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Reliability of Power Electronic Converter Systems [Kõva köide]

Edited by (Aalborg University, Department of Energy Technology, Denmark), Edited by (Aalborg University, Department of Energy Technology, Denmark), Edited by (City University of Hong Kong, Department of Electronic Engineering, Hong Kong), Edited by (University of Maryland, US)
  • Formaat: Hardback, 504 pages, kõrgus x laius: 234x156 mm
  • Sari: Energy Engineering
  • Ilmumisaeg: 07-Dec-2015
  • Kirjastus: Institution of Engineering and Technology
  • ISBN-10: 1849199019
  • ISBN-13: 9781849199018
Teised raamatud teemal:
Reliability of Power Electronic Converter SystemsSuurem pilt
  • Formaat: Hardback, 504 pages, kõrgus x laius: 234x156 mm
  • Sari: Energy Engineering
  • Ilmumisaeg: 07-Dec-2015
  • Kirjastus: Institution of Engineering and Technology
  • ISBN-10: 1849199019
  • ISBN-13: 9781849199018
Teised raamatud teemal:
Püsilink: https://www.kriso.ee/db/9781849199018.html
The main aims of power electronic converter systems (PECS) are to control, convert, and condition electrical power flow from one form to another through the use of solid state electronics. This book outlines current research into the scientific modeling, experimentation, and remedial measures for advancing the reliability, availability, system robustness, and maintainability of PECS at different levels of complexity.



Drawing on the experience of an international team of experts, this book explores the reliability of PECS covering topics including an introduction to reliability engineering in power electronic converter systems; anomaly detection and remaining-life prediction for power electronics; reliability of DC-link capacitors in power electronic converters; reliability of power electronics packaging; modeling for life-time prediction of power semiconductor modules; minimization of DC-link capacitance in power electronic converter systems; wind turbine systems; smart control strategies for improved reliability of power electronics system; lifetime modelling; power module lifetime test and state monitoring; tools for performance and reliability analysis of power electronics systems; fault-tolerant adjustable speed drive systems; mission profile-oriented reliability design in wind turbine and photovoltaic systems; reliability of power conversion systems in photovoltaic applications; power supplies for computers; and high-power converters.



Reliability of Power Electronic Converter Systems is essential reading for researchers, professionals and students working with power electronics and their applications, particularly those specialising in the development and application of power electronic converters and systems.

Arvustused

The timely and unique book Reliability of Power Electronic Converter Systems outlines current research on reliability of power conversion systems. It includes well-known metrics such as mean lifetime, mean time to failure, and mean time between failures; modeling concepts; physics of failure of power semiconductors; failure models; remaining useful life; point availability; failure mode, mechanism, and effects analysis (FMMEA) or failure mode and effects analysis (FMEA); and principal component analysis together with stochastic hybrid systems (SHS) models for performance and reliability analysis.



All chapters include a meaningful list of references at their end, as well as conclusions, a summary, and recommendations. A table of contents and index are also provided. Highlighting several pioneering reliability modeling, lifetime prediction, and converter designs for reliability, the book fosters further discussion, research, and development. It is suited for teachers, students, researchers, and professionals in the field of power electronics systems and their applications, as well as for researchers willing to contribute to cutting-edge concepts and technology in reliability enhancement, testing, and prediction in the power electronics field. -- Fernando A. Silva, PhD, Instituto Superior Técnico, Universidade de Lisboa, Portugal * IEEE Industrial Electronics Magazine * Reliability of Power Electronic Converter Systems is a book published by IET in 2015. This book is edited by four of well-known experts in power electronics and engineering reliability; Henry Shu-Hung Chung, a professor at City University of Hong Kong, Huai Wang, an associate professor, Frede Blaabjerg, a professor, at Alborg University and Michael Pecht, a professor, at University of Maryland, College Park. Despite the importance of reliability in design and control of power electronic converters, very few books have been published on this topic. The current book has been authored in sixteen chapters by a group of authors and editors from prestigious institutes. This book is a valuable resource in the field of power electronics reliability offering a rich bibliography and numerous case studies. Citing industrial standards such as MLT and IEC is a prominent feature of this book which makes it useful for whom working in relevant industries. -- Arash Hassanpour Isfahani * Bodo's Power Systems *

