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VLSI Electronics: Microstructure, Volume 22, Very Large Scale Integration Reliability [Kõva köide]

  • Formaat: Hardback, 207 pages, kõrgus x laius: 235x155 mm, kaal: 450 g
  • Sari: VLSI Electronics Microstructure Science
  • Ilmumisaeg: 18-May-1990
  • Kirjastus: Academic Press Inc
  • ISBN-10: 0122341228
  • ISBN-13: 9780122341229
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VLSI Electronics: Microstructure, Volume 22, Very Large Scale Integration Reliability
  • Formaat: Hardback, 207 pages, kõrgus x laius: 235x155 mm, kaal: 450 g
  • Sari: VLSI Electronics Microstructure Science
  • Ilmumisaeg: 18-May-1990
  • Kirjastus: Academic Press Inc
  • ISBN-10: 0122341228
  • ISBN-13: 9780122341229
Most of the literature on the subject of IC reliability emphasizes the theoretical aspects. This book offers managers and engineers insight into the practical aspects of VLSI reliability, from basic concepts to packaging issues. Other topics covered include failure analysis techniques, radiation effects, and reliability assurance and qualification. An extensive list of references is provided at the end of each chapter. Annotation copyright Book News, Inc. Portland, Or.

Arvustused

Dr. Sabnis has provided a broad overview of the major failure mechanisms afflicting modern semiconductor devices, and he has compiled a carefully selected list of references for each subject. He has also summarized many of the methods developed over time to evaluate reliability of these devices. I strongly recommend this book to all those*bMboth neophytes and experts*bMinvolved in the design, fabrication, and application of integrated circuits. --From the Foreword by Carl W. Green, Head, IC Test Technology, AT&T Bell Laboratories

Introduction. Reliability Concepts and Modeling. Electrostatic Discharge
Damage. Metal Electromigration. Dielectric Breakdown. Instabilities in ICs.
Packaging Related Reliability Issues. Reliability Assurance and
Qualification. Each chapter includes references. Index.