Preface |
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xi | |
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Chapter 1 Microstrip Lines I: Quasi-Static Analyses, Dispersion Models, and Measurements |
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1 | (58) |
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1 | (4) |
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1.1.1 Planar Transmission Structures |
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1 | (2) |
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1.1.2 Microstrip Field Configuration |
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3 | (1) |
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1.1.3 Methods of Microstrip Analysis |
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4 | (1) |
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1.2 Quasi-Static Analyses of a Microstrip |
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5 | (16) |
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1.2.1 Modified Conformal Transformation Method |
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6 | (5) |
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1.2.2 Finite Difference Method |
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11 | (1) |
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1.2.3 Integral Equation Method |
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12 | (2) |
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1.2.4 Variational Method in the Fourier Transform Domain |
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14 | (2) |
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1.2.5 Segmentation and Boundary Element Method (SBEM) |
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16 | (5) |
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1.3 Microstrip Dispersion Models |
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21 | (8) |
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1.3.1 Coupled TEM Mode and TM Mode Model |
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21 | (1) |
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1.3.2 An Empirical Relation |
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22 | (1) |
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1.3.3 Dielectric-Loaded Ridged Waveguide Model |
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22 | (2) |
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1.3.4 Empirical Formulae for Broad Frequency Range |
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24 | (2) |
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1.3.5 Planar Waveguide Model |
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26 | (1) |
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27 | (2) |
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1.4 Microstrip Transitions |
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29 | (6) |
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1.4.1 Coaxial-to-Microstrip Transition |
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30 | (1) |
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1.4.2 Waveguide-to-Microstrip Transition |
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31 | (4) |
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1.5 Microstrip Measurements |
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35 | (11) |
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1.5.1 Substrate Dielectric Constant |
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36 | (5) |
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1.5.2 Characteristic Impendance |
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41 | (1) |
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1.5.3 Phase Velocity or Effective Dielectric Constant |
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42 | (3) |
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1.5.4 Attenuation Constant |
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45 | (1) |
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46 | (13) |
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1.6.1 Printed Circuit Technologies |
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47 | (1) |
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1.6.2 Hybrid Microwave Integrated Circuits |
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48 | (3) |
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1.6.3 Monolithic Integrated Circuit Technologies |
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51 | (2) |
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53 | (6) |
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Chapter 2 Microstrip Lines II: Fullwave Analyses, Design Considerations, and Applications |
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59 | (80) |
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2.1 Methods of Fullwave Analysis |
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59 | (1) |
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2.2 Analysis of an Open Microstrip |
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60 | (8) |
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2.2.1 Integral Equation Method in the Space Domain |
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62 | (2) |
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2.2.2 Galerkin's Method in the Spectral Domain |
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64 | (1) |
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2.2.3 Discussion of Results |
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65 | (3) |
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2.3 Analysis of an Enclosed Microstrip |
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68 | (9) |
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2.3.1 Integral Equation Methods |
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69 | (4) |
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2.3.2 Finite Difference Method |
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73 | (2) |
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2.3.3 Discussion of Results |
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75 | (2) |
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2.4 Design Considerations |
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77 | (32) |
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78 | (4) |
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2.4.2 Power Handling Capability |
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82 | (7) |
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2.4.3 Effect of Tolerances |
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89 | (2) |
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2.4.4 Effect of Dielectric Anisotropy |
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91 | (3) |
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94 | (9) |
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2.4.6 Frequency Range of Operation |
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103 | (3) |
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2.4.7 Lumped Element Model of Microstrip Interconnect |
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106 | (3) |
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2.5 Other Types of Microstrip Lines |
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109 | (14) |
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2.5.1 Suspended and Inverted Microstrip Lines |
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109 | (1) |
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2.5.2 Multilayered Dielectric Microstrip |
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110 | (4) |
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2.5.3 Thin Film Microstrip (TFM) |
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114 | (2) |
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2.5.4 Valley Microstrip Lines |
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116 | (1) |
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2.5.5 Buried Microstrip Line |
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117 | (1) |
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2.5.6 Superconducting Microstrip Circuits |
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117 | (6) |
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2.6 Microstrip Applications |
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123 | (16) |
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123 | (3) |
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126 | (3) |
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129 | (1) |
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2.6.4 Packages and Assemblies |
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130 | (1) |
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131 | (8) |
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Chapter 3 Microstrip Discontinuities I: Quasi-Static Analysis and Characterization |
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139 | (50) |
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139 | (1) |
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3.2 Discontinuity Capacitance Evaluation |
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140 | (14) |
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3.2.1 Matrix Inversion Method |
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141 | (5) |
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146 | (3) |
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3.2.3 Galerkin's Method in the Fourier Transform Domain |
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149 | (2) |
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3.2.4 Use of Line Sources with Charge Reversal |
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151 | (3) |
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3.3 Discontinuity Inductance Evaluation |
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154 | (2) |
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3.4 Characterization of Various Discontinuities |
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156 | (24) |
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157 | (3) |
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3.4.2 Gaps in a Microstrip |
