This book introduces high power semiconductor laser packaging design, examining new technologies and current applications. It details challenges as well as various packaging and testing techniques.
This book introduces high power semiconductor laser packaging design, examining new technologies and current applications. It details challenges as well as various packaging and testing techniques.
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Introduction of High Power Semiconductor Lasers.- Overview of High Power
Semiconductor Laser Packages.- Thermal Design and Management in High Power
Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor
Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.-
Materials and Components in High Power Semiconductor Laser Packaging.-
Packaging Process of High Power Semiconductor Lasers.- Testing and
Characterization of High Power Semiconductor Lasers.- Failure Analysis and
Reliability Assessment in High Power Semiconductor Laser Packaging.-
Applications of High Power Semiconductor Lasers.- Development Trend and
Challenges in High Power Semiconductor Laser Packaging.
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xian Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
