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Phase Change Material-Based Heat Sinks: A Multi-Objective Perspective [Kõva köide]

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  • Formaat: Hardback, 197 pages, kõrgus x laius: 234x156 mm, kaal: 456 g, 21 Tables, black and white; 115 Illustrations, black and white
  • Ilmumisaeg: 02-Dec-2019
  • Kirjastus: CRC Press
  • ISBN-10: 0367344033
  • ISBN-13: 9780367344030
Teised raamatud teemal:
Phase Change Material-Based Heat Sinks: A Multi-Objective PerspectiveSuurem pilt
  • Formaat: Hardback, 197 pages, kõrgus x laius: 234x156 mm, kaal: 456 g, 21 Tables, black and white; 115 Illustrations, black and white
  • Ilmumisaeg: 02-Dec-2019
  • Kirjastus: CRC Press
  • ISBN-10: 0367344033
  • ISBN-13: 9780367344030
Teised raamatud teemal:
Püsilink: https://www.kriso.ee/db/9780367344030.html
Märksõnad:

Phase-change Material based heat sinks and associated optimization remains a topic of great interest, as evident from the increasing number of citations and new applications and miniaturization. Often the multi objective perspective of such heat sinks is ignored. This book introduces the readers to the PCM based heat sinks and Multi objective optimization. The authors have also included interesting in house experimental results on the "Rotating heat sinks" which is a first of a kind work. Useful to budding thermal researchers and practicing engineers in the field, this book is also a great start for students to understand the cooling applications in electronics and an asset to every library in a technical university. Since this book not only gives a critical review of the state of the art but also presents the authors' own results. The book will encourage, motivate and let the reader consider pursuing a research career in electronic cooling technologies.

Arvustused

An interesting book for researchers involved with designing heat sinks for electronics, especially high-power electronics (e.g. Si, SiC or GaN) power semiconductors since many of the applications that use these devices are limited by the device temperature during transient overcurrent. PCM may be able to extend the current range of many of these devices and lead to even higher current ratings, especially for wideband gap materials since they have a higher operating temperature rating than Si-based devices.

