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Signal Integrity: Applied Electromagnetics and Professional Practice 1st ed. 2016 [Kõva köide]

  • Formaat: Hardback, 181 pages, kõrgus x laius: 235x155 mm, kaal: 4144 g, 16 Tables, color; 1 Tables, black and white; 19 Illustrations, color; 44 Illustrations, black and white; X, 181 p. 63 illus., 19 illus. in color., 1 Hardback
  • Ilmumisaeg: 04-Apr-2016
  • Kirjastus: Springer International Publishing AG
  • ISBN-10: 3319297562
  • ISBN-13: 9783319297569
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  • Formaat: Hardback, 181 pages, kõrgus x laius: 235x155 mm, kaal: 4144 g, 16 Tables, color; 1 Tables, black and white; 19 Illustrations, color; 44 Illustrations, black and white; X, 181 p. 63 illus., 19 illus. in color., 1 Hardback
  • Ilmumisaeg: 04-Apr-2016
  • Kirjastus: Springer International Publishing AG
  • ISBN-10: 3319297562
  • ISBN-13: 9783319297569
Teised raamatud teemal:
This textbook teaches how to design working systems at very high frequencies. It is designed to introduce computer engineers to the design of extremely high speed digital systems. Combining an intuitive, physics-based approach to electromagnetics with a focus on solving realistic problems, the author presents concepts that are essential for computer and electrical engineers today. The book emphasizes an intuitive approach to electromagnetics, and then uses this foundation to show the reader how both physical phenomena can cause signals to propagate incorrectly; and how to solve commonly encountered issues. Emphasis is placed on real problems that the author has encountered in his professional career, integrating problem-solving strategies and real signal-integrity case studies throughout the presentation. Students are challenged to think about managing complex design projects and implementing successful engineering and manufacturing processes. Each chapter includes exercises to te

st concepts introduced.