1 Reliability engineering in power electronic converter systems 1(30)
1.1 Performance factors of power electronic systems
1(5)
1.1.1 Power electronic converter systems
1(2)
1.1.2 Design objectives for power electronic converters
3(1)
1.1.3 Reliability requirements in typical power electronic applications
4(2)
1.2 Reliability engineering in power electronics
6(18)
1.2.1 Key terms and metrics in reliability engineering
6(5)
1.2.2 Historical development of power electronics and reliability engineering
11(4)
1.2.3 Physics of failure of power electronic components
15(2)
1.2.4 DFR of power electronic converter systems
17(3)
1.2.5 Accelerated testing concepts in reliability engineering
20(3)
1.2.6 Strategies to improve the reliability of power electronic converter systems
23(1)
1.3 Challenges and opportunities in research on power electronics reliability
24(2)
1.3.1 Challenges in power electronics reliability research
25(1)
1.3.2 Opportunities in power electronics reliability research
25(1)
References
26(5)
2 Anomaly detection and remaining life prediction for power electronics 31(28)
2.1 Introduction
31(1)
2.2 Failure models
32(4)
2.2.1 Time-dependent dielectric breakdown models
33(1)
2.2.2 Energy-based models
34(1)
2.2.3 Thermal cycling models
35(1)
2.3 FMMEA to identify failure mechanisms
36(3)
2.4 Data-driven methods for life prediction
39(14)
2.4.1 The variable reduction method
40(2)
2.4.2 Define failure threshold by Mahalanobis distance
42(4)
2.4.3 K-nearest neighbor classification
46(2)
2.4.4 Remaining life estimation-based particle filter parameter
48(3)
2.4.5 Data-driven anomaly detection and prognostics for electronic circuits
51(1)
2.4.6 Canary methods for anomaly detection and prognostics for electronic circuits
52(1)
2.5 Summary
53(1)
Acknowledgements
53(1)
References
53(6)
3 Reliability of DC-link capacitors in power electronic converters 59(24)
3.1 Capacitors for DC-links in power electronic converters
59(5)
3.1.1 The type of capacitors used for DC-links
59(1)
3.1.2 Comparison of different types of capacitors for DC-links
60(3)
3.1.3 Reliability challenges for capacitors in power electronic converters
63(1)
3.2 Failure mechanisms and lifetime models of capacitors
64(5)
3.2.1 Failure modes, failure mechanisms, and critical stressors of DC-link capacitors
64(2)
3.2.2 Lifetime models of DC-link capacitors
66(2)
3.2.3 Accelerated lifetime testing of DC-link capacitors under humidity conditions
68(1)
3.3 Reliability-oriented design for DC links
69(6)
3.3.1 Six types of capacitive DC-link design solutions
70(2)
3.3.2 A reliability-oriented design procedure of capacitive DC-links
72(3)
3.4 Condition monitoring of DC-link capacitors
75(2)
References
77(6)
4 Reliability of power electronic packaging 83(20)
4.1 Introduction
83(1)
4.2 Reliability concepts for power electronic packaging
84(1)
4.3 Reliability testing for power electronic packaging
85(5)
4.3.1 Thermal shock testing
86(1)
4.3.2 Temperature cycling
86(1)
4.3.3 Power cycling test
87(1)
4.3.4 Autoclave
88(1)
4.3.5 Gate dielectric reliability test
88(1)
4.3.6 Highly accelerated stress test
89(1)
4.3.7 High-temperature storage life (HSTL) test
89(1)
4.3.8 Burn-in test
89(1)
4.3.9 Other tests
90(1)
4.4 Power semiconductor package or module reliability
90(4)
4.4.1 Solder joint reliability
91(1)
4.4.2 Bond wire reliability
91(3)
4.5 Reliability of high-temperature power electronic modules
94(5)
4.5.1 Power substrate
95(1)
4.5.2 High-temperature die attach reliability
