |
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1.4.8 Waveguide Phase Shifters |
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25 | (1) |
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1.4.9 Waveguide Shorting Plungers |
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25 | (1) |
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1.4.10 Coupling from Rectangular to Circular Waveguide: Resonant Cavities for Generation of Plasma |
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26 | (2) |
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1.5 Microwave Oven - A Most Common Microwave Power Device |
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28 | (9) |
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33 | (4) |
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37 | (30) |
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2.1 Basic Understanding of the Gas Discharge Plasmas |
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37 | (3) |
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2.2 Generation of the Plasma, Townsend Coefficients, Paschen Curve |
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40 | (3) |
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2.3 Generation of the Plasma by AC Power, Plasma Frequency, Cut-off Density |
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43 | (7) |
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2.4 Space-charge Sheaths at Different Frequencies of the Incident Power |
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50 | (5) |
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2.5 Classification of Gas Discharge Plasmas, Effects of Gas Pressure, Microwave Generation of Plasmas |
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55 | (12) |
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2.5.1 Classification of Gas Discharge Plasmas |
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55 | (3) |
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2.5.2 Effects of the Gas Pressure on Particle Collisions in the Plasma |
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58 | (3) |
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2.5.3 Microwave Generation of Plasmas |
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61 | (3) |
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64 | (3) |
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3 Interactions of Plasmas with Solids and Gases |
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67 | (18) |
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3.1 Plasma Processing, PVD, and PE CVD |
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67 | (5) |
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3.2 Sputtering, Evaporation, Dry Etching, Cleaning, and Oxidation of Surfaces |
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72 | (3) |
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3.3 Particle Transport in Plasma Processing and Effects of Gas Pressure |
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75 | (4) |
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3.3.1 Movements of Neutral Particles |
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76 | (1) |
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3.3.2 Movements of Charged Particles |
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77 | (2) |
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3.3 Effect of the Gas Pressure on the Plasma Processing |
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79 | (2) |
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3.4 Afterglow and Decaying Plasma Processing |
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81 | (4) |
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83 | (2) |
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4 Microwave Plasma Systems for Plasma Processing at Reduced Pressures |
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85 | (50) |
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4.1 Waveguide-Generated Isotropic and Magnetoactive Microwave Plasmas |
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85 | (20) |
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4.1.1 Waveguide-Generated Isotropic Microwave Oxygen Plasma for Silicon Oxidation |
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87 | (6) |
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4.1.2 ECR and Higher Induction Magnetized Plasma Systems for Silicon Oxidation |
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93 | (12) |
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4.2 PE CVD of Silicon Nitride Films in the Far Afterglow |
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105 | (6) |
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4.3 Microwave Plasma Jets for PE CVD of Films |
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111 | (11) |
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4.3.1 Deposition of Carbon Nitride Films |
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115 | (4) |
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4.3.2 Surfajet Plasma Parameters and an Arrangement for Expanding the Plasma Diameter |
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119 | (3) |
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4.4 Hybrid Microwave Plasma System with Magnetized Hollow Cathode |
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122 | (13) |
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129 | (6) |
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5 Microwave Plasma Systems at Atmospheric and Higher Pressures |
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135 | (34) |
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5.1 Features of the Atmospheric Plasma and Cold Atmospheric Plasma (CAP) Sources |
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136 | (4) |
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5.2 Atmospheric Microwave Plasma Sources Assisted by Hollow Cathodes |
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140 | (11) |
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5.2.1 Applications of the H-HEAD Plasma Source in Surface Treatments |
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144 | (7) |
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5.3 Microwave Treatment of Diesel Exhaust |
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151 | (3) |
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5.4 Microwave Plasma in Liquids |
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154 | (3) |
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5.5 Microwave Plasma Interactions with Flames |
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157 | (4) |
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5.6 Microwave Plasmas at Very High Pressures |
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161 | (8) |
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162 | (7) |
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6 New Applications and Trends in the Microwave Plasmas |
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169 | (12) |
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176 | (5) |
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181 | (8) |
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7.1 List of Symbols and Abbreviations |
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181 | (7) |
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7.2 Constants and Numbers |
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188 | (1) |
Index |
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189 | |