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    • 1. Stress Management for 3D ICS Using Through Silicon Vias 2011 ed.

    • Sari: AIP Conference Proceedings / Materials Physics and Applications
    • (Ilmumisaeg: 23-Nov-2011, Paperback / softback, Kirjastus: American Institute of Physics, ISBN-13: 9780735409385)
    • Scientist and engineers as well as graduate students in the fields of This conference will be of interest to anyone involved in Physics, Electrical Engineering, Materials Science and Engineering, Reliability and Quality Management, both in industry a... Loe edasi...
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  • Märksõna: Strains and stresses - Congresses - Simulation methods
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