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Thin Film Transistors: Materials and Processes 2003 ed. [Multiple-component retail product]

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  • Formaat: Multiple-component retail product, 1016 pages, kõrgus x laius: 235x155 mm, kaal: 2286 g, XXVI, 1016 p. In 2 volumes, not available separately., 2 Items, Contains 2 hardbacks
  • Ilmumisaeg: 31-Dec-2003
  • Kirjastus: Kluwer Academic Publishers
  • ISBN-10: 1402075049
  • ISBN-13: 9781402075049
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  • Formaat: Multiple-component retail product, 1016 pages, kõrgus x laius: 235x155 mm, kaal: 2286 g, XXVI, 1016 p. In 2 volumes, not available separately., 2 Items, Contains 2 hardbacks
  • Ilmumisaeg: 31-Dec-2003
  • Kirjastus: Kluwer Academic Publishers
  • ISBN-10: 1402075049
  • ISBN-13: 9781402075049
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 List of Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 CHAPTER 4 a-Si:H TFT Structures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183 YueKuo 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183 2. Basic Structures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183 3. Simplified Structures and Processes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 4. Unique Structures and Processes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 5. Redundant Structures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195 6. Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 List of Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 CHAPTER 5 Deposition of Intrinsic and Doped Semiconductor Thin Films for a-Si:H TFT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 YueKuo 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 2. Semiconductor Layer Deposition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 3. Doped Amorphous and Microcrystalline Silicon . . . . . . . . . . . . . . . . . . . . . . 223 4. Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233 List of Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 CHAPTER 6 Deposition of Dielectric Thin Films for a-Si:H TFT . . . . . . . 241 YueKuo 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241 2. Selection of Dielectric Materials and Deposition Methods . . . . . . . 242 3. PECVD SiNx Dielectric Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244 4. Yield Issues Related to Dielectrics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263 5. Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267 List of Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271 CHAPTER 7 Plasma Etching in a-Si:H TFT Array Fabrication . . . . . . . . 273 YueKuo 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 2. Topics in Plama Etching of a-Si:H TFTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 Table of Contents Vll 3. Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 307 CHAPTER 8 Metallization in a-Si:H TFT Array Fabrication . . . . . . . . . . . . . 313 Ken-ichi Onisawa, Shinji Takayama, Yuzo Shigesato, Takuya Takahashi 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . 313 2. Basic Understanding of Conductor Lines in TFT LCDs . . . . . . . . 314 3. Conductor Requirements for a-Si:H TFTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 318 4. Conducting Materials for TFT Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321 5. Key Issues in Conducting Materials for Advanced TFT Array Fabrication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 6. Conductor Deposition for TFT Arrays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 337 7. Wet Etching of Conductors for a-Si:H TFT Arrays . . . . . . . . . . . . . . . . . 347 8. Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Table of Contents v