96(1)
4.5.3 Die top surface electrical interconnection
97(1)
4.5.4 Encapsulation
98(1)
4.6 Summary
99(1)
Acknowledgements
99(1)
References
99(4)
5 Modelling for the lifetime prediction of power semiconductor modules 103(38)
5.1 Accelerated cycling tests
105(1)
5.2 Dominant failure mechanisms
106(2)
5.3 Lifetime modelling
108(10)
5.3.1 Thermal modelling
108(2)
5.3.2 Empirical lifetime models
110(2)
5.3.3 Physics-based lifetime models
112(5)
5.3.4 Lifetime prediction based on PC lifetime models
117(1)
5.4 Physics-based lifetime estimation of solder joints within power semiconductor modules
118(6)
5.4.1 Stress—strain (hysteresis) solder behaviour
119(2)
5.4.2 Constitutive solder equations
121(2)
5.4.3 Clech's algorithm
123(1)
5.4.4 Energy-based lifetime modelling
123(1)
5.5 Example of physics-based lifetime modelling for solder joints
124(12)
5.5.1 Thermal simulation
125(2)
5.5.2 Stress—strain modelling
127(2)
5.5.3 Stress—strain analysis
129(1)
5.5.4 Model verification
130(2)
5.5.5 Lifetime curves extraction
132(1)
5.5.6 Model accuracy and parameter sensitivity
133(2)
5.5.7 Lifetime estimation tool
135(1)
5.6 Conclusions
136(1)
Acknowledgements
136(1)
References
137(4)
6 Minimization of DC-link capacitance in power electronic converter systems 141(24)
6.1 Introduction
141(2)
6.2 Performance tradeoff
143(2)
6.3 Passive approach
145(2)
6.3.1 Passive filtering techniques
145(1)
6.3.2 Ripple cancellation techniques
146(1)
6.4 Active approach
147(10)
6.4.1 Power decoupling techniques
147(7)
6.4.2 Ripple cancellation techniques
154(1)
6.4.3 Control and modulation techniques
155(1)
6.4.4 Specialized circuit structures
156(1)
6.5 Conclusions
157(1)
Acknowledgement
157(1)
References
157(8)
7 Wind turbine systems 165(30)
7.1 Introduction
165(1)
7.2 Review of main WT power electronic architectures
165(6)
7.2.1 Onshore and offshore
165(6)
7.3 Public domain knowledge of power electronic converter reliabilities
171(9)
7.3.1 Architecture reliability
171(3)
7.3.2 SCADA data
174(2)
7.3.3 Converter reliability
176(4)
7.4 Reliability FMEA for each assembly and comparative prospective reliabilities
180(6)
7.4.1 Introduction
180(1)
7.4.2 Assemblies
181(1)
7.4.3 Summary
181(5)
7.5 Root causes of failure
186(1)
7.6 Methods to improve WT converter reliability and availability
187(1)
7.6.1 Architecture
187(1)
7.6.2 Thermal management
187(1)
7.6.3 Control
187(1)
7.6.4 Monitoring
188(1)
7.7 Conclusions
188(1)
7.8 Recommendations
189(1)
Acknowledgements
189(1)
Terminology
189(3)
Abbreviations
192(1)
Variables
192(1)
References
193(2)
8 Active thermal control for improved reliability of power electronics systems 195(28)
8.1 Introduction
195(4)
8.1.1 Thermal stress and reliability of power electronics
195(3)
8.1.2 Concept of active thermal control for improved reliability
198(1)
8.2 Modulation strategies achieving better thermal loading
199(5)
8.2.1 Impacts of modulation strategies on thermal stress
199(1)
8.2.2 Modulations under normal conditions
200(2)
8.2.3 Modulations under fault conditions
202(2)
8.3 Reactive power control achieving better thermal cycling
204(8)
8.3.1 Impacts of reactive power
204(2)
8.3.2 Case study on the DFIG-based wind turbine system
206(4)
8.3.3 Study case in the paralleled converters
210(2)
8.4 Thermal control strategies utilizing active power
212(5)
8.4.1 Impacts of active power to the thermal stress
212(2)
8.4.2 Energy storage in large-scale wind power converters
214(3)
8.5 Conclusions
217(1)