- IEEE Electrical Insulation Magazine, January / February Vol. 37, No. 1

Preface xiii
Symbols xvii
Notation xix
Acknowledgments xxi
Authors xxiii
1 Introduction
1(10)
1.1 Background
1(8)
1.1.1 Multi-objective optimization
8(1)
1.2 Organization of the book
9(1)
1.3 Closure
10(1)
2 Review of Literature
11(20)
2.1 Introduction
11(1)
2.2 Experimental investigations on PCM-based composite heat sinks
11(3)
2.3 Numerical studies on PCM-based finned heat sinks
14(3)
2.4 Optimization studies on PCM-based finned heat sinks
17(3)
2.5 Thermosyphon assisted melting of PCM
20(1)
2.6 Scope and objectives of the present study
21(9)
2.7 Closure
30(1)
3 Characterization of Pcm and Tces
31(4)
3.1 Introduction
31(1)
3.2 Selection of phase change material
31(2)
3.2.1 Sensible and latent heat time
33(1)
3.3 Thermal conductivity enhancer (TCE)
33(1)
3.4 Closure
34(1)
4 Experimental Setup and Instrumentation
35(18)
4.1 Introduction
35(4)
4.1.1 Heat sink design
36(2)
4.1.2 Thermocouple positions
38(1)
4.2 Uncertainty analysis
39(1)
4.3 Instrumentation for experimentation
40(5)
4.3.1 Data acquisition system
40(2)
4.3.2 Thermocouples
42(1)
4.3.3 Digital multimeter
42(1)
4.3.4 Constant temperature bath
43(1)
4.3.5 DC power source
43(1)
4.3.6 Experimental procedure
43(2)
4.4 Instrumentation for wireless temperature experiments on rotating heat sinks
45(7)
4.4.1 Wireless temperature measurement module
45(1)
4.4.2 Max31855 amplifier
45(1)
4.4.3 CIC magnetic base angle finder
46(1)
4.4.4 Accelerometer
46(1)
4.4.5 Fan with heat sink
47(1)
4.4.6 Tachometer
47(1)
4.4.7 Lithium polymer battery
47(3)
4.4.8 Arduino fio
50(1)
4.4.9 Calibration bath for wireless temperature circuit
50(1)
4.4.10 Testing of circuit
51(1)
4.4.11 Assembled wireless temperature integrated power circuit
51(1)
4.5 Closure
52(1)
5 Experimental Investigations On 72 Pin Fin Heat Sink With Discrete Heating
53(36)
5.1 Introduction
53(1)
5.2 Experimental setup and procedure
54(1)
5.3 Results and discussion
54(10)
5.3.1 Dimensionless number definition
54(2)
5.3.2 Effect of uniform heating on the thermal performance of heat sink
56(1)
5.3.3 Enhancement in the thermal performance due to PCM
57(1)
5.3.4 Effect of diagonal heating on the thermal performance of heat sink
58(1)
5.3.5 Effect of non-uniform heating on the thermal performance of heat sink
58(1)
5.3.6 Thermal performance of heat sink without PCM
59(1)
5.3.7 Effect of discrete heat source on time taken to reach set point temperature
60(4)
5.4 Heat transfer correlations
64(1)
5.5 Engineering usefulness of the correlation
65(4)
5.5.1 Performance of diagonal and planar heating at the base
67(1)
5.5.2 Comparison of uniform heating vs. non-uniform heating at the base
67(2)
5.6 Heat loss during experiments
69(4)
5.7 Sensible and latent heat accumulation for pin fin heat sink subject to discrete non-uniform heating
73(13)
5.7.1 Numerical model
73(1)
5.7.2 Governing equations
74(5)
5.7.3 Uniform heating
79(1)
5.7.4 Non-uniform heating
80(6)
5.8 Conclusions
86(1)
5.9 Closure
87(2)
6 Multi-Objective Optimization Algorithms For 72 Pin Fin Heat Sinks
89(24)
6.1 Introduction
89(1)
6.2 Application of multi-objective optimization algorithms
89(1)
6.3 Experimental results for 72 pin heat sinks with discrete heating
90(1)
6.4 Artificial neural network
91(3)
6.5 Optimization of discrete heat input of 72 pin fin heat sinks
94(3)
6.5.1 Latin hypercube sampling
96(1)
6.6 Goal programming
97(3)
6.6.1 Problem formulation
98(2)
6.7 Results obtained with non-dominated sorting genetic algorithm---NSGA-II
100(3)
6.8 Particle swarm optimization
103(1)
6.9 Brute-Force search
103(1)
6.10 Clustering of Pareto solutions
104(2)
6.11 Discussion
106(5)
6.12 Conclusions
111(1)
6.13 Closure
112(1)
7 Multi-Objective Geometric Optimization of a Pcm-Based Matrix Type Composite Heat Sink
113(26)
7.1 Introduction
113(1)
7.2 Experimental setup
114(2)
7.2.1 Uncertainty analysis
116(1)
7.3 Charging and discharging cycles
116(1)
7.4 Baseline comparison of heat sink with PCM to that of heat sink without PCM
117(5)
7.5 Numerical model
122(5)
7.5.1 Geometry and mesh
124(1)
7.5.2 Grid independence studies
124(1)
7.5.3 Boundary conditions
125(2)
7.6 Optimization
127(9)
7.6.1 Artificial neural network
128(3)
7.6.2 Multi-objective optimization
131(1)
7.6.3 Validation of optima
132(1)
7.6.4 Fluid flow and heat transfer characteristics of optimal configuration
133(3)
7.7 Conclusions
136(1)
7.8 Closure
137(2)
8 Experimental Investigation on Melting and Solidification of Phase Change Material-Based Cylindrical Heat Sinks
139(30)
8.1 Introduction
139(1)
8.2 Experimental setup
140(4)
8.2.1 Measurement of the cylinder surface temperature
141(2)
8.2.2 Measurement of rotational speed
143(1)
8.3 Heat loss during experiments
144(2)
8.4 Results and discussion
146(10)
8.4.1 Comparisons with the baseline
146(1)
8.4.2 Thermal performance of the unfinned heat sink
147(4)
8.4.2.1 Effect of rotation on the thermal performance of unfinned heat sink
151(1)
8.4.3 Thermal performance of the heat sink with a central stem
152(2)
8.4.4 Thermal performance of the finned heat sink
154(2)
8.5 Numerical analysis
156(6)
8.5.1 Analysis of a specific geometry (case 5)
160(1)
8.5.2 Analysis of centre line temperatures for cases 5 and 18
160(2)
8.6 Engineering perspective of the cylindrical heat sink configurations
162(4)
8.7 Conclusions
166(1)
8.8 Closure
167(2)
9 Thermosyphon Assisted Melting of Pcm Inside a Rectangular Enclosure: A Synergistic Numerical Approach
169(12)
9.1 Introduction
169(1)
9.2 Physical model
170(1)
9.3 Numerical procedure
171(2)
9.3.1 PCM
171(1)
9.3.2 Heat pipe
171(1)
9.3.3 Coupling
172(1)
9.4 Validation
173(1)
9.5 Results and discussion
174(5)
9.6 Conclusions
179(1)
9.7 Closure
179(2)
10 Conclusions and Scope for Future Work
181(4)
10.1 Introduction
181(2)
10.2 Major conclusions of the present study
183(1)
10.3 Suggestions for future work
184(1)
10.4 Closure
184(1)
Bibliography 185(8)
Index 193
Srikanth Rangarajan is currently a post-doctoral researcher at the State University of New York, Binghamton, NY. He has 7 papers published in international journals. He has also presented 6 papers in international conferences and has 1 patent filed from his doctoral research work.

C. Balaji is currently a Professor in the Department of Mechanical Engineering at Indian Institute of Technology (IIT) Madras, Chennai, India. He is the Editor in Chief of International Journal of Thermal Sciences.