1 The Telecom Industry and Data Centers |
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1 | (8) |
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1.1 An Overview of the Telecom Industry Market |
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1.1.1 The Global Telecom Market |
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1.1.2 The United States Telecom Market |
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2 | (1) |
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3 | (5) |
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4 | (1) |
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1.2.2 Environmental Issues |
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4 | (2) |
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1.2.3 Government Regulations |
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6 | (2) |
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8 | (1) |
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8 | (1) |
2 Data Center Energy Flow and Efficiency |
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9 | (22) |
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9 | (4) |
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11 | (1) |
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11 | (1) |
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12 | (1) |
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2.2 Energy Efficiency Metrics |
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13 | (2) |
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2.3 Methods to Improve Energy Efficiency |
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15 | (2) |
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2.3.1 Efficient Electronics |
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15 | (1) |
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2.3.2 Efficient Software Applications |
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16 | (1) |
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2.3.3 Efficient Power Supply and Distributions |
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16 | (1) |
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2.3.4 Efficient Cooling Systems |
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17 | (1) |
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2.4 Case Study Example on Data Center Energy Saving Opportunities |
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17 | (12) |
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2.4.1 Analysis of Energy Consumption |
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17 | (5) |
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2.4.2 Energy Consumption Simulations |
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22 | (4) |
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2.4.3 Energy„ Conservation Findings |
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26 | (3) |
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29 | (1) |
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29 | (2) |
3 Standards Relating to Data Center |
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31 | (16) |
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3.1 ASHRAE Thermal Guidelines |
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31 | (3) |
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3.2 TIA-942 Data Center Standard |
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34 | (2) |
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3.3 Environmental Qualification Standards |
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36 | (5) |
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3.3.1 Telcordia GR-63-CORE |
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36 | (2) |
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38 | (3) |
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3.3.3 Use for Data Center Cooling Methods |
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41 | (1) |
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3.4 Quality Management Standard: TL 9000 |
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41 | (4) |
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42 | (2) |
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3.4.2 Use for Data Centers |
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44 | (1) |
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45 | (1) |
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45 | (2) |
4 Principal Cooling Methods |
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47 | (24) |
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4.1 Principal Cooling Methods |
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47 | (8) |
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47 | (2) |
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49 | (1) |
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4.1.3 Liquid Immersion Cooling |
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50 | (3) |
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53 | (1) |
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4.1.5 Enhanced Cooling Utilizing Power Management Technologies |
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53 | (1) |
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4.1.6 Comparison of Principal Cooling Methods |
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54 | (1) |
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55 | (12) |
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4.2.1 Operation of Airside Economizer |
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56 | (1) |
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4.2.2 Operating Environment Setting |
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57 | (2) |
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4.2.3 Energy Savings from Free Air Cooling |
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59 | (5) |
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4.2.4 Hidden Costs of Free Air Cooling |
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64 | (1) |
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4.2.5 Examples of Free Air Cooling |
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65 | (2) |
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67 | (1) |
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68 | (3) |
5 Reliability Risks Under Free Air Cooling |
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71 | (24) |
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5.1 Failure Causes Under Free Air Cooling |
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71 | (5) |
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5.1.1 Increased Temperature and Temperature Variation |
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71 | (2) |
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5.1.2 Uncontrolled Humidity |
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73 | (1) |
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74 | (2) |
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5.2 Failure Mechanisms Under Free Air Cooling |
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76 | (7) |
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5.2.1 Electrostatic Discharge |
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76 | (1) |
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5.2.2 Conductive Anodic Filament Formation |
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76 | (2) |
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5.2.3 Electrochemical Migration |
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78 | (1) |
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79 | (4) |
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5.3 Testing for Free Air Cooling |
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83 | (7) |
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5.3.1 Mixed Flowing Gas (MFG) Test |
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83 | (2) |
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5.3.2 Dust Exposure Tests |
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85 | (1) |
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86 | (2) |
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5.3.4 Temperature/Humidity/Bias (THB) Testing |
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88 | (1) |
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88 | (1) |
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5.3.6 Cyclic Temperature/Humidity Testing |
