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Surface Impedance Boundary Conditions: A Comprehensive Approach [Kõva köide]

(Nokia Inc, Tampere, Finland), (The University of Akron, Ohio, USA)
  • Formaat: Hardback, 412 pages, kõrgus x laius: 234x156 mm, kaal: 920 g, 10 Tables, black and white; 130 Illustrations, black and white
  • Ilmumisaeg: 28-Sep-2009
  • Kirjastus: CRC Press Inc
  • ISBN-10: 1420044893
  • ISBN-13: 9781420044898
  • Formaat: Hardback, 412 pages, kõrgus x laius: 234x156 mm, kaal: 920 g, 10 Tables, black and white; 130 Illustrations, black and white
  • Ilmumisaeg: 28-Sep-2009
  • Kirjastus: CRC Press Inc
  • ISBN-10: 1420044893
  • ISBN-13: 9781420044898
Surface Impedance Boundary Conditions is perhaps the first effort to formalize the concept of SIBC or to extend it to higher orders by providing a comprehensive, consistent, and thorough approach to the subject. The product of nearly 12 years of research on surface impedance, this book takes the mystery out of the largely overlooked SIBC. It provides an understanding that will help practitioners select, use, and develop these efficient modeling tools for their own applications. Use of SIBC has often been viewed as an esoteric issue, and they have been applied in a very limited way, incorporated in computation as an ad hoc means of simplifying the treatment for specific problems.

Apply a Surface Impedance "Toolbox" to Develop SIBCs for Any Application

The book not only outlines the need for SIBC but also offers a simple, systematic method for constructing SIBC of any order based on a perturbation approach. The formulation of the SIBC within common numerical techniquessuch as the boundary integral equations method, the finite element method, and the finite difference methodis discussed in detail and elucidated with specific examples. Since SIBC are often shunned because their implementation usually requires extensive modification of existing software, the authors have mitigated this problem by developing SIBCs, which can be incorporated within existing software without system modification.

The authors also present:











Conditions of applicability, and errors to be expected from SIBC inclusion





Analysis of theoretical arguments and mathematical relationships





Well-known numerical techniques and formulations of SIBC





A practical set of guidelines for evaluating SIBC feasibility and maximum errors their use will produce