List of Contributors ix
Preface x
CHAPTER 1 Introduction 1(14)
Yue Kuo
1. Brief History of Thin Film Transistors
1(4)
2. a-Si:H TFT LCDs
5(5)
3. Unique a-Si:H TFT Issues
10(1)
4.
Chapter Flow in the Book
10(3)
References
13(2)
CHAPTER 2 a-Si:H TFT Thin Film and Substrate Materials 15(64)
Andrew J. Flewitt and William I. Milne
1. Introduction
15(1)
2. Semiconductors
16(24)
3. Dielectrics
40(13)
4. Substrates
53(3)
5. Characterization Techniques
56(12)
6. Summary
68(1)
References
69(6)
List of Symbols
75(4)
CHAPTER 3 Device Physics, Compact Modeling, and Circuit Applications of a-Si:H TFTs 79(104)
Arokia Nathan, Peyman Servati, Karim S. Karim, Denis Striakhdev, and Andrei Sazonov
1. Introduction
79(3)
2. Density of States and Electronic Transport
82(8)
3. Device Physics and Compact Modeling
90(43)
4. Threshold Voltage Metastibility
133(7)
5. Parameter Extraction
140(15)
6. Circuit Applications
155(13)
7. Summary
168(2)
References
170(6)
List of Symbols
176(7)
CHAPTER 4 a-Si:H TFT Structures 183(20)
Yue Kuo
1. Introduction
183(1)
2. Basic Structures
183(5)
3. Simplified Structures and Processes
188(4)
4. Unique Structures and Processes
192(3)
5. Redundant Structures
195(3)
6. Summary
198(2)
References
200(2)
List of Symbols
202(1)
CHAPTER 5 Deposition of Intrinsic and Doped Semiconductor Thin Films for a-Si:H TFT 203(38)
Yue Kuo
1. Introduction
203(3)
2. Semiconductor Layer Deposition
206(17)
3. Doped Amorphous and Microcrystalline Silicon
223(8)
4. Summary
231(2)
References
233(6)
List of Symbols
239(2)
CHAPTER 6 Deposition of Dielectric Thin Films for a-Si:H TFT 241(32)
Yue Kuo
1. Introduction
241(1)
2. Selection of Dielectric Materials and Deposition Methods
242(2)
3. PECVD SiNx Dielectric Layer
244(19)
4. Yield Issues Related to Dielectrics
263(2)
5. Summary
265(2)
References
267(4)
List of Symbols
271(2)
CHAPTER 7 Plasma Etching in a-Si:H TFT Array Fabrication 273(40)
Yue Kuo
1. Introduction
273(5)
2. Topics in Plama Etching of a-Si:H TFTs
278(28)
3. Summary
306(1)
References
307(6)
CHAPTER 8 Metallization in a-Si:H TFT Array Fabrication 313(64)
Ken-ichi Onisawa, Shinji Takayama, Yuzo Shigesato, Takuya Takahashi
1. Introduction
313(1)
2. Basic Understanding of Conductor Lines in TFT LCDs
314(4)
3. Conductor Requirements for a-Si:H TFTs
318(3)
4. Conducting Materials for TFT Array
321(3)
5. Key Issues in Conducting Materials for Advanced TFT Array Fabrication
324(13)
6. Conductor Deposition for TFT Arrays
337(10)
7. Wet Etching of Conductors for a-Si:H TFT Arrays
347(17)
8. Summary
364(2)
References
366(9)
List of Symbols
375(2)
CHAPTER 9 Catalytic Chemical Vapor Deposition of a-Si:H TFT 377(18)
Hideki Matsumura, Akira Izumi, and Atsushi Masuda
1. Introduction: Cat-CVD vs. PECVD
377(1)
2. History of Cat-CVD
378(1)
3. Fundamentals of Cat-CVD Technology
379(7)
4. Performance of Cat-CVD a-Si:H TFT
386(5)
5. Summary
391(1)
References
392(2)
List of Symbols
394(1)
CHAPTER 10 a-Si:H TFT-Based Active Matrix Flat-Panel Imagers for Medical X-ray Applications 395(90)
Larry Antonuk
1. Introduction and Background
395(9)
2. Basic Design and Operation of AMFPls
404(27)
3. Detailed Functioning and Properties of AMFPIs
431(37)
4. Summary and Outlook
468(4)
References
472(10)
List of Symbols
482(3)
CHAPTER 11 Non-LCD Applications of a-Si:H TFTs 485(22)
Yue Kuo
1. Introduction
485(1)
2. Medical Imagers
485(1)
3. Flat Panel Displays
486(5)
4. Contact Imagers, Scanners, and Printers
491(4)
5. Photo-Transistors
495(2)
6. Chemical Sensors
497(3)
7. Circuits on Various substrates
500(3)
8. Summary
503(1)
References
504(3)
Index 507
List of Contributors ix
Preface xi
CHAPTER 1 Introduction 1(7)
Yue Kuo
1. The Increase in Poly-Si TFT Activities
1(1)
2. Scientific and Technology Issues on Poly-Si TFTs
2(2)
3.
