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Semiconductor Manufacturing Technology [Kõva köide]

(Former Associate Professor At Tamkang Univ & Nat'l Tsing Hua Univ, Taiwan)
Teised raamatud teemal:
Semiconductor Manufacturing TechnologySuurem pilt
Teised raamatud teemal:
Püsilink: https://www.kriso.ee/db/9789812568236.html
Märksõnad:
This textbook contains all the materials that an engineer needs to know to start a career in the semiconductor industry. It also provides readers with essential background information for semiconductor research. It is written by a professional who has been working in the field for over two decades and teaching the material to university students for the past 15 years. It includes process knowledge from raw material preparation to the passivation of chips in a modular format.
PREFACE v
ACKNOWLEDGMENTS vii
1. OVERVIEW
1
1.1. Classification of Materials
1
1.2. Evolution of Integrated Circuit (IC) Industry
4
1.3. From Design to Chips
8
1.4. The Wafer Substrate Manufacturing Flow
12
1.5. Wafer Processing Flow
19
1.6. What Is the Semiconductor Industry Trying to Achieve?
26
1.7. The Never-Ending Effort Yield Improvement
31
2. BUILDING BLOCKS FOR INTEGRATED CIRCUITS
38
2.1. Fundamental Semiconductor Concepts
38
2.2. Resistors
47
2.3. The pn Junctions
50
2.4. Capacitors
52
2.5. The MOS Transistor
55
2.6. Integrated Circuits
58
3. THERMAL OXIDATION
63
3.1. Introduction
63
3.2. Oxidation Mechanism and Modeling
68
3.3. Isolation Technology
78
3.4. Gate Oxide
86
3.5. Cleaning before Thermal Oxidation
91
4. GAS KINETICS AND PLASMA PHYSICS
97
4.1. Gas Kinetics and Ideal Gases
97
4.2. What Is Plasma? How Is It Formed?
104
4.3. Introduction to Plasma Physics
110
4.4. Electron Impact Phenomena
114
4.5. Fundamental Plasma Reactor Configurations
120
4.6. Magnetic Field Confinement
124
5. CHEMICAL VAPOR DEPOSITION
128
5.1. Classification of CVD Reactors and Films
128
5.2. CVD Reactor Design Concepts
133
5.3. CVD Reactor Modeling
136
5.4. Characterization of Thin Films
146
5.5. Applications of CVD Films
153
6. PLASMA-ENHANCED CHEMICAL VAPOR. DEPOSITION AND ETCHING
168
6.1. The Plasma Reaction Pathways and System Variables
168
6.2. Introduction to PECVD and Film Characterization
174
6.3. Applications of PECVD Films
178
6.4. Introduction to Plasma Etching
185
6.5. Applications of Plasma Etching
190
6.6. Plasma-Enhanced CVD and Etching Reactor Modeling
205
7. PATTERN TRANSFER: PHOTOLITHOGRAPHY
212
7.1. Introduction
212
7.2. Preexposure Steps
214
7.3. Resist Chemistry
222
7.4. Fundamentals of Image Formation
233
7.5. The Exposure System Evolution and Photoprocess Variations
250
7.6. Postexposure Steps
258
8. PATTERN GENERATION
260
8.1. Introduction
260
8.2. Electron Beam Writing and Resists
267
8.3. Back-End Processing for Mask Making
277
8.4. Resolution Enhancement Technology
289
9. DOPING TECHNOLOGY
304
9.1. Introduction
304
9.2. Dopant Diffusion
310
9.3. Ion Implantation
317
9.4. Implant Damages and Annealing
327
9.5. Applications of Doping Technology
332
10. METALLIZATION AND SILICIDATION 338
10.1. Introduction
338
10.2. Sputtering Systems
346
10.3. Aluminum Metal System
349
10.4. Meeting the Step Coverage Requirements
357
10.5. Why Silicides?
367
11. PLANARIZATION AND CMP TECHNOLOGY 378
11.1. Introduction
378
11.2. Interlayer Dielectrics
382
11.3. Spin on Glass
389
11.4. Intermetal Dielectrics
392
11.5. Introduction to Chemical Mechanical Polishing and Its Applications
398
11.6. CMP Modeling
409
12. COPPER AND LOW-k 411
12.1. Back-End Processes
411
12.2. Cu Wiring
415
12.3. Low-k Dielectrics
431
12.4. Integration of Copper and Low-k Materials
435
GLOSSARY 440
REFERENCES 453
INDEX 465