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160 | (5) |
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165 | (4) |
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169 | (1) |
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170 | (4) |
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174 | (2) |
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176 | (2) |
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3.4.8 RF Short and Via Hole |
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178 | (2) |
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3.5 Compensated Microstrip Discontinuities |
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180 | (9) |
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180 | (1) |
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181 | (1) |
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182 | (3) |
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185 | (4) |
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Chapter 4 Microstrip Discontinuities II: Fullwave Analysis and Measurements |
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189 | (50) |
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4.1 Planar Waveguide Analysis |
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189 | (29) |
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4.1.1 Discontinuity Characterization |
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189 | (19) |
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4.1.2 Compensation of Discontinuity Reactances |
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208 | (1) |
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4.1.3 Radiation and Parasitic Coupling |
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209 | (9) |
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4.2 Fullwave Analysis of Discontinuities |
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218 | (9) |
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4.2.1 Galerkin's Method in the Spectral Domain |
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219 | (3) |
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4.2.2 Integral Equation Solution in the Space Domain |
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222 | (1) |
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4.2.3 Time Domain Methods for Microstrip Discontinuity Characterization |
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223 | (4) |
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4.3 Discontinuity Measurements |
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227 | (12) |
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4.3.1 Linear Resonator Method |
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228 | (4) |
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4.3.2 Ring Resonator Method |
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232 | (3) |
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4.3.3 Scattering Parameters Measurement Method |
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235 | (1) |
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236 | (3) |
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239 | (66) |
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239 | (1) |
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239 | (12) |
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5.2.1 Approximate Analysis |
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241 | (2) |
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5.2.2 Transverse Resonance Method |
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243 | (3) |
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5.2.3 Galerkin's Method in the Spectral Domain |
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246 | (5) |
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5.3 Design Considerations |
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251 | (7) |
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5.3.1 Closed-Form Expressions |
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251 | (3) |
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5.3.2 Effect of Metal Thickness |
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254 | (1) |
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5.3.3 Effect of Tolerances |
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255 | (1) |
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256 | (2) |
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5.4 Slotline Discontinuities |
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258 | (4) |
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5.4.1 Short End Discontinuty |
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258 | (1) |
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5.4.2 Open End Discontinuity |
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259 | (3) |
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262 | (6) |
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5.5.1 Coupled Microstrip-Slotline |
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262 | (1) |
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5.5.2 Conductor-Backed Slotline |
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263 | (3) |
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5.5.3 Conductor-Backed Slotline with Superstrate |
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266 | (1) |
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5.5.4 Slotlines with Double-Layered Dielectric |
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267 | (1) |
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268 | (10) |
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5.6.1 Coaxial-to-Slotline Transition |
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268 | (3) |
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5.6.2 Microstrip-to-Slotline Cross-Junction Transition |
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271 | (7) |
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5.7 Slotline Applications |
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278 | (27) |
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5.7.1 Circuits Using T-Junctions |
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278 | (9) |
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5.7.2 Circuits Using Wideband 180° Phase Shift |
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287 | (2) |
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5.7.3 Hybrid/de Ronde's Branchline Couplers |
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289 | (7) |
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5.7.4 Other Types of Slotline Circuits |
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296 | (1) |
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297 | (8) |
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Chapter 6 Defected Ground Structure (DGS) |
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305 | (42) |
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305 | (6) |
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6.1.1 Basic Structure of DGS |
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306 | (3) |
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6.1.2 Unit Cell and Periodic DGS |
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309 | (2) |
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6.1.3 Advantages and Disadvantages of DGS |
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311 | (1) |
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311 | (9) |
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6.2.1 Stop-Band Properties |
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312 | (2) |
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6.2.2 Slow-Wave Propagation |
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314 | (5) |
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6.2.3 Realization of Transmission Lines with High Characteristic Impedance |
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319 | (1) |
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320 | (6) |
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320 | (1) |
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6.3.2 Equivalent Circuit Models |
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320 | (6) |
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326 | (21) |
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327 | (6) |
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6.4.2 Other DGS-Based Passive Components |
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333 | (5) |
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6.4.3 DGS-Based Active Circuits |
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338 | (2) |
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340 | (3) |
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343 | (4) |
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Chapter 7 Coplanar Lines: Coplanar Waveguide and Coplanar Strips |
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347 | (86) |
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347 | (4) |
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351 | (29) |
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7.2.1 Quasi-Static Conformal Mapping Analysis of CPW |
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351 | (18) |
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7.2.2 Quasi-Static Conformal Mapping Analysis of CPS |
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369 | (6) |
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375 | (5) |
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7.3 Design Considerations |
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380 | (6) |
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381 | (1) |
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381 | (2) |
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7.3.3 Effect of Metallization Thickness |
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383 | (3) |
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7.4 Losses in Coplanar Lines |
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386 | (10) |
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386 | (1) |
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387 | (6) |