Introduction.- The Basics - Charge, Energy, Time, and Distance.- Practical Matters I - Circuit Boards and Chassis Design, Testing and Debugging Boards.- Gates, Packaging, and Boards: Properties and Modeling.- Circuit Elements: Resistance, Capacitance, and Inductance.- Lumped Analysis: Return Current, Ground Bounce and Ringing.- Distributed Analysis: Transmission Lines, Z0, Reflections, Termination.- Lossy Transmission Lines.- Differential Signaling.- Crosstalk: NEXT and FEXT.- EMI/EMC: Design and Susceptibility.- ESD Electrostatic Discharge (ESD).- Clocks: Distribution, Jitter, PLL Design and Layout.- More Practical Matters - Testing, Debugging, DFX, and Quality Management.- Practical Matters III: Commercial and Legal Implications, Project Management, and Risk Mitigation.- Conclusion.
1 The Basics: Charge, Energy, Time, and Distance 1(12)
Background and Objectives
1(1)
Getting Back to Basics
1(2)
Consequences of the Basics
3(1)
Distance, Time, Speed, and c
4(1)
The Effect of Dielectrics
5(1)
Risetime
6(1)
Lumped Versus Distributed
7(2)
Combining Risetimes
9(1)
Knee Frequency
10(1)
Homework
11(2)
2 Practical Matters: Circuit Boards and Debugging 13(12)
Background and Objectives
13(1)
Components and Component Packages
13(2)
Engineer's Notebook: More About Component Packaging
14(1)
What Is a Circuit Board?
15(2)
How Are Circuit Boards Made?
17(2)
How Are Circuit Boards Used to Make a Product?
19(3)
Backup: How Did We Get Here?
22(1)
How Are Circuit Boards Designed?
22(1)
The Board Is Dead. Now What?
23(1)
Homework
24(1)
3 Gates, Packaging, and Boards: Properties and Modeling 25(12)
Background and Objectives
25(1)
What Limits What Is Possible?
25(2)
Power and Heat Dissipation
27(2)
Summarizing the Effects
29(1)
Simplest Gate Model
29(2)
Electrical Modeling
31(1)
The Modeling Process
32(3)
Engineer's Notebook: More About Capacitors
34(1)
The Limits of Modeling
35(1)
Homework
36(1)
4 Circuit Elements: Resistance, Capacitance, and Inductance 37(18)
Background and Objectives
37(1)
Reviewing the Review
37(1)
What Is Resistance?
38(4)
What Is Capacitance?
42(1)
Finding Capacitance
43(3)
What Is Inductance?
46(2)
Calculating Inductance
48(1)
Inductance and Return Current
49(1)
Inductance and the Skin Effect
50(2)
Homework
52(3)
5 Ground Bounce and Ringing 55(14)
Background and Objectives
55(1)
The Role of Inductance
55(1)
What Is Ground Bounce?
56(3)
Results of Ground Bounce
59(2)
Engineer's Notebook: The Ground Bounce Pulse
59(1)
Engineer's Notebook: The Self-Resetting Board
60(1)
Minimizing Ground Bounce
61(1)
What Is Ringing?
62(2)
Results of Ringing
64(1)
Minimizing Ringing
65(1)
So Where Is Ringing Seen and Not Seen Today?
65(1)
Homework
66(3)
6 Distributed Analysis: Transmission Lines, Z0, Reflections, and Termination 69(22)
Background and Objectives
69(1)
Where Can You See a Transmission Line?
69(1)
Transmission Line: The View from the Inside
70(4)
Estimating Z0 in Common Situations
74(1)
Approximate Model of a Transmission Line
75(1)
The Left Hand and the Right Hand: Reflection and Transmission
76(5)
Terminating Impedance
81(2)
Departures from the Ideal
83(3)
Fixing It When It's Broke
86(1)
Engineer's Notebook: The High-Speed Bus Disaster
86(1)
Homework
87(4)
7 Lossy Transmission Lines 91(10)
Background and Objectives
91(1)
What Is Attenuation and How Is It Measured?
91(2)
Frequency-Dependent Attenuation
93(1)
Dielectric Loss
93(1)
How Does Dielectric Loss Affect epsilon?
94(2)
How Does Dielectric Loss Affect Signal Propagation?
96(3)
Homework
99(2)
8 Differential Signaling 101(10)
Background and Objectives
101(1)
What Is Differential Signaling and How Does It Help?
101(2)
What Is Zdiff?
103(2)
Obstacles: Clock Jitter and Common-Mode Signals
105(2)
Termination Strategies Revisited
107(2)
Homework
109(2)
9 Crosstalk 111(10)
Background and Objectives
111(1)
What Is Crosstalk?
111(2)
Near-End Versus Far-End Crosstalk
113(4)
Estimating and Reducing Crosstalk
117(1)
Diagnosing Crosstalk
117(1)
Engineer's Notebook: Crosstalk Problems
118(1)
Homework
119(2)
10 Power Distribution Network: Frequency Domain Analysis 121(16)
Background and Objectives
121(1)
The Power Distribution Network
121(2)
Power Supplies and Resonance
123(3)
Design Strategy: The Big Picture
126(1)
Design Strategy: The Details
127(3)
Design Strategy: The Role of Simulation
130(3)
Selecting Bypass Capacitors
133(1)
Homework
134(3)
11 EMI/EMC: Design and Susceptibility 137(12)
Background and Objectives
137(1)
EMI/EMC
137(2)
Circuit-Board Design
139(4)
Engineering Notebook: Mounting Holes, Cable Shields, and Grounding
140(3)
Chassis
143(1)
Cabling
144(1)
Legal Certification: Standards and Test Requirements
145(2)
Engineering Notebook: Get Down Here Right Away
146(1)
Homework
147(2)
12 Electrostatic Discharge 149(8)
Background and Objectives
149(1)
What Is Electrostatic Discharge?
149(1)
Where Can ESD Occur?
150(1)
ESD and Lightning Standards and Testing
151(1)
Components to Manage ESD
152(2)
Design Techniques to Manage ESD
154(1)
Homework
155(2)
13 Clocks, Jitter, and Phased-Lock Loops 157(6)
Background and Objectives
157(1)
Clock Jitter and Clock Skew
157(1)
Clock Sources
158(2)
Origins of Clock Jitter and Layout to Reduce It
160(1)
Engineer's Notebook: The Crystal Layout
161(1)
Homework
161(2)
14 More Practical Matters: Testing, Debugging, DFX, and Quality Management 163(8)
Background and Objectives
163(1)
Testing a Board: The Oscilloscope
163(2)
Debugging a Board: Overview
165(1)
Transitioning to Mass Production
166(4)
Engineer's Notebook: Confusing Connectors
168(2)
Engineer's Notebook: Factory Fire
170(1)
Homework
170(1)
15 Practical Matters III: Commercial and Legal Implications, Project Management, and Risk Mitigation 171(10)
Background and Objectives
171(1)
Legal Aspects of Design
171(2)
Commercial Aspects of Design
173(3)
Engineering Notebook: Predicting What Comes Next
175(1)
Project Management
176(1)
Risk Mitigation
177(1)
Engineering Careers
178(1)
Homework
179(2)
References 181
Samuel H. Russ, Ph.D is an Associate Professor, Dept. of Electrical and Computer Engineering, University of South Alabama