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More than Moore Technologies for Next Generation Computer Design Softcover reprint of the original 1st ed. 2015 [Pehme köide]

  • Formaat: Paperback / softback, 218 pages, kõrgus x laius: 235x155 mm, kaal: 3933 g, 63 Illustrations, color; 53 Illustrations, black and white; IX, 218 p. 116 illus., 63 illus. in color., 1 Paperback / softback
  • Ilmumisaeg: 05-Oct-2016
  • Kirjastus: Springer-Verlag New York Inc.
  • ISBN-10: 1493947109
  • ISBN-13: 9781493947102
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  • Formaat: Paperback / softback, 218 pages, kõrgus x laius: 235x155 mm, kaal: 3933 g, 63 Illustrations, color; 53 Illustrations, black and white; IX, 218 p. 116 illus., 63 illus. in color., 1 Paperback / softback
  • Ilmumisaeg: 05-Oct-2016
  • Kirjastus: Springer-Verlag New York Inc.
  • ISBN-10: 1493947109
  • ISBN-13: 9781493947102

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

1 Impact of TSV and Device Scaling on the Quality of 3D ICs
1(22)
Dae Hyun Kim
Sung Kyu Lim
2 3D Integration Technology
23(26)
Yuan Xie
Qiaosha Zou
3 Design and Optimization of Spin-Transfer Torque MRAMs
49(24)
Xuanyao Fong
Sri Harsha Choday
Kaushik Roy
4 Embedded STT-MRAM: Device and Design
73(28)
Seung H. Kang
Seong-Ook Jung
5 A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis
101(26)
Peiyuan Wang
Enes Eken
Wei Zhang
Rajiv Joshi
Rouwaida Kanj
Yiran Chen
6 Main Memory Scaling: Challenges and Solution Directions
127(28)
Onur Mutlu
7 Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors
155(32)
Cheng Li
Paul V. Gratz
Samuel Palermo
8 Design Automation for On-Chip Nanophotonic Integration
187
Christopher Condrat
Priyank Kalla
Steve Blair
Rasit O. Topaloglu is an Advisory R&D Engineer at IBM.