Acknowledgements
217(1)
References
218(5)
9 Lifetime modeling and prediction of power devices 223(22)
9.1 Introduction
223(2)
9.2 Failure mechanisms of power modules
225(4)
9.2.1 Package-related mechanisms
225(2)
9.2.2 Burnout failures
227(2)
9.3 Lifetime metrology
229(4)
9.3.1 Lifetime and availability
229(1)
9.3.2 Exponential distribution
230(1)
9.3.3 Weibull distribution
231(1)
9.3.4 Redundancy
232(1)
9.4 Lifetime modeling and design of components
233(8)
9.4.1 Lifetime prediction based on mission profiles
233(1)
9.4.2 Modeling the lifetime of systems with constant failure rate
234(2)
9.4.3 Modeling the lifetime of systems submitted to low-cycle fatigue
236(5)
9.5 Summary and conclusions
241(1)
Acknowledgements
242(1)
References
242(3)
10 Power module lifetime test and state monitoring 245(42)
10.1 Overview of power cycling methods
245(1)
10.2 AC current PC
246(3)
10.2.1 Introduction
246(1)
10.2.2 Stressors in AC PC
247(2)
10.3 Wear-out status of PMs
249(7)
10.3.1 On-state voltage measurement method
250(3)
10.3.2 Current measurement
253(1)
10.3.3 Cooling temperature measurement
254(2)
10.4 Voltage evolution in IGBT and diode
256(6)
10.4.1 Application of vce,on monitoring
259(1)
10.4.2 Degradation and failure mechanisms
260(2)
10.4.3 Post-mortem investigation
262(1)
10.5 Chip temperature estimation
262(15)
10.5.1 Introduction
262(2)
10.5.2 Overview of junction temperature estimation methods
264(1)
10.5.3 vce,on-load current method
265(2)
10.5.4 Estimating temperature in converter operation
267(3)
10.5.5 Temperature measurement using direct method
270(4)
10.5.6 Estimated temperature evaluation
274(3)
10.6 Processing of state monitoring data
277(6)
10.6.1 Basic types of state data handling
278(3)
10.6.2 Application of state monitoring
281(2)
10.7 Conclusion
283(1)
Acknowledgement
283(1)
References
283(4)
11 Stochastic hybrid systems models for performance and reliability analysis of power electronic systems 287(16)
11.1 Introduction
287(2)
11.2 Fundamentals of SHS
289(6)
11.2.1 Evolution of continuous and discrete states
289(1)
11.2.2 Test functions, extended generator, and moment evolution
290(1)
11.2.3 Evolution of the dynamic-state moments
291(1)
11.2.4 Leveraging continuous-state moments for dynamic risk assessment
292(1)
11.2.5 Recovering Markov reliability and reward models from SHS
293(2)
11.3 Application of SHS to PV system economics
295(4)
11.4 Concluding remarks
299(1)
Acknowledgements
299(1)
References
299(4)
12 Fault-tolerant adjustable speed drive systems 303(52)
12.1 Introduction
303(1)
12.2 Factors affecting ASD reliability
304(2)
12.2.1 Power semiconductor devices
305(1)
12.2.2 Electrolytic capacitors
305(1)
12.2.3 Other auxiliary factors
305(1)
12.3 Fault-tolerant ASD system
306(1)
12.4 Converter fault isolation stage in fault-tolerant system design
307(1)
12.5 Control or hardware reconfiguration stage in fault-tolerant system design
308(32)
12.5.1 Topological techniques
311(7)
12.5.2 Software techniques
318(10)
12.5.3 Redundant hardware techniques
328(12)
12.6 Conclusion
340(8)
Acknowledgements
348(1)
References
348(7)
13 Mission profile-oriented reliability design in wind turbine and photovoltaic systems 355(36)
13.1 Mission profile for renewable energy systems
355(7)
13.1.1 Operational environment
355(2)
13.1.2 Grid demands
357(5)
13.2 Mission-profile-oriented reliability assessment
362(5)
13.2.1 Importance of thermal stress
363(1)
13.2.2 Lifetime model of power semiconductor
363(2)