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7.4.3 Radiation and Surface Wave Losses |
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393 | (3) |
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396 | (3) |
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7.6 Comparison with Microstrip Line and Slotline |
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399 | (2) |
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401 | (9) |
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7.7.1 Coax-to-CPW Transitions |
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401 | (2) |
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7.7.2 Microstrip-to-CPS Transitions |
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403 | (2) |
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7.7.3 Microstrip-to-CPW Transition |
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405 | (1) |
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7.7.4 CPW-to-CPS Transitions |
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406 | (1) |
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7.7.5 CPS-to-Slotline Transitions |
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406 | (1) |
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7.7.6 Slotline-to-CPW Transitions |
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407 | (3) |
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7.8 Discontinuities in Coplanar Lines |
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410 | (7) |
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7.8.1 CAD Models for Discontinuities in Coplanar Waveguide Circuits |
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410 | (5) |
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7.8.2 CAD Models for Discontinuities in Coplanar Strips Circuits |
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415 | (2) |
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7.9 Coplanar Line Circuits |
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417 | (16) |
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7.9.1 Circuits with Series and Shunt Reactances in CPW |
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418 | (2) |
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7.9.2 Circuits Using Slotline-CPW Junctions |
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420 | (5) |
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425 | (8) |
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Chapter 8 Coupled Microstrip Lines |
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433 | (64) |
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433 | (1) |
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8.2 General Analysis of Coupled Lines |
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434 | (8) |
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8.2.1 Methods of Analysis |
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434 | (1) |
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8.2.2 Coupled Mode Approach |
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435 | (4) |
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8.2.3 Even- and Odd-Mode Approach |
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439 | (3) |
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8.3 Characteristics of Coupled Microstrip Lines |
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442 | (17) |
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8.3.1 Quasi-Static Analysis |
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442 | (7) |
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449 | (7) |
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456 | (3) |
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8.4 Measurements on Coupled Microstrip Lines |
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459 | (2) |
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8.4.1 Impedance Measurements |
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459 | (1) |
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8.4.2 Phase Constant Measurements |
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460 | (1) |
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8.5 Design Considerations for Coupled Microstrip Lines |
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461 | (17) |
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462 | (7) |
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469 | (4) |
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8.5.3 Effect of Fabrication Tolerances |
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473 | (1) |
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8.5.4 Coupled Microstrip Lines with Dielectric Overlays |
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474 | (4) |
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8.5.5 Effect of Dielectric Anisotropy |
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478 | (1) |
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8.6 Slot-Coupled Microstrip Lines |
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478 | (5) |
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8.7 Coupled Multiconductor Microstrip Lines |
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483 | (2) |
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8.8 Discontinuities in Coupled Microstrip Lines |
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485 | (12) |
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485 | (5) |
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8.8.2 Open-End Discontinuity |
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490 | (1) |
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491 | (6) |
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Chapter 9 Substrate Integrated Waveguide (SIW) |
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497 | (70) |
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497 | (3) |
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498 | (1) |
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9.1.2 Operation Principle |
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499 | (1) |
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9.2 Analysis Techniques of SIW |
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500 | (26) |
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9.2.1 Equivalent Rectangular Waveguide |
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500 | (3) |
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9.2.2 Full-wave Modeling of SIW Interconnects |
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503 | (10) |
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9.2.3 Full-wave Modeling of SIW Components |
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513 | (8) |
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9.2.4 Equivalent Circuits Models of SIW Discontinuities |
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521 | (5) |
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9.3 Design Considerations |
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526 | (7) |
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526 | (5) |
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9.3.2 Guided-wave and Leaky-wave Regions of Operation |
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531 | (1) |
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9.3.3 Band-gap Effects in SIW Structures |
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532 | (1) |
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533 | (1) |
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9.4 Other SIW Configurations |
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533 | (7) |
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9.4.1 Substrate Integrated Folded Waveguide (SIFW) |
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534 | (1) |
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9.4.2 Half-Mode Substrate Integrated Waveguide (HMSIW) |
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535 | (1) |
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9.4.3 Substrate Integrated Slab Waveguide (SISW) |
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536 | (2) |
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9.4.4 Substrate Integrated Ridge Waveguide (SIRW) |
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538 | (2) |
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9.5 Transitions Between SIW and Planar Transmission Lines |
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540 | (1) |
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9.5.1 Microstrip-to-SIW Transitions |
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540 | (1) |
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9.5.2 CPW-to-SIW Transitions |
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541 | (1) |
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9.6 SIW Components and Antennas |
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541 | (14) |
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543 | (4) |
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547 | (3) |
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550 | (3) |
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9.6.4 System-on-Substrate (SoS) |
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553 | (2) |
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9.7 Fabrication Technologies and Materials |
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555 | (12) |
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9.7.1 Fabrication by PCB and LTCC Technologies |
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555 | (2) |
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9.7.2 Integration of SIW on Silicon |
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557 | (1) |
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9.7.3 Use of Novel Substrate Materials |
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557 | (2) |
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9.7.4 Solutions for High Frequency Operation of SIW |
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559 | (1) |
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559 | (8) |
About the Authors |
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567 | (2) |
Index |
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569 | |