1 The Basics: Charge, Energy, Time, and Distance |
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1 | (12) |
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Background and Objectives |
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1 | (1) |
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1 | (2) |
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Consequences of the Basics |
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3 | (1) |
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Distance, Time, Speed, and c |
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4 | (1) |
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The Effect of Dielectrics |
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5 | (1) |
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6 | (1) |
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Lumped Versus Distributed |
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7 | (2) |
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9 | (1) |
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10 | (1) |
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11 | (2) |
2 Practical Matters: Circuit Boards and Debugging |
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13 | (12) |
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Background and Objectives |
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13 | (1) |
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Components and Component Packages |
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13 | (2) |
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Engineer's Notebook: More About Component Packaging |
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14 | (1) |
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15 | (2) |
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How Are Circuit Boards Made? |
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17 | (2) |
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How Are Circuit Boards Used to Make a Product? |
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19 | (3) |
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Backup: How Did We Get Here? |
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22 | (1) |
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How Are Circuit Boards Designed? |
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22 | (1) |
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The Board Is Dead. Now What? |
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23 | (1) |
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24 | (1) |
3 Gates, Packaging, and Boards: Properties and Modeling |
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25 | (12) |
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Background and Objectives |
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25 | (1) |
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What Limits What Is Possible? |
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25 | (2) |
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Power and Heat Dissipation |
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27 | (2) |
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29 | (1) |
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29 | (2) |
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31 | (1) |
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32 | (3) |
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Engineer's Notebook: More About Capacitors |
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34 | (1) |
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35 | (1) |
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36 | (1) |
4 Circuit Elements: Resistance, Capacitance, and Inductance |
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37 | (18) |
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Background and Objectives |
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37 | (1) |
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37 | (1) |
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38 | (4) |
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42 | (1) |
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43 | (3) |
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46 | (2) |
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48 | (1) |
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Inductance and Return Current |
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49 | (1) |
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Inductance and the Skin Effect |
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50 | (2) |
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52 | (3) |
5 Ground Bounce and Ringing |
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55 | (14) |
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Background and Objectives |
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55 | (1) |
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55 | (1) |
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56 | (3) |
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59 | (2) |
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Engineer's Notebook: The Ground Bounce Pulse |
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59 | (1) |
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Engineer's Notebook: The Self-Resetting Board |
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60 | (1) |
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61 | (1) |
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62 | (2) |
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64 | (1) |
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65 | (1) |
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So Where Is Ringing Seen and Not Seen Today? |
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65 | (1) |
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66 | (3) |
6 Distributed Analysis: Transmission Lines, Z0, Reflections, and Termination |
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69 | (22) |
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Background and Objectives |
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69 | (1) |
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Where Can You See a Transmission Line? |
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69 | (1) |
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Transmission Line: The View from the Inside |
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70 | (4) |
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Estimating Z0 in Common Situations |
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74 | (1) |
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Approximate Model of a Transmission Line |
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75 | (1) |
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The Left Hand and the Right Hand: Reflection and Transmission |
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76 | (5) |
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81 | (2) |
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Departures from the Ideal |
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83 | (3) |
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Fixing It When It's Broke |
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86 | (1) |
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Engineer's Notebook: The High-Speed Bus Disaster |
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86 | (1) |
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87 | (4) |
7 Lossy Transmission Lines |
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91 | (10) |
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Background and Objectives |
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91 | (1) |
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What Is Attenuation and How Is It Measured? |
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91 | (2) |
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Frequency-Dependent Attenuation |
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93 | (1) |
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93 | (1) |
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How Does Dielectric Loss Affect epsilon? |
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94 | (2) |
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How Does Dielectric Loss Affect Signal Propagation? |
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96 | (3) |
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99 | (2) |
8 Differential Signaling |
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101 | (10) |
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Background and Objectives |
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101 | (1) |
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What Is Differential Signaling and How Does It Help? |
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101 | (2) |
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103 | (2) |
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Obstacles: Clock Jitter and Common-Mode Signals |
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105 | (2) |
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Termination Strategies Revisited |
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107 | (2) |
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109 | (2) |
9 Crosstalk |
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111 | (10) |
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Background and Objectives |
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111 | (1) |
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111 | (2) |
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Near-End Versus Far-End Crosstalk |
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113 | (4) |
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Estimating and Reducing Crosstalk |
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117 | (1) |
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117 | (1) |
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Engineer's Notebook: Crosstalk Problems |
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118 | (1) |
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119 | (2) |
10 Power Distribution Network: Frequency Domain Analysis |
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121 | (16) |
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Background and Objectives |
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121 | (1) |
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The Power Distribution Network |
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121 | (2) |
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Power Supplies and Resonance |
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123 | (3) |
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Design Strategy: The Big Picture |
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126 | (1) |
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Design Strategy: The Details |
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127 | (3) |
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Design Strategy: The Role of Simulation |
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130 | (3) |
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Selecting Bypass Capacitors |
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133 | (1) |
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134 | (3) |
11 EMI/EMC: Design and Susceptibility |
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137 | (12) |
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Background and Objectives |
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137 | (1) |
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137 | (2) |
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139 | (4) |
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Engineering Notebook: Mounting Holes, Cable Shields, and Grounding |
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140 | (3) |
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143 | (1) |
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144 | (1) |
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Legal Certification: Standards and Test Requirements |
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145 | (2) |
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Engineering Notebook: Get Down Here Right Away |
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146 | (1) |
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147 | (2) |
12 Electrostatic Discharge |
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149 | (8) |
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Background and Objectives |
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149 | (1) |
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What Is Electrostatic Discharge? |
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149 | (1) |
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150 | (1) |
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ESD and Lightning Standards and Testing |
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151 | (1) |
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152 | (2) |
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Design Techniques to Manage ESD |
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154 | (1) |
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155 | (2) |
13 Clocks, Jitter, and Phased-Lock Loops |
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157 | (6) |
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Background and Objectives |
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157 | (1) |
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Clock Jitter and Clock Skew |
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157 | (1) |
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158 | (2) |
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Origins of Clock Jitter and Layout to Reduce It |
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160 | (1) |
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Engineer's Notebook: The Crystal Layout |
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161 | (1) |
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161 | (2) |
14 More Practical Matters: Testing, Debugging, DFX, and Quality Management |
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163 | (8) |
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Background and Objectives |
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163 | (1) |
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Testing a Board: The Oscilloscope |
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163 | (2) |
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Debugging a Board: Overview |
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165 | (1) |
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Transitioning to Mass Production |
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166 | (4) |
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Engineer's Notebook: Confusing Connectors |
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168 | (2) |
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Engineer's Notebook: Factory Fire |
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170 | (1) |
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170 | (1) |
15 Practical Matters III: Commercial and Legal Implications, Project Management, and Risk Mitigation |
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171 | (10) |
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Background and Objectives |
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171 | (1) |
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171 | (2) |
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Commercial Aspects of Design |
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173 | (3) |
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Engineering Notebook: Predicting What Comes Next |
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175 | (1) |
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176 | (1) |
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177 | (1) |
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178 | (1) |
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179 | (2) |
References |
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181 | |