13.2.3 Loading translation at various time scales
365(1)
13.2.4 Lifetime estimation approach
366(1)
13.3 Reliability assessment of wind turbine systems
367(6)
13.3.1 Lifetime estimation for wind power converter
368(4)
13.3.2 Mission profile effects on lifetime
372(1)
13.4 Reliability assessment of PV system
373(12)
13.4.1 PV inverter candidates
374(4)
13.4.2 Reliability assessment of single-phase PV systems
378(5)
13.4.3 Thermal-optimized operation of PV systems
383(2)
13.5 Summary
385(1)
Acknowledgements
386(1)
References
386(5)
14 Reliability of power conversion systems in photovoltaic applications 391(32)
14.1 Introduction to photovoltaic power systems
391(5)
14.1.1 DC/DC conversion
391(3)
14.1.2 DC/AC conversion
394(2)
14.2 Power conversion reliability in PV applications
396(7)
14.2.1 Capacitors
397(2)
14.2.2 IGBTs/MOSFETs
399(4)
14.3 Future reliability concerns
403(11)
14.3.1 Advanced inverter functionalities
404(5)
14.3.2 Large DC/AC ratios
409(2)
14.3.3 Module-level power electronics
411(3)
Acknowledgements
414(1)
References
414(9)
15 Reliability of power supplies for computers 423(28)
15.1 Purpose and requirements
423(5)
15.1.1 Design failure modes and effects analysis
424(4)
15.2 Thermal profile analysis
428(3)
15.3 De-rating analysis
431(2)
15.4 Capacitor life analysis
433(2)
15.4.1 Aluminum electrolytic capacitors
434(1)
15.4.2 Os-con type capacitors
435(1)
15.5 Fan life
435(3)
15.6 High accelerated life test
438(6)
15.6.1 Low temperature stress
440(1)
15.6.2 High temperature stress
441(1)
15.6.3 Vibration stress
441(2)
15.6.4 Combined temperature—vibration stress
443(1)
15.7 Vibration, shock, and drop test
444(1)
15.7.1 Vibration test
444(1)
15.7.2 Shock and drop test
445(1)
15.8 Manufacturing conformance testing
445(3)
15.8.1 The ongoing reliability testing
446(2)
15.9 Conclusions
448(1)
Acknowledgement
448(1)
References
448(3)
16 High-power converters 451(24)
16.1 High-power applications
451(1)
16.1.1 General overview
451(1)
16.2 Thyristor-based high-power devices
452(7)
16.2.1 Integrated gate-commutated thyristor (IGCT)
453(2)
16.2.2 Internally-commutated thyristor (ICT)
455(1)
16.2.3 Dual-ICT
455(2)
16.2.4 ETO/IETO
457(1)
16.2.5 Reliability of thyristor-based devices
458(1)
16.3 High-power inverter topologies
459(5)
16.3.1 Two-level converters
459(1)
16.3.2 Multi-level converters
460(4)
16.4 High-power dc—dc converter topologies
464(7)
16.4.1 DAB converter
464(5)
16.4.2 Modular dc—dc converter system
469(2)
References
471(4)
Index 475
Henry Shu-hung Chung is a Professor at the Department of Electronic Engineering, City University of Hong Kong and Director of the Centre for Smart Energy Conversion and Utilization Research. He is on the editorial boards of IEEE Transactions on Power Electronics and IEEE Journal of Emerging and Selected Topics on Power Electronics.



Huai Wang is an Associate Professor at the Department of Energy Technology, Aalborg University, Denmark. He is a work package leader at the Center of Reliable Power Electronics (CORPE) hosted by Aalborg University.



Frede Blaabjerg is a Professor in Power Electronics at the Department of Energy Technology, Aalborg University, Denmark. He is leading today the Center of Reliable Power Electronics (CORPE) hosted by Aalborg University.



Michael Pecht is an IEEE Fellow, an ASME Fellow, and an SAE Fellow. He is the Director of CALCE (Center for Advanced Life Cycle Engineering) and a Chair Professor at the University of Maryland.