Chapter Flow in the Book
4(4)
CHAPTER 2 Poly-Si Thin Film and Substrate Materials 8(87)
Oliver Bonnaud, Tayeb Mohammed-Brahim, and Dieter G. Ast
1. Introduction
8(1)
2. Poly-Si Basic Material Properties for TFT Applications
9(43)
3. Dielectric Material Properties for Poly-Si TFT Applications
52(14)
4. Substrates
66(16)
5. Summary
82(2)
References
84(8)
List of Symbols
92(3)
CHAPTER 3 Physics and Modeling of Poly-, Micro-, and Nano-Si TFTs
Benjamin Iniguez, Trond Ytterdal, Tor A. Fjeldy, and Michael S. Shur
1. Introduction
95(1)
2. Physics of Poly-Si TFTs
96(7)
3. Poly-Si TFT Device Models
103(17)
4. Micro- and Nano-Crystalline Silicon TFTs
120(13)
5. Circuit Simulation Examples
133(4)
6. Summary
137(1)
References
138(4)
List of Symbols
142(3)
CHAPTER 4 Poly-Si TFT Structures 145(31)
Ryoichi Ishihara
1. Introduction
145(1)
2. Basic TFT Structures
146(12)
3. Drain Engineering
158(7)
4. Novel TFT Structures
165(5)
5. Summary
170(1)
References
171(4)
List of Symbols
175(1)
CHAPTER 5 Poly-Si TFTs by Laser Crystallization Methods 176(44)
Toshiyuki Sameshima
1. Introduction
176(1)
2. History
176(1)
3. Pulsed Laser Heating and Rapid Crystallization
177(7)
4. Structural and Electrical Properties
184(22)
5. Poly-Si TFT Fabrication and its Characteristics
206(4)
6. Large Crystalline Grain
210(1)
7. CW Laser Crystallization
211(1)
8. Summary
212(2)
References
214(5)
List of Symbols
219(1)
CHAPTER 6 Poly-Si TFTs by Non-Laser Crystallization Methods 220(54)
Jin Jang
1. Introduction
220(1)
2. Solid Phase Crystallization (SPC) by Thermal Methods
221(9)
3. Metal Induced Crystallization of a-Si
230(24)
4. Non-Metal Induced Crystallization
254(6)
5. Summary
260(1)
References
261(9)
List of Symbols
270(4)
CHAPTER 7 Poly-Si TFTs by Direct Deposition Methods 274(19)
Jin Jang
1. Introduction
274(2)
2. Plasma Enhanced Chemical Vapor Deposition of Poly-Si
276(6)
3. Sputtering
282(1)
4. Low Pressure Chemical Vapor Deposition
283(3)
5. Summary
286(2)
References
288(3)
List of Symbols
291(2)
CHAPTER 8 Doping Techniques for Poly-Si TFTs 293(14)
Shuichi Uchikoga
1. Introduction
293(1)
2. Impact of Doping Techniques
294(3)
3. Doping Methods
297(3)
4. Activation of Dopant Methods
300(2)
5. Summary
302(2)
References
304(1)
List of Symbols
305(2)
CHAPTER 9 Gate Insulators for Poly-Si TFTs 307(17)
Shuichi Uchikoga
1. Introduction
307(1)
2. Required Features for Low Temperature Gate insulators
308(2)
3. Oxide Formation
310(5)
4. Electrical Properties
315(3)
5. Summary
318(2)
References
320(2)
List of Symbols
322(2)
CHAPTER 10 Process Integration Issues for Poly-Si TFT Fabrication 324(36)
Seiichiro Higashi
1. Introduction
324(2)
2. Key Process Integration Issues
326(19)
3. Poly-Si TFT Performances
345(9)
4. Summary
354(1)
References
355(3)
List of Symbols
358(2)
CHAPTER 11 Poly-Si TFT Drivers 360(66)
Byong-Deok Choi, Inhwan Lee, and Oh-Kong Kwon
1. Introduction
360(6)
2. Poly-Si TFT Device Characteristics for High Performance Display Drivers
366(6)
3. Poly-Si TFT LCD Data Drivers
372(29)
4. Low Power Consumption Driving Techniques and Circuit Design Using Poly-Si TFT
401(6)
5. Fault-tolerant Poly-Si TFT Circuits
407(2)
6. Poly-Si TFT for Organic EL Display: Pixel Design
409(7)
7. Comparison of Poly-Si TFT Driver Circuits and a-Si:H TFT Driver Circuits
416(4)
8. Summary
420(1)
References
421(3)
List of Symbols
424(2)
CHAPTER 12 Approaches to Poly-Si TFTs on Flexible substrates 426(38)
Youngchul Lee and Stephen J. Fonash
1. Introduction
426(2)
2. Substrate Materials
428(3)
3. Direct Fabrication on Flexible substrates
431(16)
4. Separation and Transfer Approaches
447(6)
5. Reliability of Poly-Si TFTs on Flexible Substrates
453(5)
6. Summary
458(1)
References
459(3)
List of Symbols
462(2)
CHAPTER 13 Poly-Si TFTs for non-LCD Applications 464(33)
Yue Kuo
1. Introduction
464(1)
2. Applications in VLSIC
465(12)
3. Non-VLSIC Applications
477(15)
4. Summary
492(1)
References
493(3)
List of Symbols
496(1)
INDEX 497