A careful mix of theory and practical aspects, this is an excellent tool to help anyone acquire a solid grasp of SIBC and maximize their implementation potential.
Introduction xv
Classical Surface Impedance Boundary Conditions
1(26)
Introduction
1(1)
Skin Effect Approximation
2(6)
SIBCs of the Order of Leontovich's Approximation
8(2)
High-Order SIBCs
10(7)
Mitzner's Approach
10(7)
Rytov's Approach
17(10)
General
17(1)
Calculation of the Field inside the Conductor
18(3)
Boundary Conditions at the Conductor Surface
21(1)
Particular Case of a Planar Interface
22(1)
Notes on Applicability of the Method
23(2)
References
25(2)
General Perturbation Approach to Derivation of Surface Impedance Boundary Conditions
27(52)
Introduction
27(1)
Local Coordinates
28(7)
Perturbation Technique
35(6)
Tangential Components
41(4)
Normal Components
45(4)
Normal Derivatives
49(3)
Components of the Curl Operator
52(5)
Surface Impedance ``Toolbox'' Concept
57(8)
Numerical Example
65(14)
Calculation of (f3)η, (g2)ξκ, and (g2)η
73(3)
References
76(3)
SIBCs in Terms of Various Formalisms
79(36)
Introduction
79(1)
Basic Equations
79(1)
Electric Field-Magnetic Field Formalism
80(9)
Magnetic Scalar Potential Formalism
89(6)
Magnetic Vector Potential Formalism
95(7)
Common Representation of Various SIBCs Using a Surface Impedance Function
102(3)
Surface Impedance near Corners and Edges
105(10)
References
113(2)
Calculation of the Electromagnetic Field Characteristics in the Conductor's Skin Layer
115(20)
Introduction
115(1)
Distributions across the Skin Layer
116(11)
Resistance and Internal Inductance
127(4)
Forces Acting on the Conductor
131(4)
Derivation of SIBCs for Nonlinear and Nonhomogeneous Problems
135(32)
Introduction
135(1)
Coupled Electromagnetic-Thermal Problems
136(7)
Magnetic Materials
143(13)
Nonhomogeneous Conductors
156(11)
PEC-Backed Lossy Dielectric Layer
156(3)
Two-Layer Conducting Structure
159(6)
References
165(2)
Implementation of SIBCs for the Boundary Integral Equation Method: Low-Frequency Problems
167(54)
Introduction
167(2)
Two-Dimensional Problems
169(18)
E-H Formalism
169(7)
A-K Formalism
176(6)
Common Representation
182(5)
Three-Dimensional Problems
187(6)
Properties of the Surface Impedance Function
193(2)
Boundary Element Formulations for Two-and Three-Dimensional Problems in Invariant Form
195(9)
Numerical Examples
204(5)
Quasi-Three-Dimensional Integro-Differential Formulation for Symmetric Systems of Conductors
209(12)
References
218(3)
Implementation of SIBCs for the Boundary Integral Equation Method: High-Frequency Problems
221(42)
Introduction
221(1)
Integral Representations of High-Frequency Electromagnetic Fields
222(5)
SIBCs for Lossy Dielectrics
227(5)
Direct Implementation of SIBCs into the Surface Integral Equations
232(5)
Implementation Using the Perturbation Technique
237(11)
Numerical Example
248(15)
Efficient Evaluation of Time Convolution Integrals
255(5)
References
260(3)
Implementation of SIBCs for Volume Discretization Methods
263(36)
Introduction
263(1)
Statement of the Problem
264(1)
Finite-Difference Time-Domain Method
265(15)
Finite Integration Technique
280(10)
Finite-Element Method
290(9)
Basics of Contour-Path FDTD Method
294(2)
References
296(3)
Application and Experimental Validation of the SIBC Concept
299(38)
Introduction
299(1)
Selection of the Surface Impedance Boundary Conditions for a Given Problem
299(16)
Characteristic Values of the Problem
300(1)
Asymptotic Expansions
301(1)
Methodology
302(13)
Experimental Validation of SIBCs
315(22)
Physical Configuration
316(6)
Example: Reconstruction of Currents from Measured Magnetic Fields
322(6)
Example: Calculation of p.u.1. Parameters in Multiconductor Transmission Lines
328(7)
References
335(2)
Appendix A: Review of Numerical Methods
337(30)
Introduction
337(1)
Finite-Element Method
338(15)
Physical Equations
339(2)
Discretization
341(1)
Approximation
342(3)
Minimization
345(7)
Solution
352(1)
Postprocessing
353(1)
Finite-Difference Time-Domain Method
353(3)
Boundary-Element Method
356(11)
References
362(5)
Index 367
Sergey Yuferev was born in St. Petersburg, Russia, in 1964. He received his MSc in computational fluid mechanics from St. Petersburg Technical University, St. Petersburg, in 1987, and his Ph.D. in computational electromagnetic from the A.F. Ioffe Institute, St. Petersburg, in 1992. From 1987 to 1998, he worked at with the Dense Plasma Dynamics Laboratory, A.F. Ioffe Institute. From 1999 to 2000, he was a visiting associate professor at the University of Akron, Akron, Ohio. Since 2000, he has been with the Nokia Corporation, Tampere, Finland. His current research interests include numerical and analytical methods of computational electromagnetics and their application to electromagnetic compatibility and electromagnetic interference problems of mobile phones.

Nathan Ida is currently a distinguished professor of electrical and computer engineering at the University of Akron, Akron, Ohio. He teaches electromagnetics, antenna theory, electromagnetic compatibility, sensing and actuation, and computational methods and algorithms. His current research interests include numerical modeling of electromagnetic fields, electromagnetic wave propagation, theoretical issues in computation, and nondestructive testing of materials at low and microwave frequencies as well as in communications, especially, in low-power remote control and wireless sensing. He has published extensively on electromagnetic field computation, parallel and vector algorithms and computation, nondestructive testing of materials, surface impedance boundary conditions, and other topics. He is the author of three books and co-author of a fourth. Dr. Ida is a fellow of the IEEE and the American Society of Nondestructive Testing.