| PREFACE. |
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| PART I INDIVIDUAL RF BLOCKS. |
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| 1 LNA (LOW NOISE AMPLIFIER). |
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1.2 Single-Ended Single Device LNA. |
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1.3 Single-Ended Cascode LNA. |
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1.4 LNA with AGC (Automatic Gain Control). |
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| 2 MIXERS. |
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| 3 DIFFERENTIAL PAIRS. |
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3.1 Why Differential Pairs? |
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3.2 Can DC Offset be Blocked by a Capacitor? |
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3.3 Fundamentals of Differential Pairs. |
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3.4 CMRR (Common Mode Rejection Ratio). |
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| 4 RF BALUN. |
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4.4 Micro Strip Line Baluns. |
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4.5 Mixed Types of Baluns. |
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| 5 TUNABLE FILTERS. |
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5.1 Tunable Filters in Communication Systems. |
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5.2 Coupling Between Two Tank Circuits. |
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5.4 Effect of Second Coupling. |
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6 VCO (VOLTAGE-CONTROLLED OSCILLATOR)6.1 “Three-Point” Type Oscillators. |
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6.2 Other Single-Ended Oscillators. |
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6.4 Design Example of a Single-Ended VCO. |
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6.5 Differential VCO and Quad Phases VCO. |
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| 7 POWER AMPLIFIERS (PA). |
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7.1 Classifi cations of Power Amplifiers. |
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7.2 Single-Ended PA Design. |
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7.3 Single-Ended PA-IC Design. |
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7.5 PA with Temperature Compensation. |
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7.6 PA with Output Power Control. |
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| PART II DESIGN TECHNOLOGIES AND SCHEMES. |
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| 8 DIFFERENT METHODOLOGY BETWEEN RF AND DIGITAL CIRCUIT DESIGN. |
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8.2 Differences between RF and Digital Blocks in a Communication System. |
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8.4 Notes for High-Speed Digital Circuit Design. |
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| 9 VOLTAGE AND POWER TRANSPORTATION. |
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9.1 Voltage Delivered from a Source to a Load. |
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9.2 Power Delivered from a Source to a Load. |
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9.3 Impedance Conjugate Matching. |
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9.4 Additional Effects of Impedance Matching. |
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| 10 IMPEDANCE MATCHING IN NARROW-BAND CASE. |
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10.2 Impedance Matching by Means of Return Loss Adjustment. |
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10.3 Impedance Matching Network Built of One Part. |
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10.4 Impedance Matching Network Built of Two Parts. |
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10.5 Impedance Matching Network Built of Three Parts. |
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10.6 Impedance Matching When ZS or ZL Is Not 50 Ω. |
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10.7 Parts in an Impedance Matching Network. |
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| 11 IMPEDANCE MATCHING IN A WIDE-BAND CASE. |
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11.1 Appearance of Narrow- and Wide-Band Return Loss on a Smith Chart. |
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11.2 Impedance Variation Due to Insertion of One Part per Arm or per Branch. |
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11.3 Impedance Variation Due to the Insertion of Two Parts per Arm or per Branch. |
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11.4 Impedance Matching in IQ Modulator Design for a UWB System. |
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11.5 Discussion of Wide-band Impedance Matching Networks. |
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| 12 IMPEDANCE AND GAIN OF A RAW DEVICE. |
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12.3 Small Signal Model of a Bipolar Transistor. |
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12.4 Bipolar Transistor with CE (Common Emitter) Configuration. |
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12.5 Bipolar Transistor with CB (Common Base) Configuration. |
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12.6 Bipolar Transistor with CC (Common Collector) Configuration..7 Small Signal Model of a MOSFET Transistor |
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12.8 Similarity between Bipolar and MOSFET Transistors. |
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12.9 MOSFET Transistor with CS (Common Source) Configuration. |
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12.10 MOSFET Transistor with CG (Common Gate) Configuration. |
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12.11 MOSFET Transistor with CD (Common Drain) Configuration. |
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12.12 Comparison of Bipolar and MOSFET Transistors in Various Configurations. |
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| 13 IMPEDANCE MEASUREMENT. |
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13.2 Scale and Vector Voltage Measurement. |
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13.3 Direct Impedance Measurement by Network Analyzer. |
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13.4 Alternative Impedance Measurement by Network Analyzer. |
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13.5 Impedance Measurement with the Assistance of a Circulator. |
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| 14 GROUNDING. |
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14.1 Implications of Grounding. |
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14.2 Possible Grounding Problems Hidden in a Schematic. |
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14.3 Imperfect or Inappropriate Grounding Examples. |
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14.5 Quarter Wavelength of Micro Strip Line. |
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| 15 EQUIPOTENTIALITY AND CURRENT COUPLING ON THE GROUND SURFACE. |
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15.1 Equipotentiality on the Ground Surface. |
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15.2 Forward and Return Current Coupling. |
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15.3 PCB or IC Chip with Multi-metallic Layers. |
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| 16 RFIC (RADIO FREQUENCY INTEGRATED CIRCUIT) AND SOC (SYSTEM ON CHIP). |
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16.1 Interference and Isolation. |
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16.2 Shielding for an RF Module by a Metallic Shielding Box. |
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16.3 Strong Desirability to Develop RFIC. |
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16.4 Interference Going Along an IC Substrate Path. |
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16.5 Solution for Interference Coming from the Sky. |
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16.6 Common Grounding Rules for an RF Module and RFIC Design. |
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16.7 Bottlenecks in RFIC Design. |
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| 17 MANUFACTURABILITY OF PRODUCT DESIGN. |
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17.2 Implication of 6σ Design. |
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17.3 Approaching 6σ Design. |
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17.4 Monte Carlo Analysis. |
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| PART III RF SYSTEM ANALYSIS. |
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| 18 MAIN PARAMETERS AND SYSTEM ANALYSIS IN RF CIRCUIT DESIGN. |
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18.6 Example of RF System Analysis. |
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| INDEX. 9780470405758
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