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89 | (1) |
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5.3.7 Water Spray Testing |
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90 | (1) |
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90 | (1) |
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91 | (4) |
6 Part Risk Assessment and Mitigation |
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95 | (20) |
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95 | (7) |
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95 | (1) |
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6.1.2 Understanding the Part Number |
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96 | (1) |
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6.1.3 Ratings of an Electronic Part |
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97 | (2) |
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6.1.4 Thermal Characteristics |
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99 | (2) |
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6.1.5 Electrical Specifications |
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101 | (1) |
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102 | (11) |
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6.2.1 Steps of Part Uprating |
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102 | (2) |
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6.2.2 Parameter Conformance |
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104 | (3) |
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6.2.3 Parameter Re-characterization |
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107 | (4) |
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111 | (1) |
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6.2.5 Continuing Steps After Uprating |
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112 | (1) |
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113 | (1) |
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113 | (2) |
7 Part Reliability Assessment in Data Centers |
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115 | (26) |
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115 | (2) |
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7.2 Example Handbook-Based Reliability Prediction Methods |
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117 | (4) |
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117 | (1) |
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118 | (1) |
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7.2.3 How the Handbook Calculations Work |
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118 | (1) |
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7.2.4 How the Operating Environments are Handled |
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119 | (1) |
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7.2.5 Insufficiency of the Handbook Methods |
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119 | (2) |
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7.3 Prognostics and Health Management Approaches |
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121 | (13) |
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7.3.1 Monitoring Techniques for PHM |
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122 | (1) |
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7.3.2 Physics-of-Failure Approach |
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122 | (6) |
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7.3.3 Data-Driven Approach |
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128 | (4) |
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132 | (2) |
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7.3.5 Use for the Efficient Cooling Methods |
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134 | (1) |
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134 | (2) |
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136 | (1) |
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137 | (4) |
8 Life Cycle Risk Mitigations |
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141 | (18) |
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8.1 Risk Assessment Based on Product Life Cycle Stage |
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141 | (1) |
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8.2 Risk Assessment at the Design Stage |
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142 | (4) |
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143 | (1) |
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143 | (1) |
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8.2.3 Virtual Qualification |
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144 | (1) |
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8.2.4 Simulation and Final Design |
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145 | (1) |
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8.3 Risk Assessment at the Test Stage |
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146 | (2) |
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8.3.1 Standards-Based Assessment |
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146 | (1) |
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8.3.2 Uprating Assessment |
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147 | (1) |
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8.4 Risk Assessment at the Operation Stage |
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148 | (1) |
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8.5 A Case Study of Network Equipment |
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149 | (7) |
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8.5.1 Estimation of Operating Conditions |
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150 | (1) |
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8.5.2 FMMEA and Identification of Weak Subsystems |
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151 | (1) |
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8.5.3 System and Weak Subsystem Monitoring |
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151 | (1) |
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152 | (3) |
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155 | (1) |
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156 | (1) |
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156 | (3) |
9 Emerging Trends |
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159 | (16) |
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9.1 Increased Use of Software Tools for Optimum and Reliable Operation |
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159 | (1) |
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9.2 Trends in Development of Energy Efficient Electronics |
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160 | (2) |
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9.3 Embedded (Near Source) Cooling |
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162 | (7) |
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9.3.1 Enhanced Air Cooling |
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163 | (1) |
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9.3.2 CRAC Fan Speed Control |
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164 | (1) |
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9.3.3 Direct Liquid Cooling |
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164 | (1) |
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9.3.4 Direct Phase-Change Cooling |
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165 | (1) |
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9.3.5 Comparison Between Embedded Air, Liquid, and Two-Phase Flow Cooling |
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166 | (3) |
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9.4 Net-Zero Emission Data Centers |
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169 | (1) |
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9.5 Mission Critical Data Centers |
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170 | (1) |
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9.6 Waste Heat Recovery/Chiller-less Cooling |
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171 | (1) |
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172 | (1) |
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172 | (3) |
Glossary |
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175 | |